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公开(公告)号:US2758261A
公开(公告)日:1956-08-07
申请号:US29135152
申请日:1952-06-02
Applicant: RCA CORP
Inventor: ARMSTRONG LORNE D , PANTCHECHNIKOFF JACQUES I
CPC classification number: H01L23/3157 , H01L23/041 , H01L23/16 , H01L23/24 , H01L23/42 , H01L2224/4918 , H01L2224/8592
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公开(公告)号:US2906931A
公开(公告)日:1959-09-29
申请号:US47729554
申请日:1954-12-23
Applicant: RCA CORP
Inventor: ARMSTRONG LORNE D
CPC classification number: H01L23/3157 , H01L23/041 , H01L23/16 , H01L23/24 , H01L23/42 , H01L2224/4918 , H01L2224/8592
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公开(公告)号:US2878432A
公开(公告)日:1959-03-17
申请号:US61568156
申请日:1956-10-12
Applicant: RCA CORP
Inventor: ARMSTRONG LORNE D , HARMON HENRY D , MEISEL HERBERT R
CPC classification number: H01L29/00 , H01L21/00 , H01L23/31 , H01L29/43 , H01L2924/0002 , H01L2924/00
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4.Alloy junction type semiconductor devices and methods of making them 失效
Title translation: 合金结型半导体器件及其制造方法-
公开(公告)号:US2918719A
公开(公告)日:1959-12-29
申请号:US40124053
申请日:1953-12-30
Applicant: RCA CORP
Inventor: ARMSTRONG LORNE D
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6.Method of making phosphorus diffused silicon semiconductor devices 失效
Title translation: 制造磷扩散硅半导体器件的方法公开(公告)号:US2974073A
公开(公告)日:1961-03-07
申请号:US77817358
申请日:1958-12-04
Applicant: RCA CORP
Inventor: ARMSTRONG LORNE D
IPC: H01L21/225
CPC classification number: H01L21/2255 , H01L21/2252 , Y10S148/043
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公开(公告)号:US2750542A
公开(公告)日:1956-06-12
申请号:US34645253
申请日:1953-04-02
Applicant: RCA CORP
Inventor: ARMSTRONG LORNE D , JENNY DICTRICH A
IPC: B23K35/24 , H01L29/00 , H01L29/167 , H01L29/80
CPC classification number: H01L29/167 , B23K35/24 , H01L29/00 , H01L29/80
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10.
公开(公告)号:US3214654A
公开(公告)日:1965-10-26
申请号:US8642961
申请日:1961-02-01
Applicant: RCA CORP
Inventor: ARMSTRONG LORNE D , BUCKLEY EDWARD G
IPC: H01L21/288 , H01L21/306 , H01L29/20 , H01L29/45 , H01L29/861
CPC classification number: H01L29/8613 , H01L21/288 , H01L21/30612 , H01L29/20 , H01L29/452
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