公开(公告)号：US11469520B2

公开(公告)日：2022-10-11

申请号：US16786880

申请日：2020-02-10

Applicant: RAYTHEON COMPANY

Inventor： Jack J. Schuss ,  Phillip W. Thiessen ,  Thomas V. Sikina

IPC: H01Q21/06 ,  H01Q5/307 ,  G01S7/03

Abstract: A dual band dipole radiator array includes a high band radiator array disposed on a dielectric layer for transmitting and receiving high band radar signals; a low band radiator array disposed on a front side of the high band radiator array for transmitting and receiving low band radar signals; a foam material between the low band radiator array and the high band radiator array for support; and a single aperture for both the low band radiator array and the high band radiator array for transmitting and receiving the radar signals, where the low band radiator array is comprised of a plurality of dipole structures disposed within the foam material and tuned to pass through high band radar signals to or from the high band radiator array.

公开(公告)号：US20210249771A1

公开(公告)日：2021-08-12

申请号：US16786881

申请日：2020-02-10

Applicant: RAYTHEON COMPANY

Inventor： Jack J. Schuss ,  Phillip W. Thiessen ,  Thomas V. Sikina

IPC: H01Q5/40 ,  H01Q15/00 ,  H01Q21/06 ,  G01S7/03

Abstract: A dual band frequency selective radiator array includes a high band radiator array disposed on a dielectric layer for transmitting and receiving high band radar signals; a low band radiator array disposed on a front side of the high band radiator array for transmitting and receiving low band radar signals; a frequency selective surface (FSS) tuned to the high band radar signals forming a surface of the low band radiator array and passes the high band radar signals to the high band radiator array; and a single aperture disposed in front of the low band radiator array, the high band radiator array and the FSS for both the low band radiator array and the high band radiator array for transmitting and receiving the radar signals.

公开(公告)号：US11145977B2

公开(公告)日：2021-10-12

申请号：US16441837

申请日：2019-06-14

Applicant: RAYTHEON COMPANY

Inventor： Kevin Wilder ,  Jonathan E. Nufio-Molina ,  Phillip W. Thiessen ,  Thomas V. Sikina ,  James E. Benedict ,  Andrew R. Southworth ,  Erika Klek

IPC: H01Q1/12 ,  H01Q25/00 ,  H01Q21/00 ,  H01P1/04 ,  H01Q3/30 ,  H05K1/02

Abstract: An array includes a support structure configured to support columns of beamformer assemblies, and a plurality of beamformer assemblies supported by the support structure. Each beamformer assembly includes at least one beamformer having at least one first beamformer segment and at least one second beamformer segment configured to interconnect with the first beamformer segment.

公开(公告)号：US11600922B2

公开(公告)日：2023-03-07

申请号：US16786881

申请日：2020-02-10

Applicant: RAYTHEON COMPANY

Inventor： Jack J. Schuss ,  Phillip W. Thiessen ,  Thomas V. Sikina

IPC: H01Q5/40 ,  G01S7/03 ,  H01Q15/00 ,  H01Q21/06

Abstract: A dual band frequency selective radiator array includes a high band radiator array disposed on a dielectric layer for transmitting and receiving high band radar signals; a low band radiator array disposed on a front side of the high band radiator array for transmitting and receiving low band radar signals; a frequency selective surface (FSS) tuned to the high band radar signals forming a surface of the low band radiator array and passes the high band radar signals to the high band radiator array; and a single aperture disposed in front of the low band radiator array, the high band radiator array and the FSS for both the low band radiator array and the high band radiator array for transmitting and receiving the radar signals.

公开(公告)号：US11118602B2

公开(公告)日：2021-09-14

申请号：US15863200

申请日：2018-01-05

Applicant: Raytheon Company

Inventor： Phillip W. Thiessen

IPC: F04D29/58 ,  F04D29/42 ,  F04D29/62 ,  F04D13/02 ,  H05K7/20 ,  F04D13/06 ,  F04D1/00 ,  F04D29/24

Abstract: A pump includes a circular housing having a thin profile, a brushless open frame motor, and a centrifugal impeller. The pump is configured to transport a fluid to transfer thermal energy to or from one or more external components.

公开(公告)号：US11128054B2

公开(公告)日：2021-09-21

申请号：US16373917

申请日：2019-04-03

Applicant: Raytheon Company

Inventor： Phillip W. Thiessen

IPC: H01Q21/06 ,  H01Q1/12

Abstract: An array antenna assembly includes a frame support structure and a plurality of line replaceable units that each include a panel having a front surface on which a plurality of radiating elements are disposed, and a rear surface opposing the front surface, and a bracket that extends from the rear surface and has orthogonal flanges that are engageable with the frame support structure to align the line replaceable unit within the array antenna.

公开(公告)号：US20210249787A1

公开(公告)日：2021-08-12

申请号：US16786880

申请日：2020-02-10

Applicant: RAYTHEON COMPANY

Inventor： Jack J. Schuss ,  Phillip W. Thiessen ,  Thomas V. Sikina

IPC: H01Q21/06 ,  H01Q5/307 ,  G01S7/03

Abstract: A dual band dipole radiator array includes a high band radiator array disposed on a dielectric layer for transmitting and receiving high band radar signals; a low band radiator array disposed on a front side of the high band radiator array for transmitting and receiving low band radar signals; a foam material between the low band radiator array and the high band radiator array for support; and a single aperture for both the low band radiator array and the high band radiator array for transmitting and receiving the radar signals, where the low band radiator array is comprised of a plurality of dipole structures disposed within the foam material and tuned to pass through high band radar signals to or from the high band radiator array.

公开(公告)号：US20200321709A1

公开(公告)日：2020-10-08

申请号：US16373917

申请日：2019-04-03

Applicant: Raytheon Company

Inventor： Phillip W. Thiessen

IPC: H01Q21/06 ,  H01Q1/12

Abstract: An array antenna assembly includes a frame support structure and a plurality of line replaceable units that each include a panel having a front surface on which a plurality of radiating elements are disposed, and a rear surface opposing the front surface, and a bracket that extends from the rear surface and has orthogonal flanges that are engageable with the frame support structure to align the line replaceable unit within the array antenna.

公开(公告)号：US20180199466A1

公开(公告)日：2018-07-12

申请号：US15863200

申请日：2018-01-05

Applicant: Raytheon Company

Inventor： Phillip W. Thiessen

IPC: H05K7/20 ,  F04D13/06 ,  F04D29/42 ,  F04D29/24 ,  F04D13/02 ,  F04D29/62

CPC classification number: H05K7/20272 ,  F04D1/00 ,  F04D13/024 ,  F04D13/06 ,  F04D13/0666 ,  F04D29/242 ,  F04D29/426 ,  F04D29/606 ,  F04D29/628 ,  H05K7/20254

Abstract: A pump includes a circular housing having a thin profile, a brushless open frame motor, and a centrifugal impeller. The pump is configured to transport a fluid to transfer thermal energy to or from one or more external components.