High temperature resistant molding materials
    1.
    发明授权
    High temperature resistant molding materials 失效
    耐高温成型材料

    公开(公告)号:US4762869A

    公开(公告)日:1988-08-09

    申请号:US38896

    申请日:1987-04-16

    摘要: High temperature resistant molding materials containing(A) 5-95 mol % of blocks having the structural unit I ##STR1## (B) 5-95 mol % of blocks having the structural unit II ##STR2## (C) 0-80 mol % of blocks having the structural unit III ##STR3## the molecular weight of the blocks being within the range 2000-20,000, where X is --O--, --S--, ##STR4## (only if a or b.noteq.0), ##STR5## (R.sup.7 =R.sup.8 =CH.sub.3 only if a or b.noteq.O) or a chemical bond, R.sup.7 and R.sup.8 are each alkoxy or alkyl of 1-6 carbon atoms, aryl or hydrogen, Q and W are each ##STR6## Z is --O-- or a chemical bond and R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5 and R.sup.6 are each alkyl or alkoxy of 1-6 carbon atoms, aryl, Cl or F and p, q and r are each 0 or 1 and a, b, c, d and e are each 0, 1, 2, 3 or 4.

    摘要翻译: (A)5-95摩尔%具有结构单元的嵌段(I)(B)5-95摩尔%具有结构单元II(II)的嵌段(C) )0-80摩尔%的具有结构单元III的嵌段(III)嵌段的分子量在2000-20,000范围内,其中X是-O - , - S-, (仅当a或b NOTEQUAL 0),(R7 = R8 = CH3,仅当a或b为支链O)或化学键时,R7和R8分别为烷氧基或1-6个碳原子的烷基,芳基或氢 Q和W各自为Z为-O-或化学键,且R 1,R 2,R 3,R 4,R 5和R 6各自为1-6个碳原子的烷基或烷氧基,芳基,Cl或F和p, q和r各自为0或1,a,b,c,d和e各自为0,1,2,3或4。