公开(公告)号：US20180047452A1

公开(公告)日：2018-02-15

申请号：US15796193

申请日：2017-10-27

Applicant: Renesas Electronics Corporation

Inventor： Toshihiro TANAKA ,  Yukiko UMEMOTO ,  Mitsuru HIRAKI ,  Yutaka SHINAGAWA ,  Masamichi FUJITO ,  Kazufumi SUZUKAWA ,  Hiroyuki TANIKAWA ,  Takashi YAMAKI ,  Yoshiaki KAMIGAKI ,  Shinichi MINAMI ,  Kozo KATAYAMA ,  Nozomu MATSUZAKI

IPC: G11C16/26 ,  G11C5/02 ,  H01L29/792

CPC classification number: G11C16/26 ,  G11C5/025 ,  G11C8/08 ,  G11C16/04 ,  G11C16/0425 ,  G11C16/0433 ,  G11C16/08 ,  G11C16/24 ,  G11C16/30 ,  H01L21/28 ,  H01L21/28273 ,  H01L27/105 ,  H01L27/115 ,  H01L27/11521 ,  H01L27/11526 ,  H01L27/11546 ,  H01L29/42328 ,  H01L29/42332 ,  H01L29/4234 ,  H01L29/66825 ,  H01L29/7885 ,  H01L29/792

Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section. Assuming that the thickness of a gate insulating film of the second transistor section is defined as tc and the thickness of a gate insulating film of the first transistor section is defined as tm, they have a relationship of tc

公开(公告)号：US20180374542A1

公开(公告)日：2018-12-27

申请号：US16116893

申请日：2018-08-29

Applicant: Renesas Electronics Corporation

Inventor： Toshihiro TANAKA ,  Yukiko UMEMOTO ,  Mitsuru HIRAKI ,  Yutaka SHINAGAWA ,  Masamichi FUJITO ,  Kazufumi SUZUKAWA ,  Hiroyuki TANIKAWA ,  Takashi YAMAKI ,  Yoshiaki KAMIGAKI ,  Shinichi MINAMI ,  Kozo KATAYAMA ,  Nozomu MATSUZAKI

IPC: G11C16/26 ,  G11C16/30 ,  G11C16/04 ,  G11C8/08 ,  G11C5/02 ,  H01L21/28 ,  G11C16/24 ,  H01L29/792 ,  H01L29/788 ,  H01L29/66 ,  H01L29/423 ,  H01L27/11546 ,  H01L27/11526 ,  H01L27/11521 ,  H01L27/115 ,  H01L27/105 ,  G11C16/08

CPC classification number: G11C16/26 ,  G11C5/025 ,  G11C8/08 ,  G11C16/04 ,  G11C16/0425 ,  G11C16/0433 ,  G11C16/08 ,  G11C16/24 ,  G11C16/30 ,  H01L21/28 ,  H01L21/28273 ,  H01L27/105 ,  H01L27/115 ,  H01L27/11521 ,  H01L27/11526 ,  H01L27/11546 ,  H01L29/42328 ,  H01L29/42332 ,  H01L29/4234 ,  H01L29/66825 ,  H01L29/7885 ,  H01L29/792

Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section. Assuming that the thickness of a gate insulating film of the second transistor section is defined as tc and the thickness of a gate insulating film of the first transistor section is defined as tm, they have a relationship of tc

公开(公告)号：US20130235668A1

公开(公告)日：2013-09-12

申请号：US13867055

申请日：2013-04-20

Applicant: RENESAS ELECTRONICS CORPORATION ,  HITACHI ULSI SYSTEMS CO., LTD.

Inventor： Toshihiro TANAKA ,  Yukiko UMEMOTO ,  Mitsuru HIRAKI ,  Yutaka SHINAGAWA ,  Masamichi FUJITO ,  Kazufumi SUZUKAWA ,  Hiroyuki TANIKAWA ,  Takashi YAMAKI ,  Yoshiaki KAMIGAKI ,  Shinichi MINAMI ,  Kozo KATAYAMA ,  Nozomu MATSUZAKI

IPC: G11C16/24 ,  G11C16/04

CPC classification number: G11C16/26 ,  G11C5/025 ,  G11C8/08 ,  G11C16/04 ,  G11C16/0425 ,  G11C16/0433 ,  G11C16/08 ,  G11C16/24 ,  G11C16/30 ,  H01L21/28 ,  H01L21/28273 ,  H01L27/105 ,  H01L27/115 ,  H01L27/11521 ,  H01L27/11526 ,  H01L27/11546 ,  H01L29/42328 ,  H01L29/42332 ,  H01L29/4234 ,  H01L29/66825 ,  H01L29/7885 ,  H01L29/792

Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section. Assuming that the thickness of a gate insulating film of the second transistor section is defined as tc and the thickness of a gate insulating film of the first transistor section is defined as tm, they have a relationship of tc

公开(公告)号：US20160336074A1

公开(公告)日：2016-11-17

申请号：US15224669

申请日：2016-08-01

Applicant: Renesas Electronics Corporation

Inventor： Toshihiro TANAKA ,  Yukiko UMEMOTO ,  Mitsuru HIRAKI ,  Yutaka SHINAGAWA ,  Masamichi FUJITO ,  Kazufumi SUZUKAWA ,  Hiroyuki TANIKAWA ,  Takashi YAMAKI ,  Yoshiaki KAMIGAKI ,  Shinichi MINAMI ,  Kozo KATAYAMA ,  Nozomu MATSUZAKI

IPC: G11C16/26 ,  H01L27/115 ,  H01L21/28 ,  G11C16/04 ,  G11C16/24

CPC classification number: G11C16/26 ,  G11C5/025 ,  G11C8/08 ,  G11C16/04 ,  G11C16/0425 ,  G11C16/0433 ,  G11C16/08 ,  G11C16/24 ,  G11C16/30 ,  H01L21/28 ,  H01L21/28273 ,  H01L27/105 ,  H01L27/115 ,  H01L27/11521 ,  H01L27/11526 ,  H01L27/11546 ,  H01L29/42328 ,  H01L29/42332 ,  H01L29/4234 ,  H01L29/66825 ,  H01L29/7885 ,  H01L29/792

Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section. Assuming that the thickness of a gate insulating film of the second transistor section is defined as tc and the thickness of a gate insulating film of the first transistor section is defined as tm, they have a relationship of tc

公开(公告)号：US20140198577A1

公开(公告)日：2014-07-17

申请号：US14214969

申请日：2014-03-16

Applicant: HITACHI ULSI SYSTEMS CO., LTD. ,  RENESAS ELECTRONICS CORPORATION

Inventor： Toshihiro TANAKA ,  Yukiko UMEMOTO ,  Mitsuru HIRAKI ,  Yutaka SHINAGAWA ,  Masamichi FUJITO ,  Kazufumi SUZUKAWA ,  Hiroyuki TANIKAWA ,  Takashi YAMAKI ,  Yoshiaki KAMIGAKI ,  Shinichi MINAMI ,  Kozo KATAYAMA ,  Nozomu MATSUZAKI

IPC: G11C16/26

CPC classification number: G11C16/26 ,  G11C5/025 ,  G11C8/08 ,  G11C16/04 ,  G11C16/0425 ,  G11C16/0433 ,  G11C16/08 ,  G11C16/24 ,  G11C16/30 ,  H01L21/28 ,  H01L21/28273 ,  H01L27/105 ,  H01L27/115 ,  H01L27/11521 ,  H01L27/11526 ,  H01L27/11546 ,  H01L29/42328 ,  H01L29/42332 ,  H01L29/4234 ,  H01L29/66825 ,  H01L29/7885 ,  H01L29/792

Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section. Assuming that the thickness of a gate insulating film of the second transistor section is defined as tc and the thickness of a gate insulating film of the first transistor section is defined as tm, they have a relationship of tc

Abstract translation: 半导体器件包括多个非易失性存储单元（1）。 每个非易失性存储单元包括用于信息存储的MOS型第一晶体管部分（3）和选择第一晶体管部分的MOS型第二晶体管部分（4）。 第二晶体管部分具有连接到位线的位线电极（16）和连接到控制栅极控制线的控制栅电极（18）。 第一晶体管部分具有连接到源极线的源极线电极（10），连接到存储器栅极控制线的存储栅电极（14）和直接位于存储栅电极下方的电荷存储区域（11）。 第二晶体管部分的栅极耐受电压低于第一晶体管部分的栅极耐受电压。 假设第二晶体管部分的栅极绝缘膜的厚度被定义为tc，并且第一晶体管部分的栅极绝缘膜的厚度被定义为tm，它们具有tc