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公开(公告)号：US11902644B2
公开(公告)日：2024-02-13
申请号：US17683305
申请日：2022-02-28
发明人： Jun Dai , Mei Yang , Ming-Jaan Ho
CPC分类号： H04N23/54 , H04N23/55 , H05K1/0306 , H05K1/111 , H05K1/0393
摘要： A camera module includes a holder, a lens in the holder, magnets disposed on an outer wall of the holder, and a circuit board assembly. The circuit board assembly includes an outer wiring substrate, and first and second inner wiring substrates spaced out on a surface of the outer wiring substrate. The first inner wiring substrate surrounds the holder and includes a first dielectric layer and a first inner wiring layer thereon. The first inner wiring layer includes coils of wound wire in the first inner wiring layer, and each of the coils corresponds to one of the magnets. The second inner wiring substrate includes a second inner wiring layer, a thickness of each of the coils is greater than a thickness of the second inner wiring layer. A method for manufacturing the camera module is also disclosed.
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公开(公告)号：US20220191361A1
公开(公告)日：2022-06-16
申请号：US17683305
申请日：2022-02-28
发明人： Jun Dai , Mei Yang , Ming-Jaan Ho
摘要： A camera module includes a holder, a lens in the holder, magnets disposed on an outer wall of the holder, and a circuit board assembly. The circuit board assembly includes an outer wiring substrate, and first and second inner wiring substrates spaced out on a surface of the outer wiring substrate. The first inner wiring substrate surrounds the holder and includes a first dielectric layer and a first inner wiring layer thereon. The first inner wiring layer includes coils of wound wire in the first inner wiring layer, and each of the coils corresponds to one of the magnets. The second inner wiring substrate includes a second inner wiring layer, a thickness of each of the coils is greater than a thickness of the second inner wiring layer. A method for manufacturing the camera module is also disclosed.
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公开(公告)号：US11294285B2
公开(公告)日：2022-04-05
申请号：US16843123
申请日：2020-04-08
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Xian-Qin Hu , Mei Yang , Jun Dai
IPC分类号： G03F7/095 , C23C30/00 , H05K3/38 , H05K3/06 , C23G1/10 , C23C28/02 , H05K3/40 , H05K3/18 , H05K1/09 , C23F1/44 , C23F1/02 , G03F7/20
摘要： A method for manufacturing the circuit board comprises following steps of forming a silver layer on each of two opposite surfaces of an insulating substrate, and forming a copper layer on each silver layer, thereby obtaining a middle structure; defining at least one through-hole on the middle structure, and each through-hole extending through each copper layer; forming a copper wiring layer on the copper layers to cover each through-hole and a portion region of the copper layers, the copper wiring layer comprising a copper conductive structure passing through each through-hole, the copper conductive structure connecting the copper layers; removing the copper layers not covered by the copper wiring layer; and etching the silver layers to form a silver wiring layer corresponding to the copper wiring layer, wherein a first etching liquid, which does not etch the copper wiring layer, is used for etching the silver layers.
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公开(公告)号：US11871526B2
公开(公告)日：2024-01-09
申请号：US17672980
申请日：2022-02-16
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Jun Dai
IPC分类号： H05K1/02 , H01L23/06 , H01F27/22 , H01F27/29 , H01F27/32 , H01F27/255 , H05K3/46 , H05K1/03 , H05K3/00 , H05K3/18
CPC分类号： H05K3/467 , H05K1/0298 , H05K1/0313 , H05K3/0023 , H05K3/188 , H05K2203/06 , H05K2203/0723
摘要： A circuit board includes a substrate, a first circuit layer, a second circuit layer, and a third circuit layer. The substrate includes a base layer, a first metal layer formed on the base layer, and a seed layer formed on the first metal layer. The first circuit layer is located on the substrate and includes the first metal layer and a signal layer formed on a surface of the first metal layer. The second circuit layer is coupled to the first circuit layer and includes the first metal layer, the seed layer, and a connection pillar formed on a surface of the first metal layer and the seed layer. The third circuit layer is coupled to the second circuit layer and includes the seed layer and a coil formed on a surface of the seed layer.
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公开(公告)号：US10653011B2
公开(公告)日：2020-05-12
申请号：US15817052
申请日：2017-11-17
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Xian-Qin Hu , Mei Yang , Jun Dai
IPC分类号： H05K1/09 , H05K3/38 , H05K3/46 , H05K3/06 , C23G1/10 , C23C28/02 , H05K3/40 , H05K3/18 , H05K3/00 , C23F1/44 , C23F1/02 , G03F7/20 , G03F7/095
摘要： A method for manufacturing the circuit board comprises following steps of providing an insulating substrate, and defining at least one through-hole on the insulating substrate to extending through two opposite surfaces of the insulating substrate; forming a silver layer on each of the two opposite surfaces, and forming a silver conductive structure in each through-hole connecting the silver layers; forming a copper wiring layer on the silver layers to cover each silver conductive structure and a portion region of the silver layers; and etching the silver layers to form a silver wiring layer corresponding to the copper wiring layer, wherein a first etching liquid, which does not etch the copper wiring layer, is used for etching the silver layers.
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公开(公告)号：US11291126B2
公开(公告)日：2022-03-29
申请号：US17022385
申请日：2020-09-16
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Jun Dai
IPC分类号： H05K1/00 , H05K1/02 , H05K1/09 , H05K1/11 , H05K1/18 , H05K3/02 , H05K3/06 , H05K3/28 , H05K3/46 , H05K1/03 , H05K3/18 , H05K3/00
摘要： A circuit board includes a substrate, a first circuit layer, a second circuit layer, and a third circuit layer. The substrate includes a base layer, a first metal layer formed on the base layer, and a seed layer formed on the first metal layer. The first circuit layer is located on the substrate and includes the first metal layer and a signal layer formed on a surface of the first metal layer. The second circuit layer is coupled to the first circuit layer and includes the first metal layer, the seed layer, and a connection pillar formed on a surface of the first metal layer and the seed layer. The third circuit layer is coupled to the second circuit layer and includes the seed layer and a coil formed on a surface of the seed layer.
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公开(公告)号：US20190116676A1
公开(公告)日：2019-04-18
申请号：US15817052
申请日：2017-11-17
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： XIAN-QIN HU , Mei Yang , Jun Dai
摘要： A method for manufacturing the circuit board comprises following steps of providing an insulating substrate, and defining at least one through-hole on the insulating substrate to extending through two opposite surfaces of the insulating substrate; forming a silver layer on each of the two opposite surfaces, and forming a silver conductive structure in each through-hole connecting the silver layers; forming a copper wiring layer on the silver layers to cover each silver conductive structure and a portion region of the silver layers; and etching the silver layers to form a silver wiring layer corresponding to the copper wiring layer, wherein a first etching liquid, which does not etch the copper wiring layer, is used for etching the silver layers.
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