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    MULTI-CHIP LED DEVICES
    4.
    发明申请
    MULTI-CHIP LED DEVICES 有权
    多芯片LED器件

    公开(公告)号：US20120069564A1

    公开(公告)日：2012-03-22

    申请号：US13017407

    申请日：2011-01-31

    申请人： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Jeffrey C. Britt

    发明人： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Jeffrey C. Britt

    IPC分类号： F21V5/04 ,  H05K13/00 ,  F21V11/00

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  Y10T29/49002 ,  H01L2924/00014

    摘要： Multi-chip LED devices are described. Embodiments of the present invention provide multi-chip LED devices with relatively high efficiency and good color rendering. The LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The optical element may be molded from silicone. The LED chips may be connected in parallel. In some embodiments, the LED device includes a submount, which may be made of a ceramic material such as alumina or aluminum nitride. Wire bonds can be connected to the LED chips so that all the wire bonds tend the outside of a group of LED chips. Various sizes and types of LED chips may be used, including vertical LED chips and sideview LED chips.

    摘要翻译： 描述了多芯片LED器件。 本发明的实施例提供了具有较高效率和良好显色性能的多芯片LED器件。 LED装置包括多个互连的LED芯片和诸如透镜的光学元件。 光学元件可以由硅树脂模制而成。 LED芯片可以并联连接。 在一些实施例中，LED装置包括底座，其可由诸如氧化铝或氮化铝的陶瓷材料制成。 引线键可以连接到LED芯片，使得所有的引线键都趋向于一组LED芯片的外部。 可以使用各种尺寸和类型的LED芯片，包括垂直LED芯片和侧视LED芯片。

    High density multi-chip LED devices
    5.
    发明授权
    High density multi-chip LED devices 有权
    高密度多芯片LED器件

    公开(公告)号：US09041042B2

    公开(公告)日：2015-05-26

    申请号：US13017502

    申请日：2011-01-31

    申请人： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Amber C. Abare ,  Jeffrey C. Britt

    发明人： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Amber C. Abare ,  Jeffrey C. Britt

    IPC分类号： H01L33/62 ,  H01L25/075 ,  H01L33/58

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  Y10T29/49002 ,  H01L2924/00014

    摘要： High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.

    摘要翻译： 描述了高密度多芯片LED器件。 本发明的实施例提供了具有相对较高效率和小尺寸的光输出的高密度多芯片LED器件。 LED装置包括多个互连的LED芯片和诸如透镜的光学元件。 LED芯片可以分为两组，其中每组中的LED芯片并联连接，并且串联连接。 在一些实施例中，LED装置包括可由陶瓷制成的底座。 底座可以包括连接母线和与芯片接合的半圆形区域。 引线键可以连接到LED芯片，使得所有的引线键都布置在一组LED芯片的外部以最小化光吸收。

    Multi-chip LED devices
    6.
    发明授权
    Multi-chip LED devices 有权
    多芯片LED器件

    公开(公告)号：US08696159B2

    公开(公告)日：2014-04-15

    申请号：US13017407

    申请日：2011-01-31

    申请人： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Jeffrey C. Britt

    发明人： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Jeffrey C. Britt

    IPC分类号： F21V23/00 ,  H01L33/00

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  Y10T29/49002 ,  H01L2924/00014

    摘要： Multi-chip LED devices are described. Embodiments of the present invention provide multi-chip LED devices with relatively high efficiency and good color rendering. The LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The optical element may be molded from silicone. The LED chips may be connected in parallel. In some embodiments, the LED device includes a submount, which may be made of a ceramic material such as alumina or aluminum nitride. Wire bonds can be connected to the LED chips so that all the wire bonds tend the outside of a group of LED chips. Various sizes and types of LED chips may be used, including vertical LED chips and sideview LED chips.

    摘要翻译： 描述了多芯片LED器件。 本发明的实施例提供了具有较高效率和良好显色性能的多芯片LED器件。 LED装置包括多个互连的LED芯片和诸如透镜的光学元件。 光学元件可以由硅树脂模制而成。 LED芯片可以并联连接。 在一些实施例中，LED装置包括底座，其可由诸如氧化铝或氮化铝的陶瓷材料制成。 引线键可以连接到LED芯片，使得所有的引线键都趋向于一组LED芯片的外部。 可以使用各种尺寸和类型的LED芯片，包括垂直LED芯片和侧视LED芯片。

    HIGH DENSITY MULTI-CHIP LED DEVICES
    7.
    发明申请
    HIGH DENSITY MULTI-CHIP LED DEVICES 有权
    高密度多芯片LED器件

    公开(公告)号：US20120068198A1

    公开(公告)日：2012-03-22

    申请号：US13017502

    申请日：2011-01-31

    申请人： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Amber C. Abare ,  Jeffrey C. Britt

    发明人： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Amber C. Abare ,  Jeffrey C. Britt

    IPC分类号： H01L33/58

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  Y10T29/49002 ,  H01L2924/00014

    摘要： High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.

    摘要翻译： 描述了高密度多芯片LED器件。 本发明的实施例提供了具有相对较高效率和小尺寸的光输出的高密度多芯片LED器件。 LED装置包括多个互连的LED芯片和诸如透镜的光学元件。 LED芯片可以分为两组，其中每组中的LED芯片并联连接，并且串联连接。 在一些实施例中，LED装置包括可由陶瓷制成的底座。 底座可以包括连接母线和与芯片接合的半圆形区域。 引线键可以连接到LED芯片，使得所有的引线键都布置在一组LED芯片的外部以最小化光吸收。