High temperature resistant molding materials
    2.
    发明授权
    High temperature resistant molding materials 失效
    耐高温成型材料

    公开(公告)号:US4762869A

    公开(公告)日:1988-08-09

    申请号:US38896

    申请日:1987-04-16

    摘要: High temperature resistant molding materials containing(A) 5-95 mol % of blocks having the structural unit I ##STR1## (B) 5-95 mol % of blocks having the structural unit II ##STR2## (C) 0-80 mol % of blocks having the structural unit III ##STR3## the molecular weight of the blocks being within the range 2000-20,000, where X is --O--, --S--, ##STR4## (only if a or b.noteq.0), ##STR5## (R.sup.7 =R.sup.8 =CH.sub.3 only if a or b.noteq.O) or a chemical bond, R.sup.7 and R.sup.8 are each alkoxy or alkyl of 1-6 carbon atoms, aryl or hydrogen, Q and W are each ##STR6## Z is --O-- or a chemical bond and R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5 and R.sup.6 are each alkyl or alkoxy of 1-6 carbon atoms, aryl, Cl or F and p, q and r are each 0 or 1 and a, b, c, d and e are each 0, 1, 2, 3 or 4.

    摘要翻译: (A)5-95摩尔%具有结构单元的嵌段(I)(B)5-95摩尔%具有结构单元II(II)的嵌段(C) )0-80摩尔%的具有结构单元III的嵌段(III)嵌段的分子量在2000-20,000范围内,其中X是-O - , - S-, (仅当a或b NOTEQUAL 0),(R7 = R8 = CH3,仅当a或b为支链O)或化学键时,R7和R8分别为烷氧基或1-6个碳原子的烷基,芳基或氢 Q和W各自为Z为-O-或化学键,且R 1,R 2,R 3,R 4,R 5和R 6各自为1-6个碳原子的烷基或烷氧基,芳基,Cl或F和p, q和r各自为0或1,a,b,c,d和e各自为0,1,2,3或4。

    Continuous production of linear thermoplastic polyesters
    6.
    发明授权
    Continuous production of linear thermoplastic polyesters 失效
    连续生产线型热塑性聚酯

    公开(公告)号:US4973655A

    公开(公告)日:1990-11-27

    申请号:US365125

    申请日:1989-06-12

    IPC分类号: C08G63/66 C08G63/78 C08G63/80

    CPC分类号: C08G63/78

    摘要: A process for the continuous production of linear thermoplastic polyesters comprises the following steps:(a) passing a transesterification or esterification product of an aliphatic or aromatic dicarboxylic acid having a molecular weight of

    摘要翻译: 用于连续生产线型热塑性聚酯的方法包括以下步骤:(a)将分子量<300的脂族或芳族二羧酸或其成酯衍生物的酯交换或酯化产物与脂族或脂环族 分子量<250的二醇,其可另外含有分子量为400〜4000的聚(环氧烷)二醇,在250〜360℃下,在0.5〜20mmHg的压力下,在 通过具有自由表面积为0.3至1.5m 2 / l的内部配件的基本上直立的管状预缩合区,停留时间为3至10分钟以形成预缩合物和分子量<250的蒸气二醇,(b) 分离成预缩合和蒸发的二醇,和(c)在240〜290℃下,在0.5〜20mmH的压力下进一步冷凝底部的预缩合物 g在停留时间为10至40分钟,并充满浓缩的颗粒聚酯。

    Thermoplastic molding compounds
    7.
    发明授权
    Thermoplastic molding compounds 失效
    热塑性模塑料

    公开(公告)号:US06380306B1

    公开(公告)日:2002-04-30

    申请号:US09269338

    申请日:1999-03-25

    IPC分类号: C08L900

    CPC分类号: C08L51/04 C08L2666/02

    摘要: Thermoplastic molding materials of A) from 72 to 88.5% by weight of a thermoplastic styrene or &agr;-methylstyrene polymer or copolymer, B) from 10 to 20% by weight of a first graft polymer having an average particle diameter d50 from 400 to 600 nm, having an n-butyl acrylate based rubber-elastic graft core, and a styrene or &agr;-methylstyrene (co)polymer graft shell, C) from 1.5 to 8% by weight of a second graft polymer having a bimodal particle size distribution, the average particle diameter d50 being from 25 to 200 nm and from 350 to 550 nm, having a butadiene or isoprene polymer or copolymer based rubber-elastic graft core, and a styrene or &agr;-methylstyrene (co)polymer graft shell, D) from 0 to 50% by weight of conventional additives, where the graft polymers B) and C) constitute from 11.5 to 25% by weight of components A), B) and C), and components A) to D) amount to 100% by weight.

    摘要翻译: A)热塑性成型材料(A)为72〜88.5重量%的热塑性苯乙烯或α-甲基苯乙烯聚合物或共聚物,B)10〜20重量%的平均粒径d50为400〜600nm的第一接枝聚合物, 具有丙烯酸正丁酯基橡胶弹性接枝芯和苯乙烯或α-甲基苯乙烯(共)聚合物接枝壳,C)1.5至8重量%的具有双峰粒径分布的第二接枝聚合物,平均 粒径d50为25〜200nm,350〜550nm,具有丁二烯或异戊二烯聚合物或共聚物基橡胶弹性接枝芯,苯乙烯或α-甲基苯乙烯(共)聚合物接枝壳,D)为0〜 50重量%的常规添加剂,其中接枝聚合物B)和C)构成组分A),B)和C)的11.5至25重量%,组分A)至D)占100重量%。

    Highly heat-resistant polyaryl ether ketones
    10.
    发明授权
    Highly heat-resistant polyaryl ether ketones 失效
    高耐热聚芳醚酮

    公开(公告)号:US4867912A

    公开(公告)日:1989-09-19

    申请号:US142715

    申请日:1988-01-11

    IPC分类号: C08G65/40 C08L71/00 C08L81/06

    摘要: Highly heat-resistant polyaryl ether ketones are composed of(A) from 50 to 100 mol % of repeat units of the general formula I ##STR1## or a ring-substituted C.sub.1 -C.sub.8 -alkyl, C.sub.1 -C.sub.8 -alkoxy, aryl, chlorine or fluorine derivative thereof and(B) from 0 to 50 mol % of repeat units, different from I, of the general formulae II and/or III ##STR2## or a ring-substituted C.sub.1 -C.sub.8 -alkyl, C.sub.1 -C.sub.8 -alkoxy, aryl, chlorine or fluorine derivative thereof, where Q, Q', Y, Y', T, T', Z and Z' are each --O--, --CO-- or a chemical bond, one or more of these substituents is a --CO-- group, and s, t and u are each 0 or 1.

    摘要翻译: 高耐热聚芳醚酮由(A)50-100摩尔%的通式I重复单元或环取代的C 1 -C 8烷基,C 1 -C 8 - 烷氧基 ,芳基,氯或氟衍生物和(B)0至50摩尔%的通式II和/或III与I不同的重复单元,或环 - 取代的C 1 -C 8 - 烷基,C 1 -C 8 - 烷氧基,芳基,氯或氟衍生物,其中Q,Q',Y,Y',T,T',Z和Z'各自为-O - , - 或化学键,这些取代基中的一个或多个是-CO-基团,s,t和u各自为0或1。