公开(公告)号：US09887105B2

公开(公告)日：2018-02-06

申请号：US14983143

申请日：2015-12-29

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Haruhiko Harada

IPC: H01L21/56 ,  B29C45/14 ,  B29C45/40 ,  B29C45/02 ,  H01L23/29 ,  H01L23/31 ,  H01L23/00 ,  B29K105/00

CPC classification number: H01L21/565 ,  B29C45/02 ,  B29C45/14655 ,  B29C45/4005 ,  B29K2105/255 ,  H01L21/561 ,  H01L23/295 ,  H01L23/3128 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00

Abstract: An object of the present invention is to improve the reliability and productivity of a semiconductor device by suppressing generation of a resin burr in a molding process. In a mold die, a tip-end surface of each push-up pin provided on the rear surface side of a lower die cavity block and a part of the rear surface of the lower die cavity block with which the tip-end surface of each push-up pin is contacted are inclined in such a manner that a distance to a top surface of the lower die cavity block becomes longer towards the pot side where mold resin is supplied. Accordingly, when the lower die cavity block is returned to the initial position, the lower die cavity block is lifted while being slightly moved towards the pot block side. Thus, no gap is formed between a side surface of the pot block and a side surface of the lower die cavity block.

公开(公告)号：US11705344B2

公开(公告)日：2023-07-18

申请号：US17405550

申请日：2021-08-18

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Masakatsu Suzuki ,  Haruhiko Harada ,  Yasuhiko Akaike

IPC: H01L21/56 ,  H01L21/02

CPC classification number: H01L21/565 ,  H01L21/02041 ,  H01L2924/181

Abstract: A technique capable of shortening process time for plasma cleaning is provided. A method of manufacturing a semiconductor device includes a step of preparing a substrate including a plurality of device regions each including a semiconductor chip electrically connected to a plurality of terminals formed on a main surface by a wire, a step of delivering the substrate while emitting plasma generated in atmospheric pressure to the main surface of the substrate, a step of delivering the substrate while capturing an image of a region of the main surface of the substrate and a step of forming a sealing body by sealing the semiconductor chip and the wire with a resin.

公开(公告)号：US09966329B2

公开(公告)日：2018-05-08

申请号：US15660294

申请日：2017-07-26

Applicant: Renesas Electronics Corporation

Inventor： Fukumi Shimizu ,  Haruhiko Harada

IPC: H01L21/00 ,  H01L23/495 ,  H01L21/56 ,  H01L21/66 ,  H01L21/67 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/49568 ,  H01L21/4842 ,  H01L21/561 ,  H01L21/565 ,  H01L21/67115 ,  H01L21/67126 ,  H01L21/67253 ,  H01L22/12 ,  H01L23/49503 ,  H01L23/49537 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Reliability of a semiconductor device is improved. A method for manufacturing the semiconductor device includes the steps of: providing a lead frame having a semiconductor chip mounted thereon; providing a heat radiating frame having a heat radiating plate; and resin sealing the semiconductor chip and the heat radiating plate with the lead frame and the heat radiating frame in a stacked state. The method further includes the steps of: separating a frame body of the heat radiating frame from the lead frame having a sealing body; and applying an inspection to detect resin-unfilled regions to the lead frame having the sealing body. Since the frame body of the heat radiating frame shielding an inspection region is removed before the inspection, it becomes possible to perform the inspection using transmitted light.

公开(公告)号：US09960055B1

公开(公告)日：2018-05-01

申请号：US15857138

申请日：2017-12-28

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Haruhiko Harada

IPC: H01L21/56 ,  H01L23/00 ,  B29C45/02 ,  B29C45/40 ,  B29C45/14 ,  H01L23/31 ,  H01L23/29 ,  B29K105/00

CPC classification number: H01L21/565 ,  B29C45/02 ,  B29C45/14655 ,  B29C45/4005 ,  B29K2105/255 ,  H01L21/561 ,  H01L23/295 ,  H01L23/3128 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2924/00

Abstract: In a mold die, a tip-end surface of each push-up pin provided on the rear surface side of a lower die cavity block and a part of the rear surface of the lower die cavity block with which the tip-end surface of each push-up pin is contacted are inclined in such a manner that a distance to a top surface of the lower die cavity block becomes longer towards the pot side where mold resin is supplied. When the lower die cavity block is returned to the initial position, the lower die cavity block is lifted while being slightly moved towards the pot block side. No gap is formed between a side surface of the pot block and a side surface of the lower die cavity block.