Method for manufacturing an electronic assembly; an electronic assembly, a cover and a substrate
    4.
    发明授权
    Method for manufacturing an electronic assembly; an electronic assembly, a cover and a substrate 有权
    电子组件的制造方法 电子组件,盖子和基板

    公开(公告)号:US07884289B2

    公开(公告)日:2011-02-08

    申请号:US12297022

    申请日:2007-04-11

    IPC分类号: H05K7/02

    摘要: The present invention relates to a method for manufacturing an electronic assembly (50) comprising an electronic component, a cavity and a substrate which method comprises; —providing an electronic component (10) having a first pattern with a substantially closed configuration; —providing a cover (18) on a surface of the electronic component, which cover together with said surface defines a cavity (20), the closed configuration of the first pattern substantially enclosing the cover at said surface; —providing a substrate (30) having a second pattern with a substantially closed configuration, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad; —disposing solder material at the solder pad; —positioning the electronic component and the substrate so as to align both the substantially closed configurations of the first and second pattern, while the substrate supports a top surface (28) of the cover; —reflow-soldering the solder material, therewith providing a soldered connection (52) between the first and second pattern. Furthermore the present invention relates to an electronic assembly (50), a cover (18) and a substrate (30).

    摘要翻译: 本发明涉及一种用于制造电子组件(50)的方法,所述电子组件(50)包括电子部件,空腔和基板,所述方法包括: - 提供具有基本上封闭构造的第一图案的电子部件(10) - 提供与所述表面一起覆盖的所述电子部件的表面上的盖子(18)限定空腔(20),所述第一图案的所述封闭构造基本上在所述表面上包围所述盖子; - 提供具有基本封闭构造的第二图案的衬底(30),该封闭构造至少部分对应于第一图案的封闭构造,并且包括焊盘; - 在焊料垫上涂抹焊料; - 定位所述电子部件和所述基板,以使所述第一和第二图案的所述基本上封闭的构造对准,同时所述基板支撑所述盖的顶表面(28); - 回流焊接焊料材料,从而在第一和第二图案之间提供焊接连接(52)。 此外,本发明涉及电子组件(50),盖(18)和基板(30)。

    METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY; AN ELECTRONIC ASSEMBLY, A COVER AND A SUBSTRATE
    7.
    发明申请
    METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY; AN ELECTRONIC ASSEMBLY, A COVER AND A SUBSTRATE 有权
    制造电子装配的方法; 电子组件,盖子和基板

    公开(公告)号:US20090159331A1

    公开(公告)日:2009-06-25

    申请号:US12297022

    申请日:2007-04-11

    摘要: The present invention relates to a method for manufacturing an electronic assembly (50) comprising an electronic component, a cavity and a substrate which method comprises; —providing an electronic component (10) having a first pattern with a substantially closed configuration; —providing a cover (18) on a surface of the electronic component, which cover together with said surface defines a cavity (20), the closed configuration of the first pattern substantially enclosing the cover at said surface; —providing a substrate (30) having a second pattern with a substantially closed configuration, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad; —disposing solder material at the solder pad; —positioning the electronic component and the substrate so as to align both the substantially closed configurations of the first and second pattern, while the substrate supports a top surface (28) of the cover; —reflow-soldering the solder material, therewith providing a soldered connection (52) between the first and second pattern. Furthermore the present invention relates to an electronic assembly (50), a cover (18) and a substrate (30).

    摘要翻译: 本发明涉及一种用于制造电子组件(50)的方法,所述电子组件(50)包括电子部件,空腔和基板,所述方法包括: - 提供具有基本上封闭构造的第一图案的电子部件(10) - 提供与所述表面一起覆盖的所述电子部件的表面上的盖子(18)限定空腔(20),所述第一图案的所述封闭构造基本上在所述表面上包围所述盖子; - 提供具有基本封闭构造的第二图案的衬底(30),该封闭构造至少部分对应于第一图案的封闭构造,并且包括焊盘; - 在焊料垫上涂抹焊料; - 定位所述电子部件和所述基板,以使所述第一和第二图案的所述基本上封闭的构造对准,同时所述基板支撑所述盖的顶表面(28); - 回流焊接焊料材料,从而在第一和第二图案之间提供焊接连接(52)。 此外,本发明涉及电子组件(50),盖(18)和基板(30)。