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公开(公告)号：US09970957B2
公开(公告)日：2018-05-15
申请号：US14925305
申请日：2015-10-28
Applicant: Robert Bosch GmbH
Inventor： Andreas Scheurle , Guenther-Nino-Carlo Ulrich
IPC: G01P15/125 , G01P15/08
CPC classification number: G01P15/125 , B81B2203/0181 , G01P2015/0831
Abstract: A rocker device for a micromechanical Z-sensor, including two rocker arms which are mounted around a torsion spring and which are asymmetric relative to the torsion spring; the rocker arms having first perforations; at least one of the rocker arms having at least one opening, a diameter of the first perforations being configured in a defined manner to be smaller than a diameter of the opening; and a cavity for connecting the first perforations to the at least one opening being formed in at least one of the rocker arms.
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公开(公告)号：US12151936B2
公开(公告)日：2024-11-26
申请号：US17776354
申请日：2021-01-12
Applicant: Robert Bosch GmbH
Inventor： Heribert Weber , Andreas Scheurle , Christoph Hermes , Peter Schmollngruber , Thomas Friedrich
Abstract: A micromechanical component for a sensor device or microphone device. The micromechanical component includes a diaphragm with a diaphragm inner side to which an electrode structure is directly or indirectly connected; and a cavity that is formed at least in a volume that is exposed by at least one removed area of at least one sacrificial layer. At least one residual area made of at least one electrically insulating sacrificial layer material of the at least one sacrificial layer is also present at the micromechanical component, and including at least one insulation area made of at least one electrically insulating material that is not the same as the electrically insulating sacrificial layer material. The electrode structure is electrically insulated from the diaphragm, and/or the at least one residual area of the at least one sacrificial layer is delimited from the cavity, using the at least one insulation area.
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公开(公告)号：US20230339745A1
公开(公告)日：2023-10-26
申请号：US17792171
申请日：2021-03-22
Applicant: Robert Bosch GmbH
Inventor： Heribert Weber , Andreas Scheurle , Christoph Hermes , Peter Schmollngruber , Thomas Friedrich
CPC classification number: B81C1/00523 , B81B3/0024
Abstract: A method for manufacturing a micromechanical sensor. The method includes: applying a first oxide sacrificial layer onto a substrate; removing material of the substrate through openings in the first oxide sacrificial layer; closing the openings in the first oxide sacrificial layer by applying a second oxide sacrificial layer; forming a sensing area on a carrier structure, the sensing area and the carrier structure being formed on the oxide sacrificial layers and the sensing area and/or the carrier structure being connected to the substrate via at least one attachment area, which forms a flexible structure; and at least partially removing the oxide sacrificial layers between the carrier structure and the substrate with the aid of an etching process.
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公开(公告)号：US20220081285A1
公开(公告)日：2022-03-17
申请号：US17446898
申请日：2021-09-03
Applicant: Robert Bosch GmbH
Inventor： Heribert Weber , Peter Schmollngruber , Thomas Friedrich , Andreas Scheurle , Joachim Fritz , Sophielouise Mach
Abstract: A production method for a micromechanical component for a sensor or microphone device. The method includes: patterning a plurality of first trenches through a substrate surface of a monocrystalline substrate made of at least one semiconductor material using anisotropic etching, covering the lateral walls of the plurality of first trenches with a passivation layer, while bottom areas of the plurality of first trenches are kept free or are freed of the passivation layer, etching at least one first cavity, into which the plurality of first trenches opens, into the monocrystalline substrate using an isotropic etching method, in which an etching medium of the isotropic etching method is conducted through the plurality of first trenches, and by covering the plurality of first trenches by epitaxially growing a monocrystalline sealing layer on the substrate surface of the monocrystalline substrate made of the at least one identical semiconductor material as the monocrystalline substrate.
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公开(公告)号：US20240369435A1
公开(公告)日：2024-11-07
申请号：US18630460
申请日：2024-04-09
Applicant: Robert Bosch GmbH
Inventor： Johannes Classen , Andreas Scheurle , Manuel Glas
IPC: G01L19/00 , G01L9/00 , G01P15/125
Abstract: A membrane sensor. The membrane sensor includes: a pressure sensor configured to generate a first sensor signal depending on a deflection of a pressure-loadable membrane; an acceleration sensor configured to generate a second sensor signal depending on an acceleration acting on a MEMS functional structure; and an evaluation circuit configured to compensate for a dependence of the first sensor signal on an acceleration force, in particular weight force, acting on the membrane, based on the second sensor signal. The pressure sensor and the acceleration sensor are stacked one above the other in a z direction. A method for generating a compensated sensor signal using such a membrane sensor is also described.
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Patent Agency Ranking
公开(公告)号：US20230304881A1
公开(公告)日：2023-09-28
申请号：US18044099
申请日：2021-10-06
Applicant: Robert Bosch GmbH
Inventor： Heribert Weber , Andreas Scheurle , Joachim Fritz , Peter Schmollngruber , Sophielouise Mach , Thomas Friedrich
CPC classification number: G01L9/0048 , B81B3/007 , B81B2201/0264 , B81B2203/0127 , B81B2203/0307
Abstract: A micromechanical component. The micromechanical component includes: a membrane; the membrane includes at least one reinforcement structure of a geometrically defined shape, which reinforces the membrane in a defined manner, in the region of at least one anchor structure and/or in the region of at least one connecting structure.
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公开(公告)号：US20220396477A1
公开(公告)日：2022-12-15
申请号：US17776354
申请日：2021-01-12
Applicant: Robert Bosch GmbH
Inventor： Heribert Weber , Andreas Scheurle , Christoph Hermes , Peter Schmollngruber , Thomas Friedrich
Abstract: A micromechanical component for a sensor device or microphone device. The micromechanical component includes a diaphragm with a diaphragm inner side to which an electrode structure is directly or indirectly connected; and a cavity that is formed at least in a volume that is exposed by at least one removed area of at least one sacrificial layer. At least one residual area made of at least one electrically insulating sacrificial layer material of the at least one sacrificial layer is also present at the micromechanical component, and including at least one insulation area made of at least one electrically insulating material that is not the same as the electrically insulating sacrificial layer material. The electrode structure is electrically insulated from the diaphragm, and/or the at least one residual area of the at least one sacrificial layer is delimited from the cavity, using the at least one insulation area.
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8.发明公开公开(公告)号：US20230357001A1
公开(公告)日：2023-11-09
申请号：US18246790
申请日：2021-09-30
Applicant: Robert Bosch GmbH
Inventor： Heribert Weber , Andreas Scheurle , Hans Artmann , Peter Schmollngruber , Thomas Friedrich , Uwe Schiller
CPC classification number: B81C1/00158 , B81B3/0021 , B81B2201/0257 , B81C2201/0105 , B81C2201/014 , B81C2203/038 , B81B2203/0307 , B81B2203/0315 , B81B2203/033 , B81B2203/0353
Abstract: A production method for a micromechanical component for a sensor device or microphone device. The method includes: forming a supporting structure composed of a first sacrificial material on a substrate surface of a substrate with a first sacrificial material layer, a plurality of etching holes structured through the first sacrificial material layer, and a plurality of supporting posts projecting into the substrate; etching into the substrate surface at least one cavity spanned by the supporting structure; forming a diaphragm composed of at least one semiconductor material on or over the first sacrificial material layer of the supporting structure; depositing a layer stack comprising at least one sacrificial layer and at least one counter electrode; and exposing the diaphragm by at least partially removing at least the supporting structure and the at least one sacrificial layer.
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公开(公告)号：US11418885B2
公开(公告)日：2022-08-16
申请号：US17147310
申请日：2021-01-12
Applicant: Robert Bosch GmbH
Inventor： Heribert Weber , Andreas Scheurle , Christoph Hermes , Peter Schmollngruber , Thomas Friedrich
Abstract: A micromechanical component for a sensor device or microphone device. The component includes a diaphragm support structure with a diaphragm, a cavity formed in the diaphragm support structure and adjoined by a diaphragm inner side, and a separating trench structured through the surface of the diaphragm support structure and extends to the cavity and completely frames the diaphragm, and that is sealed off media-tight and/or air-tight using at least one separating trench closure material. An etching channel is formed in the diaphragm support structure, separately from the separating trench, and extends from its first etching channel end section to its second etching channel end section. The first etching channel end section opens into the cavity, and the second etching channel end section is sealed off media-tight and/or air-tight using at least one etching channel closure structure formed on an outer partial surface of the surface of the diaphragm support structure.
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公开(公告)号：US11407635B2
公开(公告)日：2022-08-09
申请号：US16625185
申请日：2018-06-14
Applicant: Robert Bosch GmbH
Inventor： Andreas Scheurle , Bernd Klein , Heinz Nedelmann , Heribert Weber , Isolde Simon , Martin Lapisa , Melissa Delheusy , Michael Knauss , Raschid Baraki , Vitaliy Kondrashov
Abstract: A bonding pad layer system is deposited on a semiconductor chip as a base, for example, a micromechanical semiconductor chip, in which at least one self-supporting dielectric membrane made up of dielectric layers, a platinum conductor track and a heater made of platinum is integrated. In the process, the deposition of a tantalum layer takes place first, upon that the deposition of a first platinum layer, upon that the deposition of a tantalum nitride layer, upon that the deposition of a second platinum layer and upon that the deposition of a gold layer, at least one bonding pad for connecting with a bonding wire being formed in the gold layer. The bonding pad is situated in the area of the contact hole on the semiconductor chip, in which a platinum conductor track leading to the heater is connected using a ring contact and/or is connected outside this area.
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