公开(公告)号：US3720525A

公开(公告)日：1973-03-13

申请号：US3720525D

申请日：1971-08-16

Applicant: RCA CORP

Inventor： FELDSTEIN N ,  WEINER J

IPC: C23C18/40 ,  C23C3/02

CPC classification number: C23C18/40

Abstract: THE RATE OF PLATING COPPER ONTO AN ACTIVE METALLIC SURFACE OF A SUBSTRATE FROM AN ELECTROLESS COPPER PLATING SOLUTION IS ENHANCED BY ADDING TO THE PLATING SOLUTION AN IONIC COMPOUND CONSISTING OF EITHER AN ACETATE, A NITRATE, AN OXALATE, A LACTATE, A CHLORIDE, A TARTRATE, A FORMATE, A PHTHALAE, A TUNGSTATE, A MOLYBDATE, A CHLORATE, A PERCHLORATE, A CITRATE, A MOLONATE, OR MIXTURES THEREOF.

公开(公告)号：US3753816A

公开(公告)日：1973-08-21

申请号：US3753816D

申请日：1971-11-18

Applicant: RCA CORP

Inventor： FELDSTEIN N ,  LAW H

IPC: C23C18/18 ,  G03F1/72 ,  H05K1/03 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/22 ,  C23F1/02 ,  C23F17/00

CPC classification number: G03F1/72 ,  C23C18/1605 ,  H05K1/0306 ,  H05K3/062 ,  H05K3/108 ,  H05K3/181 ,  H05K3/225 ,  H05K2201/0344 ,  H05K2203/0542 ,  H05K2203/072 ,  Y10T29/49156 ,  Y10T29/49746

Abstract: The method comprises depositing a thin layer of a first metal having a relatively high degree of solubility in a particular etchant over both plated areas (if a previously deposited pattern is being repaired) and unplated areas on a substrate, this first metal being catalytic to electroless deposition of a second metal to be subsequently deposited, electrolessly depositing on the first metal either an overall pattern of areas of a second metal which has a relatively low degree of solubility in the etchant or a pattern limited to parts of a previously deposited pattern that were missing or incompletely formed, and then treating the plated areas with the etchant, where desired, so that the first metal is removed where it is not covered by the second metal but the second metal is substantially unaffected.

Abstract translation: 该方法包括在两个镀覆区域（如果先前沉积的图案被修复）和在基底上未镀覆的区域上沉积具有相对较高溶解度的第一金属薄层，该第一金属在特定的蚀刻剂上催化以无电化 沉积待随后沉积的第二金属，在第一金属上无电沉积第二金属的整体图案，其在蚀刻剂中具有相对较低溶解度的第二金属的区域或限于先前沉积图案的部分的图案， 丢失或不完全形成，然后在需要时用蚀刻剂处理镀覆区域，使得第一金属在不被第二金属覆盖但第二金属基本上不受影响的情况下被去除。

公开(公告)号：US3841881A

公开(公告)日：1974-10-15

申请号：US28877772

申请日：1972-09-13

Applicant: RCA CORP

Inventor： FELDSTEIN N ,  LANCSEK T

IPC: C23C18/28 ,  C23C3/02

CPC classification number: C23C18/28

Abstract: A colloidal solution of a catalytic metal is prepared by admixing an acid-soluble salt of the metal, hydrochloric acid, a soluble stannous salt present in excess of the amount necessary to reduce the metal salt to colloidal metal, and a quantity of stannic chloride that has been separately aged. A substrate surface upon which metal is to be deposited is treated with the catalytic colloidal solution. The catalyzed surface is then subjected to an electroless plating bath.

Abstract translation: 催化金属的胶体溶液通过将金属的酸溶性盐，盐酸，超过金属盐所需量的可溶性亚锡盐与胶态金属混合，并将一定量的氯化锡， 已分别老化。 用催化胶体溶液处理要沉积金属的衬底表面。 然后将催化表面进行化学镀浴。

公开(公告)号：US3822155A

公开(公告)日：1974-07-02

申请号：US32530873

申请日：1973-01-22

Applicant: RCA CORP

Inventor： FELDSTEIN N ,  WEINER J

IPC: C23C18/16 ,  G03F1/54 ,  C23F1/02

CPC classification number: G03F1/54 ,  C23C18/1603 ,  C23C18/1689 ,  C23C18/40

Abstract: A METHOD COMPRISING ELECTROLESSLY DEPOSITING A SEMITRANSPARENT FILM WHICH IS PREDOMINANTLY CUPROUS OXIDE OM A TRANSPARENT SUBSTRATE AND DELINEATING A PATTERN IN THE FILM BY ETCHING.

公开(公告)号：US3745039A

公开(公告)日：1973-07-10

申请号：US3745039D

申请日：1971-10-28

Applicant: RCA CORP

Inventor： FELDSTEIN N

IPC: C23C18/36 ,  C23C3/02

CPC classification number: C23C18/36

Abstract: ELECTROLESS DEPOSITION OF COBALT FROM AN AQUEOUS ALKALINE BATH ON A PALLADIUM ACTIVATED SUBSTRATE. BATH CONTAINS HYPOPHOSPHITE AS REDUCING AGENT, LINEAR POLYPHOSPHATE ANION AND AMMONIUM HYDROXIDE AS COMPLEXING AGENTS AND SMALL CONTROLLED AMOUNTS OF NICKEL ION. COBALT WILL ALSO DEPOSIT WITHOUT IONS BEING IN BATH BY PROVIDING NICKEL ON SUBSTRATE.