公开(公告)号：US5812387A

公开(公告)日：1998-09-22

申请号：US803980

申请日：1997-02-21

申请人： Qun Lu ,  Paul E. Grandmont ,  Shih-Chang Liu

发明人： Qun Lu ,  Paul E. Grandmont ,  Shih-Chang Liu

IPC分类号： H02M3/00 ,  H05K1/14 ,  H02M1/00

CPC分类号： H05K1/144 ,  H02M3/00 ,  H02M7/003

摘要： A multi-deck power converter module assembly for connection with a substrate (e.g., a host board) having connection regions disposed on its surface includes a second circuit board positioned over a first circuit board, the second circuit board having apertures extending from an upper surface to a lower surface of the second circuit board. At least two rail members are positioned over the second circuit board, each rail member having a first and a second plurality of holes. A pair of spacers are disposed between the first and second circuit boards, each spacer extending through one of the apertures of the second circuit board and received within one of the first plurality of holes of one of the rail members. Terminal pins are attached to the first circuit board, at least one terminal pin extending through the second circuit board and a corresponding one of the second plurality of holes for connection to one of the connection regions on the substrate. Each of the second plurality of holes is sized to allow the rail members to be slidably positioned over the terminal pins during assembly of the power converter module.

公开(公告)号：US5933343A

公开(公告)日：1999-08-03

申请号：US158221

申请日：1998-09-22

申请人： Qun Lu ,  Paul E. Grandmont ,  Shih-Chang Liu

发明人： Qun Lu ,  Paul E. Grandmont ,  Shih-Chang Liu

IPC分类号： H02M3/00 ,  H05K1/14 ,  H02M1/00

CPC分类号： H05K1/144 ,  H02M3/00 ,  H02M7/003

摘要： A multi-deck power converter module assembly for connection with a substrate (e.g., a host board) having connection regions disposed on its surface includes a second circuit board positioned over a first circuit board, the second circuit board having apertures extending from an upper surface to a lower surface of the second circuit board. At least two rail members are positioned over the second circuit board, each rail member having a first and a second plurality of holes. A pair of spacers are disposed between the first and second circuit boards, each spacer extending through one of the apertures of the second circuit board and received within one of the first plurality of holes of one of the rail members. Terminal pins are attached to the first circuit board, at least one terminal pin extending through the second circuit board and a corresponding one of the second plurality of holes for connection to one of the connection regions on the substrate. Each of the second plurality of holes is sized to allow the rail members to be slidably positioned over the terminal pins during assembly of the power converter module.

摘要翻译： 用于与具有设置在其表面上的连接区域的基板（例如，主板）连接的多层电力转换器模块组件包括位于第一电路板上的第二电路板，第二电路板具有从上表面 到第二电路板的下表面。 至少两个轨道构件定位在第二电路板上方，每个轨道构件具有第一和第二多个孔。 一对间隔件设置在第一和第二电路板之间，每个间隔件延伸穿过第二电路板的一个孔并被接纳在一个轨道构件的第一多个孔中的一个孔内。 端子销附接到第一电路板，延伸穿过第二电路板的至少一个端子引脚和用于连接到基板上的一个连接区域的第二多个孔中的相应一个。 第二多个孔中的每一个的尺寸被设计成允许轨道构件在组装功率转换器模块期间可滑动地定位在端子销上方。

公开(公告)号：US5781093A

公开(公告)日：1998-07-14

申请号：US693878

申请日：1996-08-05

申请人： Paul E. Grandmont ,  Qun Lu ,  Fei Ma

发明人： Paul E. Grandmont ,  Qun Lu ,  Fei Ma

IPC分类号： H01F17/00 ,  H01F27/28 ,  H01F41/04 ,  H01F5/00

CPC分类号： H01F27/2804 ,  H01F17/0006 ,  H01F41/041

摘要： A planar winding assembly includes first and second windings, each winding having an axis and a pair of insulative sheet layers, laminated together, with at least one of each of the pairs of insulative sheets having a hole. Each winding further includes a metal strip conductor that is wound about the axis of its winding and is sealed between the laminated insulative sheet layers. The metal strip conductor has a portion projecting into the hole. The metal strip conductor of the first winding is electrically connected to the metal strip conductor of the second winding through the holes of the insulative sheets.

公开(公告)号：US5949321A

公开(公告)日：1999-09-07

申请号：US114759

申请日：1998-07-14

申请人： Paul E. Grandmont ,  Qun Lu ,  Fei Ma

发明人： Paul E. Grandmont ,  Qun Lu ,  Fei Ma

IPC分类号： H01F17/00 ,  H01F27/28 ,  H01F41/04 ,  H01F5/00

CPC分类号： H01F27/2804 ,  H01F17/0006 ,  H01F41/041

摘要： A planar winding assembly includes first and second windings, each winding having an axis and a pair of insulative sheet layers, laminated together, with at least one of each of the pairs of insulative sheets having a hole. Each winding further includes a metal strip conductor that is wound about the axis of its winding and is sealed between the laminated insulative sheet layers. The metal strip conductor has a portion projecting into the hole. The metal strip conductor of the first winding is electrically connected to the metal strip conductor of the second winding through the holes of the insulative sheets.

摘要翻译： 平面绕组组件包括第一和第二绕组，每个绕组具有层叠在一起的轴线和一对绝缘片层，每对绝缘片中的至少一个具有孔。 每个绕组还包括围绕其绕组的轴线缠绕并被密封在层压绝缘片层之间的金属带状导体。 金属带状导体具有突出到孔中的部分。 第一绕组的金属带状导体通过绝缘片的孔电连接到第二绕组的金属带状导体。

公开(公告)号：US5254435A

公开(公告)日：1993-10-19

申请号：US946812

申请日：1992-09-16

申请人： Paul E. Grandmont ,  Harold Lake

发明人： Paul E. Grandmont ,  Harold Lake

IPC分类号： G03F7/095 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/28 ,  G03C1/90

CPC分类号： H05K3/0082 ,  G03F7/0952 ,  H05K2203/0195 ,  H05K2203/0505 ,  H05K2203/0551 ,  H05K3/064 ,  H05K3/108 ,  H05K3/28

摘要： A CAD driven photoplotter selectively exposes a photographic imaging layer without affecting the underlying UV sensitive resist on a substrate to make a printed wiring board, for example. The image layer is developed on the board and used as an in situ mask for the underlying UV resist during exposure to UV. After UV exposure, the image layer is peeled off to allow conventional processing of the resist. The in situ mask is preferably applied in the form of a baseless, high contrast, high gamma emulsion layer bonded to the protective cover sheet over the uncured resist. To facilitate application, the emulsion layer is carried by a release paper which is removed before photoplotting. After UV exposure, the cover sheet and emulsion layer are integrally peeled from the resist.

摘要翻译： CAD驱动的光绘图仪选择性地曝光摄影成像层，而不会影响基板上的下面的UV敏感抗蚀剂，以制成印刷线路板。 图像层在板上显影，并在暴露于紫外线时用作底层紫外线抗蚀剂的原位掩模。 在UV曝光之后，图像层被剥离以允许抗蚀剂的常规处理。 原位掩模优选以未经固化的抗蚀剂结合到保护性覆盖片上的无根，高对比度，高γ乳剂层的形式施用。 为了便于应用，乳剂层由释放纸携带，在剥离纸之前被除去。 UV曝光后，覆盖片和乳剂层从抗蚀剂一体地剥离。

公开(公告)号：US4666818A

公开(公告)日：1987-05-19

申请号：US742742

申请日：1985-06-10

申请人： Harold Lake ,  Paul E. Grandmont

发明人： Harold Lake ,  Paul E. Grandmont

IPC分类号： G03F1/00 ,  G03F7/095 ,  G03F7/20 ,  G03F7/26 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/28 ,  G03C11/12 ,  G03C5/00

CPC分类号： H05K3/0082 ,  G03F7/0952 ,  H05K2203/0195 ,  H05K2203/0505 ,  H05K2203/0551 ,  H05K3/064 ,  H05K3/108 ,  H05K3/28

摘要： A method for patterning a photoresist or insulating layer on a printed wiring board utilizes two photoreactive coatings comprising a photoprocessable ultraviolet (UV) sensitive layer overlaid with a thin, unexposed, undeveloped strip base silver film. A white light x-y plotter, preferably employing an octagonal aperture, is driven directly from a CAD system to expose the film on the board in the desired pattern without affecting the underlying UV sensitive layer. The film is then developed on the board and employed as an in situ mask for the underlying UV layer during exposure of the board to a UV flood lamp. After UV exposure the film is peeled off to allow conventional processing of the selectively polymerized layer. This technique produces high resolution, inspectable onboard masks in full registration using reliable low energy plotters.

摘要翻译： 用于在印刷线路板上图案化光致抗蚀剂或绝缘层的方法使用两个光反应涂层，其包含覆盖有薄的未曝光的未开发的带状基底银膜的可光处理的紫外线（UV）敏感层。 优选使用八边形孔的白光x-y绘图仪直接从CAD系统驱动，以期望的图案露出板上的胶片，而不会影响底层的紫外线敏感层。 然后将该膜在板上显影，并将其用于在将板暴露于UV泛光灯的同时作为底层UV层的原位掩模。 在UV曝光之后，将膜剥离以允许选择性聚合层的常规加工。 这种技术使用可靠的低能量绘图仪，在完全注册时产生高分辨率，可检查的机载掩模。

公开(公告)号：US6030851A

公开(公告)日：2000-02-29

申请号：US869014

申请日：1997-06-04

申请人： Paul E. Grandmont ,  Clifford D. Fung

发明人： Paul E. Grandmont ,  Clifford D. Fung

IPC分类号： G01L9/00 ,  G01L19/06 ,  H01L21/00

CPC分类号： G01L19/0618 ,  G01L9/0042

摘要： A structure and method of fabrication is provided for a micromechanical overrange protected pressure sensor. A pressure sensor having a silicon substrate is provided with a cavity and a deformable diaphragm wherein deflection of the diaphragm in response to pressure is limited by a forward pressure stop. A method is provided for electrodepositing a metal layer which is attached to the substrate adjacent to the diaphragm to provide a reverse pressure stop in response to pressure supplied to the underside of a diaphragm. The metal layer has a relatively low thermal coefficient of expansion and is patterned through use of a photo-resist layer. A previously deposited precision spacer between the diaphragm and reverse pressure stop is removed to provide a precision gap between the reverse pressure stop and the diaphragm.Micromechanical elements of relatively great size, yet having precision dimensions or positioning are herein fabricated by lithography of patterned resist films up to several hundred microns thick, exposed and developed to great depth with faithful pattern delineation. The patterns formed by development of the exposed resist are then metallized, preferably by pulse electroplating, to form structural or mechanical elements. Deep film patterning may be achieved by laying down successive layers of a dry film resist and exposing each layer after it is deposited.

摘要翻译： 提供了一种用于微机械超范围保护的压力传感器的结构和制造方法。 具有硅基板的压力传感器设置有空腔和可变形隔膜，其中响应于压力的隔膜的偏转受到正向压力停止的限制。 提供了一种电沉积金属层的方法，该金属层附着在与隔膜相邻的基板上，以响应提供给隔膜下侧的压力而提供反向压力停止。 金属层具有相对低的热膨胀系数，并通过使用光致抗蚀剂层进行图案化。 在膜片和反向压力挡块之间先前​​沉积的精密间隔物被去除，以提供反向压力停止和隔膜之间的精确间隙。 具有相当大尺寸但具有精确尺寸或定位的微机械元件在本文中通过用高达数百微米厚的图案化抗蚀剂膜的光刻制造，通过忠实的图案描绘曝光和显影至大深度。 然后通过曝光的抗蚀剂的显影形成的图案优选地通过脉冲电镀进行金属化，以形成结构或机械元件。 深膜图案化可以通过铺设干膜抗蚀剂的连续层并在其沉积之后暴露每层来实现。

公开(公告)号：US5302494A

公开(公告)日：1994-04-12

申请号：US915341

申请日：1992-07-17

申请人： Paul E. Grandmont ,  Harold Lake ,  Richard A. Anderson

发明人： Paul E. Grandmont ,  Harold Lake ,  Richard A. Anderson

IPC分类号： H01L21/48 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  G03C5/00

CPC分类号： H05K3/465 ,  H01L21/4857 ,  H05K3/0023 ,  H05K3/0041 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0554 ,  H05K2203/107 ,  H05K3/002 ,  H05K3/0035 ,  H05K3/108 ,  H05K3/184 ,  H05K3/244 ,  H05K3/389 ,  H05K3/422 ,  H05K3/4661 ,  Y10S428/901 ,  Y10S428/913 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/31678

摘要： A microporous, photoprocessable, moderately hydrophilic material on which metal can be deposited directly using electroless plating techniques, and its use in preparing printed wiring boards and circuit components.

摘要翻译： 可以使用化学镀技术直接沉积金属的微孔，光可加工的中等亲水性材料，以及其用于制备印刷线路板和电路部件的用途。

公开(公告)号：US4915983A

公开(公告)日：1990-04-10

申请号：US742747

申请日：1985-06-10

申请人： Harold Lake ,  Paul E. Grandmont

发明人： Harold Lake ,  Paul E. Grandmont

IPC分类号： H01L21/48 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H05K3/42 ,  H05K3/46

CPC分类号： H01L21/4857 ,  H05K3/0023 ,  H05K3/0041 ,  H05K3/465 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0554 ,  H05K3/002 ,  H05K3/0035 ,  H05K3/108 ,  H05K3/184 ,  H05K3/244 ,  H05K3/422 ,  H05K3/4661 ,  Y10T29/49128 ,  Y10T29/49165

摘要： A process for making additive multilayer circuit boards uses separately designed and fabricated composite structures each consisting of a patterned conductive metal foil supported by a photo-processible insulating film. The composite is bonded foil pattern side down to the substrate or pre-existing multilayer structure and selected areas of the insulating film are removed down to underlying metal sites for electroless plating. All of the apertures in the insulating film are then electrolessly plated full of metal flush to the upper surface. Additional patterned composites are applied and plated up as desired to create blind vias and new conductor patterns layer by layer. In an alternate process a foil clad composite is bonded to an existing substrate foil side up. The insulating layer is selectively etched through windows photoetched in the foil layer. The voids in the insulator layer expose copper sites on the underlying composite. The voids are plated full of metal to form vias and the foil layer is photoetched to make a conductor pattern. The process is repeated to make a multilayer PWB.

摘要翻译： 制造添加剂多层电路板的方法使用分别设计和制造的复合结构，每个复合结构由图案化的由可光致抗蚀绝缘膜支撑的导电金属箔构成。 复合材料将箔片图案侧向下贴合到基底或预先存在的多层结构，并将绝缘膜的选定区域下移到下面的金属部位用于化学镀。 然后将绝缘膜中的所有孔径无电镀，使其与上表面齐平。 根据需要施加附加的图案化复合材料并铺板以逐层地形成盲孔和新导体图案。 在替代方法中，箔包覆复合材料与现有的衬底箔一起向上结合。 通过在箔层中蚀刻的窗口来选择性地蚀刻绝缘层。 绝缘体层中的空隙暴露了下面的复合材料上的铜部位。 空隙充满金属以形成通孔，并且箔层被光刻以制成导体图案。 重复该过程以制备多层PWB。

公开(公告)号：US4403196A

公开(公告)日：1983-09-06

申请号：US256373

申请日：1981-04-22

申请人： Paul E. Grandmont

发明人： Paul E. Grandmont

IPC分类号： H03F3/217 ,  H03F3/45 ,  H03F3/38

CPC分类号： H03F3/217 ,  H03F3/45479

摘要： The adverse effects of the impedance of long varying impedance connecting lines used in pulse width modulated power amplifier are eliminated by means of a dual input differential amplifier that senses the line voltage drops in the connecting lines and combines them into a line voltage drop compensation signal that is applied across the power amplifier inputs. This line voltage drop compensation signal raises the output of the power amplifier by the amounts needed to null out the line voltage drops.

摘要翻译： 通过双输入差分放大器消除在脉冲宽度调制功率放大器中使用的长阻抗连接线的阻抗的不利影响，该输入差分放大器检测连接线中的线路电压降，并将它们组合成线路电压降补偿信号， 跨越功率放大器输入。 该线路压降补偿信号将功率放大器的输出提高到消除线路电压降所需的量。