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公开(公告)号：US11940345B2
公开(公告)日：2024-03-26
申请号：US16721333
申请日：2019-12-19
Applicant: Robert Bosch GmbH
Inventor： Thomas Friedrich , Christoph Hermes , Hans Artmann , Heribert Weber , Peter Schmollngruber , Volkmar Senz
CPC classification number: G01L9/0073 , B81B3/0018 , G01L1/148 , G01L9/12 , B81B2201/0264
Abstract: A micromechanical component for a capacitive pressure sensor device includes a substrate; a frame structure that frames a partial surface; a membrane that is tensioned by the frame structure such that a self-supporting region of the membrane extends over the framed partial surface and an internal volume with a reference pressure therein is sealed in an airtight fashion, the self-supporting region of the membrane being deformable by a physical pressure on an external side of the self-supporting region that not equal to the reference pressure; a measurement electrode situated on the framed partial surface; and a reference measurement electrode that is situated on the framed partial surface and is electrically insulated from the measurement electrode.
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2.发明公开公开(公告)号：US20230357001A1
公开(公告)日：2023-11-09
申请号：US18246790
申请日：2021-09-30
Applicant: Robert Bosch GmbH
Inventor： Heribert Weber , Andreas Scheurle , Hans Artmann , Peter Schmollngruber , Thomas Friedrich , Uwe Schiller
CPC classification number: B81C1/00158 , B81B3/0021 , B81B2201/0257 , B81C2201/0105 , B81C2201/014 , B81C2203/038 , B81B2203/0307 , B81B2203/0315 , B81B2203/033 , B81B2203/0353
Abstract: A production method for a micromechanical component for a sensor device or microphone device. The method includes: forming a supporting structure composed of a first sacrificial material on a substrate surface of a substrate with a first sacrificial material layer, a plurality of etching holes structured through the first sacrificial material layer, and a plurality of supporting posts projecting into the substrate; etching into the substrate surface at least one cavity spanned by the supporting structure; forming a diaphragm composed of at least one semiconductor material on or over the first sacrificial material layer of the supporting structure; depositing a layer stack comprising at least one sacrificial layer and at least one counter electrode; and exposing the diaphragm by at least partially removing at least the supporting structure and the at least one sacrificial layer.
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公开(公告)号：US11418885B2
公开(公告)日：2022-08-16
申请号：US17147310
申请日：2021-01-12
Applicant: Robert Bosch GmbH
Inventor： Heribert Weber , Andreas Scheurle , Christoph Hermes , Peter Schmollngruber , Thomas Friedrich
Abstract: A micromechanical component for a sensor device or microphone device. The component includes a diaphragm support structure with a diaphragm, a cavity formed in the diaphragm support structure and adjoined by a diaphragm inner side, and a separating trench structured through the surface of the diaphragm support structure and extends to the cavity and completely frames the diaphragm, and that is sealed off media-tight and/or air-tight using at least one separating trench closure material. An etching channel is formed in the diaphragm support structure, separately from the separating trench, and extends from its first etching channel end section to its second etching channel end section. The first etching channel end section opens into the cavity, and the second etching channel end section is sealed off media-tight and/or air-tight using at least one etching channel closure structure formed on an outer partial surface of the surface of the diaphragm support structure.
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公开(公告)号：US11407635B2
公开(公告)日：2022-08-09
申请号：US16625185
申请日：2018-06-14
Applicant: Robert Bosch GmbH
Inventor： Andreas Scheurle , Bernd Klein , Heinz Nedelmann , Heribert Weber , Isolde Simon , Martin Lapisa , Melissa Delheusy , Michael Knauss , Raschid Baraki , Vitaliy Kondrashov
Abstract: A bonding pad layer system is deposited on a semiconductor chip as a base, for example, a micromechanical semiconductor chip, in which at least one self-supporting dielectric membrane made up of dielectric layers, a platinum conductor track and a heater made of platinum is integrated. In the process, the deposition of a tantalum layer takes place first, upon that the deposition of a first platinum layer, upon that the deposition of a tantalum nitride layer, upon that the deposition of a second platinum layer and upon that the deposition of a gold layer, at least one bonding pad for connecting with a bonding wire being formed in the gold layer. The bonding pad is situated in the area of the contact hole on the semiconductor chip, in which a platinum conductor track leading to the heater is connected using a ring contact and/or is connected outside this area.
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公开(公告)号：US20210395074A1
公开(公告)日：2021-12-23
申请号：US17287389
申请日：2019-12-13
Applicant: Robert Bosch GmbH
Inventor： Hans Artmann , Christoph Hermes , Heribert Weber , Jochen Reinmuth , Peter Schmollngruber , Thomas Friedrich
Abstract: A micromechanical component, whose diaphragm is supported and has support structures on its inner diaphragm side. Each of the support structures includes a first and second edge element structure, and at least one intermediate element structure positioned between the first and second edge element structures. For each of the support structures, a plane of symmetry is definable, with respect to which at least the first edge element structure of the respective support structure and the second edge element structure of the respective support structure are specularly symmetric. In each of support structures, a first maximum dimension of its first edge element structure perpendicular to its plane of symmetry and a second maximum dimension of its second edge element structure perpendicular to its plane of symmetry are greater than the maximum dimension of its intermediate element structure perpendicular to its plane of symmetry.
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Patent Agency Ranking
公开(公告)号：US20210219058A1
公开(公告)日：2021-07-15
申请号：US17147310
申请日：2021-01-12
Applicant: Robert Bosch GmbH
Inventor： Heribert Weber , Andreas Scheurle , Christoph Hermes , Peter Schmollngruber , Thomas Friedrich
Abstract: A micromechanical component for a sensor device or microphone device. The component includes a diaphragm support structure with a diaphragm, a cavity formed in the diaphragm support structure and adjoined by a diaphragm inner side, and a separating trench structured through the surface of the diaphragm support structure and extends to the cavity and completely frames the diaphragm, and that is sealed off media-tight and/or air-tight using at least one separating trench closure material. An etching channel is formed in the diaphragm support structure, separately from the separating trench, and extends from its first etching channel end section to its second etching channel end section. The first etching channel end section opens into the cavity, and the second etching channel end section is sealed off media-tight and/or air-tight using at least one etching channel closure structure formed on an outer partial surface of the surface of the diaphragm support structure.
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公开(公告)号：US09567212B2
公开(公告)日：2017-02-14
申请号：US14061887
申请日：2013-10-24
Applicant: Robert Bosch GmbH
Inventor： Julian Gonska , Jochen Reinmuth , Kathrin Gutsche , Jens Frey , Heribert Weber
CPC classification number: B81C1/00285 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2207/096 , B81C2203/0118 , B81C2203/035
Abstract: A micromechanical component includes a first space in which a first sensor is situated and a second space in which a second sensor is situated, different pressures prevailing in the first and second spaces, one of the two spaces extending via a third space to a first lattice structure which is situated in an edge region of the component and is essentially hermetically sealed.
Abstract translation: 微机械部件包括第一传感器所在的第一空间和第二传感器所在的第二空间，在第一和第二空间中存在不同的压力，两个空间中的一个通过第三空间延伸到第一格子 结构位于组件的边缘区域中，并且基本上被气密地密封。
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公开(公告)号：US09518877B2
公开(公告)日：2016-12-13
申请号：US14478117
申请日：2014-09-05
Applicant: Robert Bosch GmbH
Inventor： Heribert Weber
CPC classification number: G01L1/148 , B81B3/007 , B81B2201/0235 , B81B2201/0264 , G01L9/0073 , H01L29/66007
Abstract: A micromechanical component for a capacitive sensor device includes first and second electrodes. The first electrode is at least partially formed from a first semiconductor layer and/or metal layer, and at least one inner side of the second electrode facing the first electrode is formed from a second semiconductor layer and/or metal layer. A cavity is between the first and second electrodes. Continuous recesses are structured into the inner side of the second electrode and sealed off with a closure layer. At least one reinforcing layer of the second electrode and at least one contact element which is electrically connected to the first electrode, to the layer of the second electrode which forms the inner side, to at least one printed conductor, and/or to a conductive substrate area, are formed from at least one epi-polysilicon layer. Also described is a micromechanical component manufacturing method for a capacitive sensor device.
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公开(公告)号：US20240383745A1
公开(公告)日：2024-11-21
申请号：US18692496
申请日：2022-08-08
Applicant: ROBERT BOSCH GMBH
Inventor： Heribert Weber , Peter Schmolingruber , Thomas Friedrich
Abstract: A micromechanical component. The micromechanical component includes: a substrate; at least one first oxide layer arranged on the substrate; and an etch stop layer arranged directly on the at least one first oxide layer; wherein a further wiring level is arranged on a bottom side of the etch stop layer.
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公开(公告)号：US11933689B2
公开(公告)日：2024-03-19
申请号：US17420953
申请日：2020-03-26
Applicant: Robert Bosch GmbH
Inventor： Heribert Weber , Christoph Hermes , Hans Artmann , Peter Schmollngruber , Thomas Friedrich , Volkmar Senz
CPC classification number: G01L9/12 , G01L19/0061 , G01L19/0618
Abstract: A sensor device having a first counter electrode extending under an intermediate carrier, and having a first distance between the intermediate carrier and the first counter electrode being modifiable by the pressure on the movable region, and the first counter electrode encompassing, under the intermediate carrier, at least one electrically separated region that is disposed below a spacing element and includes at least a lateral extent of the spacing element.
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