公开(公告)号：US10039188B2

公开(公告)日：2018-07-31

申请号：US14811813

申请日：2015-07-28

Applicant: QUALCOMM Incorporated

Inventor： Changhan Yun ,  Francesco Carobolante ,  Chengjie Zuo ,  Jonghae Kim ,  Mario Francisco Velez ,  Lawrence D. Smith ,  Matthew M. Nowak

IPC: H05K1/16 ,  H05K1/02 ,  H01L23/498 ,  H05K7/10 ,  H05K3/10 ,  H05K3/30 ,  H05K3/00

CPC classification number: H05K1/165 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/19105 ,  H05K1/0231 ,  H05K1/0243 ,  H05K1/0262 ,  H05K3/0091 ,  H05K3/10 ,  H05K3/30 ,  H05K7/1092 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49147 ,  Y10T29/49156

Abstract: A two-stage power delivery network includes a voltage regulator and an interposer. The interposer includes a packaging substrate having an embedded inductor. The embedded inductor includes a set of traces and a set of through substrate vias at opposing ends of the traces. The interposer is coupled to the voltage regulator. The two-stage power delivery network also includes a semiconductor die supported by the packaging substrate. The two-stage power delivery network also includes a capacitor that is supported by the packaging substrate. The capacitor is operable to provide a decoupling capacitance associated with the semiconductor die and a capacitance to reduce a switching noise of the voltage regulator.

公开(公告)号：US20140268615A1

公开(公告)日：2014-09-18

申请号：US13830033

申请日：2013-03-14

Applicant: QUALCOMM INCORPORATED

Inventor： Changhan Yun ,  Francesco Carobolante ,  Chengjie Zuo ,  Jonghae Kim ,  Mario Francisco Velez ,  Lawrence D. Smith ,  Matthew M. Nowak

IPC: H05K7/10 ,  H05K3/30 ,  H05K3/10

CPC classification number: H05K1/165 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/19105 ,  H05K1/0231 ,  H05K1/0243 ,  H05K1/0262 ,  H05K3/0091 ,  H05K3/10 ,  H05K3/30 ,  H05K7/1092 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49147 ,  Y10T29/49156

Abstract: A two-stage power delivery network includes a voltage regulator and an interposer. The interposer includes a packaging substrate having an embedded inductor. The embedded inductor includes a set of traces and a set of through substrate vias at opposing ends of the traces. The interposer is coupled to the voltage regulator. The two-stage power delivery network also includes a semiconductor die supported by the packaging substrate. The two-stage power delivery network also includes a capacitor that is supported by the packaging substrate. The capacitor is operable to provide a decoupling capacitance associated with the semiconductor die and a capacitance to reduce a switching noise of the voltage regulator.

Abstract translation: 两级供电网络包括电压调节器和插入器。 插入器包括具有嵌入式电感器的封装衬底。 嵌入式电感器包括一组迹线和一组在迹线的相对端处的通过衬底通孔。 插入器耦合到电压调节器。 两级供电网络还包括由封装基板支撑的半导体管芯。 两级供电网络还包括由包装基板支撑的电容器。 电容器可操作以提供与半导体管芯相关联的去耦电容和电容，以降低电压调节器的开关噪声。

公开(公告)号：US20150334847A1

公开(公告)日：2015-11-19

申请号：US14811813

申请日：2015-07-28

Applicant: QUALCOMM Incorporated

Inventor： Changhan Yun ,  Francesco Carobolante ,  Chengjie Zuo ,  Jonghae Kim ,  Mario Francisco Velez ,  Lawrence D. Smith ,  Matthew M. Nowak

IPC: H05K3/10 ,  H05K3/00 ,  H05K3/30

CPC classification number: H05K1/165 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/19105 ,  H05K1/0231 ,  H05K1/0243 ,  H05K1/0262 ,  H05K3/0091 ,  H05K3/10 ,  H05K3/30 ,  H05K7/1092 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49147 ,  Y10T29/49156

Abstract: A two-stage power delivery network includes a voltage regulator and an interposer. The interposer includes a packaging substrate having an embedded inductor. The embedded inductor includes a set of traces and a set of through substrate vias at opposing ends of the traces. The interposer is coupled to the voltage regulator. The two-stage power delivery network also includes a semiconductor die supported by the packaging substrate. The two-stage power delivery network also includes a capacitor that is supported by the packaging substrate. The capacitor is operable to provide a decoupling capacitance associated with the semiconductor die and a capacitance to reduce a switching noise of the voltage regulator.

Abstract translation: 两级供电网络包括电压调节器和插入器。 插入器包括具有嵌入式电感器的封装衬底。 嵌入式电感器包括一组迹线和一组在迹线的相对端处的通过衬底通孔。 插入器耦合到电压调节器。 两级供电网络还包括由封装基板支撑的半导体管芯。 两级供电网络还包括由包装基板支撑的电容器。 电容器可操作以提供与半导体管芯相关联的去耦电容和电容，以降低电压调节器的开关噪声。

公开(公告)号：US09101068B2

公开(公告)日：2015-08-04

申请号：US13830033

申请日：2013-03-14

Applicant: QUALCOMM Incorporated

Inventor： Changhan Yun ,  Francesco Carobolante ,  Chengjie Zuo ,  Jonghae Kim ,  Mario Francisco Velez ,  Lawrence D. Smith ,  Matthew M. Nowak

IPC: H05K7/00 ,  H05K7/10 ,  H05K1/02 ,  H05K1/16 ,  H01L23/498

CPC classification number: H05K1/165 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/19105 ,  H05K1/0231 ,  H05K1/0243 ,  H05K1/0262 ,  H05K3/0091 ,  H05K3/10 ,  H05K3/30 ,  H05K7/1092 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49147 ,  Y10T29/49156

Abstract: A two-stage power delivery network includes a voltage regulator and an interposer. The interposer includes a packaging substrate having an embedded inductor. The embedded inductor includes a set of traces and a set of through substrate vias at opposing ends of the traces. The interposer is coupled to the voltage regulator. The two-stage power delivery network also includes a semiconductor die supported by the packaging substrate. The two-stage power delivery network also includes a capacitor that is supported by the packaging substrate. The capacitor is operable to provide a decoupling capacitance associated with the semiconductor die and a capacitance to reduce a switching noise of the voltage regulator.

Abstract translation: 两级供电网络包括电压调节器和插入器。 插入器包括具有嵌入式电感器的封装衬底。 嵌入式电感器包括一组迹线和一组在迹线的相对端处的通过衬底通孔。 插入器耦合到电压调节器。 两级供电网络还包括由封装基板支撑的半导体管芯。 两级供电网络还包括由包装基板支撑的电容器。 电容器可操作以提供与半导体管芯相关联的去耦电容和电容，以降低电压调节器的开关噪声。