公开(公告)号：US5545429A

公开(公告)日：1996-08-13

申请号：US270086

申请日：1994-07-01

申请人： Richard B. Booth ,  Emanuel I. Cooper ,  Edward A. Giess ,  Mark R. Kordus ,  Sol Krongelb ,  Steven P. Ostrander ,  Judith M. Roldan ,  Carlos J. Sambucetti ,  Ravi Saraf

发明人： Richard B. Booth ,  Emanuel I. Cooper ,  Edward A. Giess ,  Mark R. Kordus ,  Sol Krongelb ,  Steven P. Ostrander ,  Judith M. Roldan ,  Carlos J. Sambucetti ,  Ravi Saraf

IPC分类号： H05K3/20 ,  H05K3/32 ,  H05K3/42 ,  B05D5/12 ,  C25D5/02

CPC分类号： H05K3/423 ,  H05K2203/0152 ,  H05K2203/0733 ,  H05K2203/1509 ,  H05K3/205 ,  H05K3/321

摘要： The present invention is directed to a process of a method for the full metallization of thru-holes in a polymer structure comprising the steps of applying a film-forming amount of a conductive polymer-metal composite paste to a metal cathode; bonding a patterned polymer structure to said paste; subjecting said polymer structure to an electrolytic plating bath for a time sufficient to fully metallize thru-hole surfaces in said patterned polymer structure and removing the structure from the cathode assembly. The fully metallized thru-hole polymer structure can then be cleaned and polished to produce a finished product.

摘要翻译： 本发明涉及一种在聚合物结构中贯穿孔的全金属化方法的方法，包括以下步骤：向金属阴极施加成膜量的导电聚合物 - 金属复合浆料; 将图案化的聚合物结构键合到所述糊料; 使所述聚合物结构经受电解电镀浴足够的时间以完全金属化所述图案化的聚合物结构中的通孔表面，并从阴极组件中去除结构。 完全金属化的通孔聚合物结构然后可以被清洁和抛光以产生成品。

公开(公告)号：US5306872A

公开(公告)日：1994-04-26

申请号：US996368

申请日：1992-12-23

申请人： Mark R. Kordus ,  Mark S. Schneider ,  Louis H. Wirtz

发明人： Mark R. Kordus ,  Mark S. Schneider ,  Louis H. Wirtz

IPC分类号： H01L21/48 ,  H05K3/46 ,  H05K1/00

CPC分类号： H01L21/4839 ,  H01L21/4846 ,  H05K3/4614

摘要： The present invention relates generally to new decal structures, and more particularly to electrically conductive decals that are filled with organic insulator material. Various methods and processes that are used to make these electrically conductive decals filled with organic dielectric materials are disclosed.

摘要翻译： 本发明一般涉及新的贴花结构，更具体地涉及填充有机绝缘材料的导电贴图。 公开了用于制造填充有机介电材料的这些导电贴花的各种方法和工艺。

公开(公告)号：US5338900A

公开(公告)日：1994-08-16

申请号：US996367

申请日：1992-12-23

申请人： Mark S. Schneider ,  John Acocella ,  Lester W. Herron ,  Mark R. Kordus ,  Louis H. Wirtz

发明人： Mark S. Schneider ,  John Acocella ,  Lester W. Herron ,  Mark R. Kordus ,  Louis H. Wirtz

IPC分类号： H01L21/68 ,  H01L23/498 ,  H05K1/00

CPC分类号： H01L21/6835 ,  H01L23/49827 ,  H01L2221/68377 ,  H01L2924/0002 ,  H01L2924/09701

摘要： The present invention relates generally to new structures for decals, and more particularly to electrically conductive decals filled with inorganic insulator material. Various methods and processes that are used to make these electrically conductive decals filled with inorganic dielectric material are disclosed.

摘要翻译： 本发明一般涉及用于贴花的新结构，更具体地说，涉及填充有无机绝缘体材料的导电贴花。 公开了用于制造充满无机介电材料的这些导电贴花的各种方法和工艺。

公开(公告)号：US5116459A

公开(公告)日：1992-05-26

申请号：US665497

申请日：1991-03-06

申请人： Mark R. Kordus ,  Mark S. Schneider ,  Louis H. Wirtz

发明人： Mark R. Kordus ,  Mark S. Schneider ,  Louis H. Wirtz

IPC分类号： H01R43/00 ,  H01L21/48 ,  H01L21/68 ,  H01L23/498 ,  H05K3/40

CPC分类号： H01L21/6835 ,  H01L21/4839 ,  H01L21/486 ,  H01L23/49827 ,  H01L2221/68377 ,  H01L2924/0002 ,  H01L2924/09701

摘要： The present invention relates generally to new processes for making decals, and more particularly to electrically conductive decals that are filled with organic insulator material. Various methods and processes that are used to make these electrically conductive decals filled with organic dielectric materials are disclosed.

摘要翻译： 本发明一般涉及用于制造贴花的新方法，更具体地说，涉及用有机绝缘材料填充的导电贴花。 公开了用于制造填充有机介电材料的这些导电贴花的各种方法和工艺。

公开(公告)号：US5108541A

公开(公告)日：1992-04-28

申请号：US665633

申请日：1991-03-06

申请人： Mark S. Schneider ,  John Acocella ,  Lester W. Herron ,  Mark R. Kordus ,  Louis H. Wirtz

发明人： Mark S. Schneider ,  John Acocella ,  Lester W. Herron ,  Mark R. Kordus ,  Louis H. Wirtz

IPC分类号： H01R43/00 ,  H01L21/48 ,  H01L21/68 ,  H05K1/03 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46

CPC分类号： H01L21/6835 ,  H01L21/4846 ,  H01L21/486 ,  H05K3/06 ,  H05K3/4647 ,  H01L2221/68377 ,  H05K1/0306 ,  H05K2203/0369 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1184 ,  H05K2203/1476 ,  H05K3/4614

摘要： The present invention relates generally to new processes for making decals, and more particularly to electrically conductive decals filled with inorganic insulator material. Various methods and processes that are used to make these electrically conductive decals filled with inorganic dielectric material are disclosed.

摘要翻译： 本发明一般涉及用于制造贴花的新方法，更具体地说，涉及填充有无机绝缘体材料的导电贴花。 公开了用于制造充满无机介电材料的这些导电贴花的各种方法和工艺。