摘要:
An assembly for measuring a trench depth parameter of a workpiece is disclosed. The assembly has an ultra-violet radiation source; a split fiber bundle having a first branch for propagating the ultra-violet radiation from the radiation source to a lens, and a second branch; a lens for focusing the UV radiation to the workpiece and refocusing an ultra-violet interference signal to the second branch; and a detector responsive to the ultra-violet interference signal received through the second branch. The detector transforms the ultra-violet interference signal to an electrical signal which is a measure of a trench depth of the workpiece. The ultra-violet interference signal is developed when ultra-violet radiation propagates through the workpiece and reflects from its base region to thereby interfere with ultra-violet radiation that is directly reflected by a workpiece surface which is different from the base region.
摘要:
Method for correcting aberrations of an optical system and solving the problem of tolerance buildup. The method posits a desired specification limit for each of at least one optical characteristic of an optical element, and requires embossing at least a portion of a surface of the optical element for bringing the or each optical characteristic within its corresponding specification limit.
摘要:
A substrate has a top side and a bottom side. A solar cell is secured to the top side of the substrate and has an anode and a cathode. A heat transfer element is secured to the bottom side of the substrate. An anode pad is formed on the top side of the substrate and is coupled to the anode of the solar cell; similarly, a cathode pad is formed on the top side of the substrate and is coupled to the cathode of the solar cell. The substrate coefficient of thermal expansion and the solar cell coefficient of thermal expansion match within plus or minus ten parts per million per degree C.
摘要:
A light pipe that can be employed for a Concentrator Photo-Voltaic (CPV) system is provided. The light pipe homogenizes light by diffusion and/or refraction, and can be embodied in a structure that has a low aspect ratio. The diffusion and/or refraction can be effected by concave or convex surfaces of a transparent medium that forms a body of the light pipe, by light diffracting particles, and/or by a diffracting surface. Optionally, multiple transparent media can be employed with a refracting and/or diffracting interface therebetween. The reduced aspect ratio of the light pipe can improve reliability of mechanical alignment in the CPV system as well as reducing the cost of manufacturing and/or aligning the light pipe within the CPV system.
摘要:
A transportable photovoltaic system includes a plurality of photovoltaic devices, a composite frame to which the plurality of photovoltaic devices are affixed, and a base structure to which the composite frame is movably attached through at least one variable-angle mount structure. The orientation of the frame and the light concentrating elements relative to the base structure can be altered employing the at least one variable-angle mount structure. The frame and the plurality of photovoltaic devices can be assembled prior to shipping, and the base structure can be manufactured on site. The transportable photovoltaic system is not affixed to ground or other fixture, but can be picked up at any time during the operational lifetime. The transportable photovoltaic system can be rapidly deployed with little or no site preparation requirement other than generally level ground, and can be retracted to a lower exposure position to avoid storm and/or hazardous conditions.
摘要:
Electrical contact to the front side of a photovoltaic cell is provided by an array of conductive through-substrate vias, and optionally, an array of conductive blocks located on the front side of the photovoltaic cell. A dielectric liner provides electrical isolation of each conductive through-substrate via from the semiconductor material of the photovoltaic cell. A dielectric layer on the backside of the photovoltaic cell is patterned to cover a contiguous region including all of the conductive through-substrate vias, while exposing a portion of the backside of the photovoltaic cell. A conductive material layer is deposited on the back surface of the photovoltaic cell, and is patterned to form a first conductive wiring structure that electrically connects the conductive through-substrate vias and a second conductive wiring structure that provides electrical connection to the backside of the photovoltaic cell.
摘要:
An apparatus for cooling a surface having a metal structure made of a material with high thermal conductivity, and designed to provide efficient cooling of the surface while minimizing mechanical stress between the metal structure and the surface.
摘要:
A system for imprint lithography, which includes a substrate, a patterned mask, an imprint applying unit that imprints, via the patterned mask, a pattern into a resist layer on the substrate, and an overlay device that overlays a cladding layer over the substrate.
摘要:
Electrical contact to the front side of a photovoltaic cell is provided by an array of conductive through-substrate vias, and optionally, an array of conductive blocks located on the front side of the photovoltaic cell. A dielectric liner provides electrical isolation of each conductive through-substrate via from the semiconductor material of the photovoltaic cell. A dielectric layer on the backside of the photovoltaic cell is patterned to cover a contiguous region including all of the conductive through-substrate vias, while exposing a portion of the backside of the photovoltaic cell. A conductive material layer is deposited on the back surface of the photovoltaic cell, and is patterned to form a first conductive wiring structure that electrically connects the conductive through-substrate vias and a second conductive wiring structure that provides electrical connection to the backside of the photovoltaic cell.
摘要:
A method (and apparatus) of imprint lithography, includes imprinting, via a patterned mask, a pattern into a resist layer on a substrate, and overlaying a cladding layer over the imprinted resist layer. A portion of the cladding layer is used as a hard mask for a subsequent processing.