Fiber array alignment substrate
    1.
    发明授权
    Fiber array alignment substrate 失效
    光纤阵列对准衬底

    公开(公告)号:US06754428B1

    公开(公告)日:2004-06-22

    申请号:US10098750

    申请日:2002-03-14

    IPC分类号: G02B600

    摘要: An apparatus includes a substrate having at least one opening through a top surface to a bottom surface, the substrate also having a first plurality of aligned grooves formed in the top surface and a plurality of fibers, where each of the plurality of fibers are positioned over the opening and in contact with the substrate within a corresponding one of the first plurality of grooves. In another aspect, a method of manipulating fibers includes placing a plurality of fibers on a substrate to extend over an opening formed through a top surface of the substrate to a bottom surface of the substrate, and flowing air through the opening to draw the plurality of fibers down towards the top surface of the substrate, and positioning each of said plurality of fibers in substantial alignment.

    摘要翻译: 一种装置包括具有通过顶表面至底表面的至少一个开口的衬底,该衬底还具有形成在顶表面中的第一多个对准的沟槽和多个纤维,其中多个纤维中的每一个定位在上面 所述开口并与所述第一多个凹槽中相应的一个槽内的所述基板接触。 在另一方面,一种操纵纤维的方法包括将多根纤维放置在基底上,以延伸穿过基底的顶表面形成的开口到基底的底表面,并使空气流过开口以吸引多个 纤维向下朝向衬底的顶表面,并且将所述多个纤维中的每一个定位成基本对准。

    Apparatus and method for indirect surface cleaning
    2.
    发明授权
    Apparatus and method for indirect surface cleaning 有权
    用于间接表面清洗的设备和方法

    公开(公告)号:US07993464B2

    公开(公告)日:2011-08-09

    申请号:US12055178

    申请日:2008-03-25

    IPC分类号: B08B7/00

    摘要: A method for laser surface cleaning of a target surface that has limited or no access to the environment directly above the surface to be cleaned. The method includes the ability to clean the surface with a reduced risk of substrate damage. The method includes direct laser excitation of a contaminated substrate surface and thermal transfer from the substrate to the contaminating particulate or contamination layer. The method also includes producing a thermally based removal and reducing a risk of substrate damage by keeping the temperature required to produce surface cleaning below the thermal damage level of the substrate material. In addition, the method includes reducing the risk of substrate damage by utilizing relatively long pulse-widths, providing for improved removal of small contaminants/particles, and directing the beam through a material disposed relative to the surface that is part of the substrates environmental enclosure.

    摘要翻译: 一种用于目标表面的激光表面清洁的方法,该方法在待清洁表面正上方有限制或无法进入环境。 该方法包括清洁表面的能力,降低了底物损伤的风险。 该方法包括对受污染的基底表面的直接激光激发和从基底到污染颗粒或污染层的热转移。 该方法还包括通过将产生表面清洁所需的温度保持在基底材料的热损伤水平以下来产生基于热的去除并降低基底损伤的风险。 此外,该方法包括通过利用相对较长的脉冲宽度降低衬底损伤的风险,提供改善的小污染物/颗粒的去除,以及引导光束穿过相对于作为衬底环境外壳的一部分的表面设置的材料 。

    APPARATUS AND METHOD FOR INDIRECT SURFACE CLEANING
    3.
    发明申请
    APPARATUS AND METHOD FOR INDIRECT SURFACE CLEANING 有权
    用于间接表面清洁的装置和方法

    公开(公告)号:US20090038637A1

    公开(公告)日:2009-02-12

    申请号:US12055178

    申请日:2008-03-25

    IPC分类号: B08B7/00

    摘要: A method for laser surface cleaning of a target surface that has limited or no access to the environment directly above the surface to be cleaned. The method includes the ability to clean the surface with a reduced risk of substrate damage. The method includes direct laser excitation of a contaminated substrate surface and thermal transfer from the substrate to the contaminating particulate or contamination layer. The method also includes producing a thermally based removal and reducing a risk of substrate damage by keeping the temperature required to produce surface cleaning below the thermal damage level of the substrate material. In addition, the method includes reducing the risk of substrate damage by utilizing relatively long pulse-widths, providing for improved removal of small contaminants/particles, and directing the beam through a material disposed relative to the surface that is part of the substrates environmental enclosure.

    摘要翻译: 一种用于目标表面的激光表面清洁的方法,该方法在待清洁表面正上方有限制或无法进入环境。 该方法包括清洁表面的能力,降低了底物损伤的风险。 该方法包括对受污染的基底表面的直接激光激发和从基底到污染颗粒或污染层的热转移。 该方法还包括通过将产生表面清洁所需的温度保持在基底材料的热损伤水平以下来产生基于热的去除并降低基底损伤的风险。 此外,该方法包括通过利用相对较长的脉冲宽度降低衬底损伤的风险,提供改善的小污染物/颗粒的去除,以及引导光束穿过相对于作为衬底环境外壳的一部分的表面设置的材料 。

    Wafer fabrication process
    5.
    发明授权
    Wafer fabrication process 有权
    晶圆制造工艺

    公开(公告)号:US08562749B2

    公开(公告)日:2013-10-22

    申请号:US13475997

    申请日:2012-05-20

    IPC分类号: B08B7/00

    摘要: A wafer fabrication process with removal of haze formation from a pellicalized photomask surface is provided. The wafer fabrication process includes pre-print wafer processing, wafer print processing using at least one photomask having a pellicle, photomask clean processing, wafer print processing using the photomask, and post-print wafer processing. The photomask clean processing step includes directing a laser through the pellicle towards an inorganic particle disposed on the photomask to remove the particle from the photomask by thermal decomposition.

    摘要翻译: 提供了从薄膜光掩模表面去除雾霾形成的晶片制造工艺。 晶片制造工艺包括预打印晶片处理,使用至少一个具有防护薄膜的光掩模,光掩模清洁处理,使用光掩模的晶片印刷处理和印后晶片处理的晶片印刷处理。 光掩模清洁处理步骤包括将激光穿过防护薄膜,朝向设置在光掩模上的无机颗粒,以通过热分解从光掩模中除去颗粒。

    Apparatus and method for indirect surface cleaning
    6.
    发明授权
    Apparatus and method for indirect surface cleaning 有权
    用于间接表面清洗的设备和方法

    公开(公告)号:US08293019B2

    公开(公告)日:2012-10-23

    申请号:US12277106

    申请日:2008-11-24

    IPC分类号: B08B7/00

    摘要: Methods for cleaning a surface of a substrate and for increasing the useable lifetime of a photomask substrate are provided. In one method, a substrate has at least one radiation-produced particle disposed thereon, and a laser that has a wavelength that substantially coincides with a high absorption coefficient of the substrate is directed towards the substrate. A thermal increase is generated in the substrate, and the radiation-produced particle is removed from the substrate by transferring thermal energy from the substrate to the radiation-produced particle until the radiation-produced particle decomposes.

    摘要翻译: 提供了清洁基板的表面和增加光掩模基板的使用寿命的方法。 在一种方法中,衬底具有设置在其上的至少一个辐射产生颗粒,并且具有基本上与衬底的高吸收系数一致的波长的激光器被引向衬底。 在衬底中产生热增加,并且通过将热能从衬底转移到辐射产生的颗粒直到辐射产生的颗粒分解,从衬底去除辐射产生的颗粒。

    Apparatus and Method for Indirect Surface Cleaning
    7.
    发明申请
    Apparatus and Method for Indirect Surface Cleaning 有权
    间接表面清洁的设备和方法

    公开(公告)号:US20090065024A1

    公开(公告)日:2009-03-12

    申请号:US12277106

    申请日:2008-11-24

    IPC分类号: B08B7/00

    摘要: Methods for cleaning a surface of a substrate and for increasing the useable lifetime of a photomask substrate are provided. In one method, a substrate has at least one radiation-produced particle disposed thereon, and a laser that has a wavelength that substantially coincides with a high absorption coefficient of the substrate is directed towards the substrate. A thermal increase is generated in the substrate, and the radiation-produced particle is removed from the substrate by transferring thermal energy from the substrate to the radiation-produced particle until the radiation-produced particle decomposes.

    摘要翻译: 提供了清洁基板的表面和增加光掩模基板的使用寿命的方法。 在一种方法中,衬底具有设置在其上的至少一个辐射产生颗粒,并且具有基本上与衬底的高吸收系数一致的波长的激光器被引向衬底。 在衬底中产生热增加,并且通过将热能从衬底转移到辐射产生的颗粒直到辐射产生的颗粒分解,从衬底去除辐射产生的颗粒。