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1.发明授权Chemical mechanical polishing a substrate having a filler layer and a stop layer 有权化学机械抛光具有填料层和停止层的基材公开(公告)号：US07201636B2
公开(公告)日：2007-04-10
申请号：US11075778
申请日：2005-03-08
CPC分类号： H01L21/76819 , B24B37/04 , B24B37/042 , H01L21/31053 , H01L21/3212 , H01L21/7684
摘要： A substrate is chemical mechanical polished with a high-selectivity slurry until the stop layer is at least partially exposed, and then the substrate is polished with a low-selectivity slurry until the stop layer is completely exposed.
摘要翻译： 将基材用高选择性浆料进行化学机械抛光，直至止挡层至少部分暴露，然后用低选择性浆料抛光基材直到停止层完全暴露。
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2.发明授权Chemical mechanical polishing a substrate having a filler layer and a stop layer 有权化学机械抛光具有填料层和停止层的基材公开(公告)号：US06863593B1
公开(公告)日：2005-03-08
申请号：US09184805
申请日：1998-11-02
IPC分类号： B24B37/04 , H01L21/3105 , H01L21/321 , H01L21/768 , B24C1/08
CPC分类号： H01L21/76819 , B24B37/04 , B24B37/042 , H01L21/31053 , H01L21/3212 , H01L21/7684
摘要： A substrate is chemical mechanical polished with a high-selectivity slurry until the stop layer is at least partially exposed, and then the substrate is polished with a low-selectivity slurry until the stop layer is completely exposed.
摘要翻译： 将基材用高选择性浆料进行化学机械抛光，直至止挡层至少部分暴露，然后用低选择性浆料抛光基材直到停止层完全暴露。
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公开(公告)号：US6162368A
公开(公告)日：2000-12-19
申请号：US97004
申请日：1998-06-13
申请人： Shijian Li , Thomas H. Osterheld , Fred C. Redeker
发明人： Shijian Li , Thomas H. Osterheld , Fred C. Redeker
IPC分类号： B24B37/04 , H01L21/304 , H01L21/306 , H01L21/321 , B44C1/22 , H01L21/00
CPC分类号： B24B37/04 , B24B37/042 , H01L21/3212
摘要： Chemical mechanical polishing of a silicon layer, such as a polycrystalline silicon, is improved by initially chemical mechanically polishing the silicon layer with an oxide-polishing slurry. Then the silicon layer is chemical mechanically polished with a silicon-polishing slurry until the substrate is planarized.
摘要翻译： 通过用氧化物抛光浆料首先化学机械抛光硅层，改善硅层（例如多晶硅）的化学机械抛光。 然后用硅抛光浆料对硅层进行化学机械抛光，直到基板平坦化。
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4.发明授权Polishing pad having a grooved pattern for use in chemical mechanical polishing 有权具有用于化学机械抛光的带槽图案的抛光垫公开(公告)号：US06645061B1
公开(公告)日：2003-11-11
申请号：US09441633
申请日：1999-11-16
IPC分类号： B24D1100
CPC分类号： B24B37/26
摘要： A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.
摘要翻译： 一种用于化学机械抛光装置的抛光垫。 抛光垫包括多个同心的圆形槽。 抛光垫可以包括具有不同宽度和间隔的凹槽的多个区域。
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5.发明授权
公开(公告)号：US5984769A
公开(公告)日：1999-11-16
申请号：US3315
申请日：1998-01-06
IPC分类号： B24B37/26 , B24D13/14 , H01L21/304 , B24D11/00
CPC分类号： B24B37/26
摘要： A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.
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6.发明授权Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus 有权具有用于化学机械抛光装置的带槽图案的抛光垫公开(公告)号：US06273806B1
公开(公告)日：2001-08-14
申请号：US09350754
申请日：1999-07-09
IPC分类号： B24D1100
CPC分类号： B24B37/26
摘要： A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of circular concentric grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.
摘要翻译： 一种用于化学机械抛光装置的抛光垫。 抛光垫包括多个圆形同心凹槽。 抛光垫可以包括具有不同宽度和间隔的凹槽的多个区域。
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公开(公告)号：US06855043B1
公开(公告)日：2005-02-15
申请号：US09611247
申请日：2000-07-07
申请人： Jianshe Tang , Brian J. Brown , Charles C. Garretson , Benjamin A. Bonner , Thomas H. Osterheld , Fred C. Redeker
发明人： Jianshe Tang , Brian J. Brown , Charles C. Garretson , Benjamin A. Bonner , Thomas H. Osterheld , Fred C. Redeker
IPC分类号： B24B37/30 , B24B37/32 , H01L21/304 , B24B47/02
摘要： A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane that applies a load to a substrate and a retaining ring. The friction coefficient of the lower surface of the flexible membrane is increased to prevent contact between the substrate and the retaining ring, thereby preventing slurry compaction and buildup and substrate deformation caused by such contact.
摘要翻译： 用于化学机械抛光装置的载体头包括向基材和保持环施加载荷的柔性膜。 增加柔性膜的下表面的摩擦系数，以防止基板与保持环之间的接触，从而防止由此引起的浆料压实和堆积以及基板变形。
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公开(公告)号：US09005999B2
公开(公告)日：2015-04-14
申请号：US13539344
申请日：2012-06-30
申请人： Kun Xu , Jimin Zhang , David H. Mai , Stephen Jew , Shih-Haur Walters Shen , Zhihong Wang , Thomas H. Osterheld , Wen-Chiang Tu , Gary Ka Ho Lam , Tomohiko Kitajima
发明人： Kun Xu , Jimin Zhang , David H. Mai , Stephen Jew , Shih-Haur Walters Shen , Zhihong Wang , Thomas H. Osterheld , Wen-Chiang Tu , Gary Ka Ho Lam , Tomohiko Kitajima
IPC分类号： H01L21/00 , H01L21/302 , H01L21/304
CPC分类号： H01L21/302 , B24B37/015 , H01L21/304
摘要： Methods for chemical mechanical polishing (CMP) of semiconductor substrates, and more particularly to temperature control during such chemical mechanical polishing are provided. In one aspect, the method comprises polishing the substrate with a polishing surface during a polishing process to remove a portion of the conductive material, repeatedly monitoring a temperature of the polishing surface during the polishing process, and exposing the polishing surface to a rate quench process in response to the monitored temperature so as to achieve a target value for the monitored temperature during the polishing process.
摘要翻译： 提供半导体衬底的化学机械抛光（CMP）的方法，更具体地说，涉及这种化学机械抛光时的温度控制。 一方面，该方法包括在抛光过程中用抛光表面抛光衬底以去除导电材料的一部分，在抛光过程中反复监测抛光表面的温度，并将抛光表面暴露于速率骤冷过程 响应于所监测的温度，以便在抛光过程中达到监测温度的目标值。
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公开(公告)号：US20140113524A1
公开(公告)日：2014-04-24
申请号：US13658737
申请日：2012-10-23
申请人： Jun Qian , Sivakumar Dhandapani , Benjamin Cherian , Thomas H. Osterheld , Jeffrey Drue David , Gregory E. Menk , Boguslaw A. Swedek , Doyle E. Bennett
发明人： Jun Qian , Sivakumar Dhandapani , Benjamin Cherian , Thomas H. Osterheld , Jeffrey Drue David , Gregory E. Menk , Boguslaw A. Swedek , Doyle E. Bennett
IPC分类号： B24B37/013 , B24B49/12
CPC分类号： B24B37/013 , B24B49/12
摘要： A method of controlling polishing includes polishing a substrate, monitoring the substrate during polishing with an in-situ spectrographic monitoring system to generate a sequence of measured spectra, selecting less than all of the measured spectra to generate a sequence of selected spectra, generating a sequence of values from the sequence of selected spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.
摘要翻译： 控制抛光的方法包括抛光衬底，用原位光谱监测系统在抛光期间监测衬底以产生测量光谱序列，选择少于所有测量光谱以产生选定光谱序列，产生序列 根据所选光谱的序列的值，并且基于所述值序列来确定抛光终点或抛光速率的调整中的至少一个。
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公开(公告)号：US08470125B2
公开(公告)日：2013-06-25
申请号：US13246614
申请日：2011-09-27
摘要： A carrier head for a chemical mechanical polishing apparatus includes a retaining ring having a flexible lower portion and a rigid upper portion.
摘要翻译： 用于化学机械抛光装置的承载头包括具有柔性下部和刚性上部的保持环。
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