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    CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF
    2.
    发明公开
    CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20230171876A1

    公开(公告)日：2023-06-01

    申请号：US17564995

    申请日：2021-12-29

    申请人： Avary Holding (Shenzhen) Co., Ltd. ,  HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd. ,  Garuda Technology Co., Ltd.

    发明人： Zhi-Hong YANG ,  Mao-Feng HSU

    IPC分类号： H05K1/02 ,  H01L23/552 ,  H05K3/46

    CPC分类号： H05K1/0218 ,  H01L23/552 ,  H05K3/4644

    摘要： The disclosure provides a circuit board assembly, which includes a core layer, an electronic component, a first shielding ring wall, a second shielding ring wall, a first circuit layer, a second circuit layer, a first insulating layer and first shielding columns. The core layer includes an accommodating space, and the accommodating space has an inner side wall. The first shielding ring wall is disposed in the accommodating space and covers the inner side wall, in which the first shielding ring wall surrounds the electronic component. The second shielding ring wall is disposed in the core layer and surrounds the first shielding ring wall. The core layer is disposed between the first circuit layer and the second circuit layer. The second circuit layer is disposed between the first insulating layer and the core layer. The first shielding columns are disposed in the first insulating layer.

    CIRCUIT BOARD ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
    3.
    发明公开
    CIRCUIT BOARD ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20230156906A1

    公开(公告)日：2023-05-18

    申请号：US18097095

    申请日：2023-01-13

    申请人： QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD ,  Avary Holding (Shenzhen) Co., Limited. ,  GARUDA TECHNOLOGY CO., LTD.

    发明人： XIN LU ,  WEI-XIANG LI

    IPC分类号： H05K1/02 ,  H05K3/32

    CPC分类号： H05K1/021 ,  H05K3/32

    摘要： A circuit board assembly includes an inner circuit substrate, a first outer circuit substrate, a second outer circuit substrate, a heat conducting block, an electronic component, and a reinforcing plate. The first outer circuit substrate and second outer circuit substrate are disposed on surfaces of the inner circuit substrate. The heat conducting block penetrates through the inner circuit substrate and connects to the first outer circuit substrate and the second outer circuit substrate. The heat conducting block made of aluminum nitride. An electronic component at least partially accommodated in the heat conducting block. The reinforcing plate is disposed on a surface of the second outer circuit substrate corresponding to the electronic component and faces away from the electronic component. The present disclosure further provides a method for manufacturing the circuit board assembly.

    CIRCUIT BOARD ASSEMBLY
    7.
    发明公开
    CIRCUIT BOARD ASSEMBLY 审中-公开

    公开(公告)号：US20240040687A1

    公开(公告)日：2024-02-01

    申请号：US18486814

    申请日：2023-10-13

    申请人： Avary Holding (Shenzhen) Co., Ltd. ,  HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd. ,  Garuda Technology Co., Ltd.

    发明人： Mao-Feng HSU ,  Zhi-Hong YANG

    IPC分类号： H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/10

    CPC分类号： H05K1/0216 ,  H05K1/183 ,  H05K3/30 ,  H05K3/107 ,  H05K1/0298

    摘要： The disclosure provides a circuit board assembly, which includes a core layer, an electronic component, a first shielding ring wall, a second shielding ring wall, a first circuit layer, a second circuit layer, a first insulating layer and a plurality of shielding columns. The core layer has an accommodating space, in which the accommodating space has an inner sidewall. The electronic component is disposed in the accommodating space. The first shielding ring wall is disposed in the accommodating space and covers the inner sidewall, in which the first shielding ring wall surrounds the electronic component and is not in contact with the electronic component. The second shielding ring wall is disposed in the core layer and surrounds the first shielding ring wall. The core layer is disposed between the first circuit layer and the second circuit layer. The shielding columns are disposed in the first insulating layer.

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    8.
    发明公开
    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20240006748A1

    公开(公告)日：2024-01-04

    申请号：US18036372

    申请日：2021-10-18

    申请人： HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. ,  Avary Holding (Shenzhen) Co., Limited. ,  GARUDA TECHNOLOGY CO., LTD.

    发明人： CHIH-CHIEH FU ,  YU-JIA MEN

    IPC分类号： H01Q1/38 ,  H01Q1/36 ,  H05K3/42 ,  H05K1/02

    CPC分类号： H01Q1/38 ,  H01Q1/364 ,  H05K3/429 ,  H05K1/0237 ,  H05K2201/10098

    摘要： The present application provides a circuit board and a manufacturing method thereof. The manufacturing method includes: providing a stacked board; the stacked board includes a third conducting circuit, a second substrate, a first conducting circuit, a first substrate, and a second conducting circuit, which are stacked disposed in that order; defining several through holes on a surface of the stacked board along a stacked direction of the stacked board; and manufacturing antenna conductors in the through holes. The antenna conductors are disposed in the through holes on a surface of the stacked board, the antenna conductors on different layers are connected to corresponding conducting circuits, some of the antenna conductors are directly connected with the conducting circuit. A loss of signals while transmitting is reduced, and the circuit board including the antenna structure is changed from an up-down structure into a left-right structure for reducing a board thickness.

    CIRCUIT BOARD AND METHOD FOR MANUFACTURING THEREOF
    9.
    发明公开
    CIRCUIT BOARD AND METHOD FOR MANUFACTURING THEREOF 审中-公开

    公开(公告)号：US20230389185A1

    公开(公告)日：2023-11-30

    申请号：US17855032

    申请日：2022-06-30

    申请人： Avary Holding (Shenzhen) Co., Ltd. ,  QingDing Precision Electronics(Huai'an) Co., Ltd. ,  Garuda Technology Co., Ltd.

    发明人： Zhi GUO ,  Chen XIONG ,  Po-Yuan CHEN

    IPC分类号： H05K1/18 ,  H05K3/32

    CPC分类号： H05K1/183 ,  H05K3/321 ,  H05K2201/10984

    摘要： A method for manufacturing a circuit board includes disposing an electronic component in a recess formed in a first circuit substrate, and bonding a second circuit substrate to the first circuit substrate to form a third circuit substrate with the electronic component embedded. The method includes forming an opening in the third circuit substrate to expose the electronic component and an inner surface of the third circuit substrate. The method includes disposing an insulation case in the opening. The insulation case has a first segment directly contacting the electronic component, a second segment facing the inner surface, an inner wall between the first and second segments, a first chamber surrounded by the first segment and the inner wall, and a second chamber surrounded by the second segment and the inner wall. The method includes adding a heat-exchanging fluid into the first chamber.