摘要:
In a voltage detecting circuit, a transistor is configured as a P-type MOSFET, and includes a source connected with an input terminal, a gate connected with a ground voltage terminal and a drain connected with an output terminal. A transistor is configured as a P-type MOSFET, and includes a gate and a source connected with the output terminal and a drain connected with the ground terminal. Gate width and gate length of the transistor and gate width and gate length of the transistor are adjusted so that source-drain current flowing between the source and the drain of the transistor becomes equal to source-drain current flowing between the source and the drain of the transistor when the voltage applied to the input terminal is set to be preset trigger voltage. This configuration accomplishes detecting that the input voltage exceeds the trigger voltage with simple configuration.
摘要:
A booster circuit is configured, such that: in response to a reading request for reading data from a flash memory, when a voltage of an output terminal detected by a voltage detection circuit is not higher than a voltage, an oscillator outputs a control clock signal of predetermined on time and off time to a transistor of a boost converter to perform switching control of the transistor; and when the voltage detection circuit detects that the voltage of the output terminal reaches a voltage, an oscillator outputs a control clock signal of an on time and an off time input from a selection circuit to a transistor of a boost converter to perform switching control of the transistor.
摘要:
The channel number detecting circuit detects the operation channel number based on the output terminal voltage after falling down when the output terminal voltage falls down during the voltage boosting control, and the switching control circuit generates the control clock signal having the on-time and the off-time adjusted based on the operation channel number and performs the voltage boosting control using generating control clock signal. The voltage boosting control is properly performed based on the operation channel number when the operation channel number increase during performing the voltage boosting control. Thus boosting the power supply voltage up to a second voltage is accomplished.
摘要:
The interposer 30 is disposed on an upper surface of the stacked structure 24 formed by stacking a plurality of a DRAM chip 20 and a plurality of a flash memory chip 22. Thus down-size of an entire device is accomplished. A boost converter having an inductor is used as a voltage boost circuit 40. Thus down-size of the entire device is accomplished.
摘要:
The interposer is disposed on an upper surface of the stacked structure formed by stacking a plurality of a DRAM chip and a plurality of a flash memory chip. Thus down-size of an entire device is accomplished. A boost converter having an inductor is used as a voltage boost circuit. Thus down-size of the entire device is accomplished in comparison to a voltage boost circuit using a charge pump connected in parallel with a plurality of a capacitance.
摘要:
A booster circuit is configured, such that: in response to a reading request for reading data from a flash memory, when a voltage of an output terminal detected by a voltage detection circuit is not higher than a voltage, an oscillator outputs a control clock signal of predetermined on time and off time to a transistor of a boost converter to perform switching control of the transistor; and when the voltage detection circuit detects that the voltage of the output terminal reaches a voltage, an oscillator outputs a control clock signal of an on time and an off time input from a selection circuit to a transistor of a boost converter to perform switching control of the transistor.
摘要:
The voltage Vdd is set to be lower than in the normal operation (step S100), then voltage is applied to each of the power-supply voltage applied node Vdd, the ground voltage applied node Vss, the semiconductor substrate and the well so that relative high voltage between the gate of turn-on transistor and the semiconductor substrate or the gate of turn-on transistor and well (steps S110 and S120). This process accomplishes rising of the threshold voltage of the transistor that is turned on, the reduction of the variation in the threshold voltage between a plurality of the transistors of the memory cell including latch circuit, and the improvement of the voltage characteristic of the memory cell.
摘要:
A memory cell array includes a plurality of memory cells arranged in a matrix form. A word line and a power supply line respectively are connected in common to the plurality of memory cells arranged in each row. A power supply line/word line control circuit is connected to each word line and each power supply line. In accessing the plurality of memory cells row by row, the control circuit raises the voltage of the power supply line and, after the voltage of the power supply line reaches the high voltage at all the positions, starts activation of the word line. On the other hand, in turning from the access state to the non-access state, the control circuit deactivates the word line and, after the voltage of the word line changes to the ground voltage at all the positions, changes the voltage of the power supply line to the low voltage.
摘要:
An ECL output buffer circuit is constituted by an output buffer circuit main portion and its control circuit. In the output buffer circuit main portion, an output from a differential switch is input to the base of a bipolar transistor (emitter follower). The emitter of the bipolar transistor is connected to an output terminal. A ground potential is applied to the collector of the bipolar transistor. One end of the channel conductive path of a MOS transistor is connected to the base of the bipolar transistor. The other end of the channel conductive path is connected to a power-supply terminal via a constant-current source. The control circuit controls the ON/OFF operation of the MOS transistor and the output level of the bipolar transistor. When the output buffer circuit main portion is to be set in a standby state, the control circuit performs control to set the MOS transistor in an ON state and set the output of the bipolar transistor at low level.
摘要:
A semiconductor memory device includes a first memory cell array and a second memory cell array section into which the same data can be simultaneously written. Logic gates are provided between the word lines of the first memory cell array section and the respective word lines of the second memory cell array section. In the normal operation mode, the logic gates connect each of the rows of memory cells in the first memory cell array section to a corresponding one of the rows of memory cells in the second memory cell array section, and set each of the rows of memory cells in the second memory cell array section to a selected level when the same data is simultaneously written into the memory cells of the second memory cell array section. When each of the rows of memory cells in the second memory cell array section is set to the selected level, all the columns of the memory cells in the second memory cell array section are simultaneously selected and the same data is simultaneously written into the second memory cell array section.