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1.发明授权Cooling system employing a heat exchanger with phase change material, and method of operation thereof 失效采用具有相变材料的热交换器的冷却系统及其操作方法公开(公告)号：US07760502B2
公开(公告)日：2010-07-20
申请号：US11876849
申请日：2007-10-23
IPC分类号： H05K7/20
CPC分类号： F28D20/02 , F28D15/00 , F28D2020/0013 , F28F27/00 , F28F2255/02 , H05K7/20836 , Y02E60/145
摘要： A heat exchanger for use, e.g., in a rear door of a server rack in a computer room, made up of pipes clad with a layer of a phase change material, such as a paraffin, so that latent heat is absorbed in the conversion from the solid to the liquid state. Preferably, each pipe in turn is opened by a control valve and chilled coolant flows through the pipe until the phase change material reverts back to the solid state. Then, the control valve is again closed, and the phase change material is further heated by waste heat so that it is melted once more. Preferably, the control valve for only one pipe at a time is opened, so that latent heat is being absorbed by the phase change material around all pipes but one.
摘要翻译： 一种用于例如在计算机室中的服务器机架的后门中的热交换器，其由包含诸如石蜡的相变材料层的管道组成，使得潜热被从 固体液态。 优选地，每个管道依次由控制阀打开，并且冷却的冷却剂流过管道直到相变材料回复到固态。 然后，再次关闭控制阀，通过废热进一步加热相变材料，使其再次熔融。 优选地，一次仅一个管道的控制阀被打开，使得潜热被所有管道周围的相变材料吸收，但是一个。
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2.发明申请COOLING SYSTEM EMPLOYING A HEAT EXCHANGER WITH PHASE CHANGE MATERIAL, AND METHOD OF OPERATION THEREOF 失效使用相变材料的热交换器的冷却系统及其运行方法公开(公告)号：US20090103266A1
公开(公告)日：2009-04-23
申请号：US11876849
申请日：2007-10-23
CPC分类号： F28D20/02 , F28D15/00 , F28D2020/0013 , F28F27/00 , F28F2255/02 , H05K7/20836 , Y02E60/145
摘要： A heat exchanger for use, e.g., in a rear door of a server rack in a computer room, made up of pipes clad with a layer of a phase change material, such as a paraffin, so that latent heat is absorbed in the conversion from the solid to the liquid state. Preferably, each pipe in turn is opened by a control valve and chilled coolant flows through the pipe until the phase change material reverts back to the solid state. Then, the control valve is again closed, and the phase change material is further heated by waste heat so that it is melted once more. Preferably, the control valve for only one pipe at a time is opened, so that latent heat is being absorbed by the phase change material around all pipes but one.
摘要翻译： 一种用于例如在计算机室中的服务器机架的后门中的热交换器，其由包含诸如石蜡的相变材料层的管道组成，使得潜热被从 固体液态。 优选地，每个管道依次由控制阀打开，并且冷却的冷却剂流过管道直到相变材料回复到固态。 然后，再次关闭控制阀，通过废热进一步加热相变材料，使其再次熔融。 优选地，一次仅一个管道的控制阀被打开，使得潜热被所有管道周围的相变材料吸收，但是一个。
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3.发明申请Reduced stress relaxation in elastomeric compression structures adapted for use with electrical components 审中-公开适用于电气部件的弹性体压缩结构中的应力松弛减少公开(公告)号：US20070038807A1
公开(公告)日：2007-02-15
申请号：US11201967
申请日：2005-08-11
IPC分类号： G06F13/28
CPC分类号： H01R43/007 , H01R13/2414
摘要： Disclosed are enhanced methods and elastomeric compression structures utilizing embedded gas-filled gas-filled polymeric microspheres that are expanded in predefined conditions that are usable in electrical components for reducing stress relaxation.
摘要翻译： 公开了利用嵌入式气体填充气体填充的聚合物微球体的增强方法和弹性体压缩结构，其在可用于减少应力松弛的电气部件中的预定条件下膨胀。
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公开(公告)号：US20060170904A1
公开(公告)日：2006-08-03
申请号：US11050053
申请日：2005-02-03
IPC分类号： G01B11/16
CPC分类号： G01K5/52 , G01K5/72 , G01K11/32 , G05D23/1917 , G05D23/27
摘要： Disclosed are heat management method, and system, and computer program product that include at least one optical strain gauge that is mounted on a printed board in proximity to an object being monitored for temperature changes. Power for controlling heat to the object is modified in response to changes in the optical reference signal of the gauge, whereby such changes are correlated to the rate of strain change in the object as measured relative to predefined temperature changes of the object being monitored.
摘要翻译： 公开了热管理方法，系统和计算机程序产品，其包括安装在印刷板上的至少一个光学应变计，所述光学应变计附近被监测用于温度变化的物体。 响应于计量器的光学参考信号的变化来修改对对象的热控制的功率，由此这种变化与被测物体相对于被监视物体的预定温度变化测量的物体中的应变变化速率相关。
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公开(公告)号：US20060124705A1
公开(公告)日：2006-06-15
申请号：US11008769
申请日：2004-12-09
申请人： Joseph Kuczynski , Arvind Sinha , Timothy Tofil
发明人： Joseph Kuczynski , Arvind Sinha , Timothy Tofil
IPC分类号： B23K31/02
CPC分类号： H05K3/3494 , B23K1/005 , B23K2101/40 , H05K2201/10734 , H05K2203/0195 , H05K2203/0278 , H05K2203/081 , H05K2203/1572 , H05K2203/1581
摘要： A reflow heating system includes a housing assembly defining an internal thermal processing chamber that encapsulates at least a microelectronic assembly on a substrate. A first heating source is coupled to the housing assembly and within the thermal processing chamber. The first heating source is biased by a force-applying assembly into engagement with the microelectronic assembly. The first heating source comprises one or more heating platens adapted to engage the microelectronic assembly for applying direct heat sufficient to melt solder. A vacuum assembly is incorporated in the heating platen for allowing application of at least a partial vacuum to the microelectronic assembly to permit withdrawal thereof from the substrate. A radiant heating source is applied beneath the substrate and a directional heating source is applied to the microelectronic assembly.
摘要翻译： 回流加热系统包括限定内部热处理室的壳体组件，其将至少一个微电子组件封装在衬底上。 第一加热源联接到壳体组件并在热处理室内。 第一加热源由施力组件偏压成与微电子组件接合。 第一加热源包括适于接合微电子组件的一个或多个加热压板，用于施加足以熔化焊料的直接热。 真空组件被结合在加热台板中，以允许至少部分真空施加到微电子组件以允许从基板取出。 将辐射加热源施加在基底下方，并将定向加热源施加到微电子组件。
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公开(公告)号：US20050090130A1
公开(公告)日：2005-04-28
申请号：US10929474
申请日：2004-08-31
申请人： Joseph Kuczynski , Timothy Tofil , Paul Vermilyea
发明人： Joseph Kuczynski , Timothy Tofil , Paul Vermilyea
摘要： An electrical connector includes contact pads on a printed circuit board and contact members on a substrate. The contact members are pressed against the contact pads by a compression mat having compressor fingers. A clamping arrangement forces the compressor fingers against the substrate and thereby presses the contact members against the connector pads. The compression mat is made of elastomeric material, which has a tendency to relax and thus reduce the pressure after the clamping arrangement is tightened. A restrainer member is used to offset this tendency of the polymer to relax. The restrainer member has holes through which the compressor fingers of the compression mat extend.
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7.发明申请Land grid array (LGA) interposer with adhesive-retained contacts and method of manufacture 失效带有粘合剂保持触点的焊盘阵列（LGA）插入件和制造方法公开(公告)号：US20050208785A1
公开(公告)日：2005-09-22
申请号：US10803634
申请日：2004-03-18
申请人： Joseph Kuczynski , Timothy Tofil , Paul Vermilyea
发明人： Joseph Kuczynski , Timothy Tofil , Paul Vermilyea
CPC分类号： H01R13/2435 , H01R12/7076 , H05K7/1061
摘要： A novel Land Grid Array (LGA) interposer with adhesive-retained contacts and method of manufacture provide improved reliability in LGA mounting applications. A flexible adhesive is used to secure LGA interposer contacts to the walls of voids through an interposer frame. The contacts may be spring contacts or “fuzz button” type contacts. The use of a flexible adhesive provides for floating movement of the contacts within the voids so that thermal expansion stresses do not cause unbalanced compression of the contacts that could otherwise occur with a fixed attachment of the contacts to the frame. The resulting interposer can provide reliable electrical connection from LGA lands on an integrated circuit package to lands on an electronic assembly that is highly tolerant of thermal expansion differences, while eliminating migration of the contacts out of the voids that could otherwise cause shorting or disconnection.
摘要翻译： 具有粘合剂保持触点和制造方法的新型Land Grid Array（LGA）插入器在LGA安装应用中提供了更高的可靠性。 使用柔性粘合剂通过插入框架将LGA插入件触点固定在空隙壁上。 触点可以是弹簧触点或“模糊按钮”型触点。 柔性粘合剂的使用提供了触点在空隙内的浮动运动，使得热膨胀应力不会导致触头的不平衡压缩，否则可能会由触头固定在框架上。 所得到的内插器可以提供从集成电路封装上的LGA焊盘到位于电子组件上的高度耐热膨胀差异的可靠的电连接，同时消除触点脱离可能引起短路或断开的空隙之外的迁移。
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