摘要:
An electronic device includes a housing, an electronic display viewable from a front side of the electronic device, an optical shuttering layer substantially parallel to the front side, and a color changing layer positioned over at least a portion of the shuttering layer. A driver controls transitions of the shuttering layer between a transparent clear state and an opaque state and also transitions of the color changing layer between a transparent clear state and a colored state. Depending on driver control, the appearance of the electronic device can change from an opaque color (solid color or with graphic design elements), to a translucent color (solid color or with graphic design elements) possibly with an underlying electronic display somewhat visible, to a transparent color with an underlying electronic display clearly visible.
摘要:
An electronic device includes a housing, an electronic display viewable from a front side of the electronic device, an optical shuttering layer substantially parallel to the front side, and a color changing layer positioned over at least a portion of the shuttering layer. A driver controls transitions of the shuttering layer between a transparent clear state and an opaque state and also transitions of the color changing layer between a transparent clear state and a colored state. Depending on driver control, the appearance of the electronic device can change from an opaque color (solid color or with graphic design elements), to a translucent color (solid color or with graphic design elements) possibly with an underlying electronic display somewhat visible, to a transparent color with an underlying electronic display clearly visible.
摘要:
Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of encapsulant material in the cavity is treated to form a hardened upper surface thereof having a shape. A luminescent conversion element is provided on the upper surface of the treated first quantity of encapsulant material. The luminescent conversion element includes a wavelength conversion material and has a thickness at a middle region of the cavity greater than proximate a sidewall of the cavity.
摘要:
Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of encapsulant material in the cavity is treated to form a hardened upper surface thereof having a selected shape. A luminescent conversion element is provided on the upper surface of the treated first quantity of encapsulant material. The luminescent conversion element includes a wavelength conversion material and has a thickness at a middle region of the cavity greater than proximate a sidewall of the cavity.
摘要:
Methods of packaging a semiconductor light emitting device in a reflector having a moat positioned between a lower and an upper sidewall thereof, the upper and lower sidewall defining a reflective cavity, include dispensing encapsulant material into the reflective cavity including the light emitting device therein to cover the light emitting device and to form a convex meniscus of encapsulant material in the reflective cavity extending from an edge of the moat without contacting the upper sidewall of the reflector. The encapsulant material in the reflective cavity is cured. Packaged semiconductor light emitting devices and reflectors for the same are also provided.
摘要:
Methods of packaging a semiconductor light emitting device positioned in a reflective cavity are provided. A first quantity of encapsulant material is dispensed into the reflective cavity including the light emitting device therein and the first quantity of encapsulant in the reflective cavity is cured. A second quantity of encapsulant material is dispensed onto the cured first quantity of encapsulant material. A lens is positioned in the reflective cavity on the dispensed second quantity of encapsulant material. The dispensed second quantity of encapsulant material is cured to attach the lens in the reflective cavity.
摘要:
An emitter package comprising a light emitting diode (LED) mounted to the surface of a submount with the surface having a first meniscus forming feature around the LED. A matrix encapsulant is included on the surface and covering the LED. The outer edge of the matrix encapsulant adjacent the surface is defined by the meniscus forming feature and the encapsulant forms a substantially dome-shaped covering over said LED. A method for manufacturing an LED package by providing a body with a surface having a first meniscus holding feature. An LED is mounted to the surface with the meniscus holding feature around the LED. A liquid matrix encapsulant is introduced over the LED and the surface, the first meniscus holding feature holding the liquid matrix encapsulant in a dome-shape over the LED. The matrix encapsulant is then cured.
摘要:
Adhesive-free assembly of the substrate and reflector components of a semiconductor die package is achieved by injection molding the reflector onto a surface of the substrate or by molding the reflector separate from the substrate and securing it in place on the substrate through deformation of a portion of the reflector. The reflector may be made reflective either by molding the reflector using a light scattering material or through the addition of a reflective element, such as a piece of foil material that is secured to the reflector. A variety of interchangeable reflective elements having different surface shapes, and thus different light reflecting properties, may be made.
摘要:
The present invention relates to a mobile pet bed wherein the top and bottom units of the mobile pet bed are reversibly attached to each other. When the top unit is removed from the bottom unit the mobile pet bed functions similarly to a traditional pet bed. When the top unit is attached to the bottom unit the mobile pet bed functions as a pet carrier. Additionally, the top unit of the mobile pet bed has a door portion that can be opened and closed to permit pet ingress and egress as well as permitting easy loading of the mobile pet bed with the animal without necessitating the removal of the top unit from the bottom unit.