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1.发明授权公开(公告)号：US08244081B2
公开(公告)日：2012-08-14
申请号：US12813334
申请日：2010-06-10
CPC分类号： G02B6/423 , G02B6/4232
摘要： In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.
摘要翻译： 在其中一个或多个光束路径将与相应数量的有源光学元件对准的光电组件中，柔性对准特征和固定对准特征之间的协作实现弹性平均，以便提供目标精度。 通过在柔性和固定对准特征的大量本地耦合上平均尺寸和位置误差，弹性平均提供与更昂贵和复杂的运动学对准技术相同的精度。
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2.发明申请公开(公告)号：US20100247034A1
公开(公告)日：2010-09-30
申请号：US12813334
申请日：2010-06-10
IPC分类号： G02B6/26
CPC分类号： G02B6/423 , G02B6/4232
摘要： In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.
摘要翻译： 在其中一个或多个光束路径将与相应数量的有源光学元件对准的光电组件中，柔性对准特征和固定对准特征之间的协作实现弹性平均，以便提供目标精度。 通过在柔性和固定对准特征的大量局部耦合上平均尺寸和位置误差，弹性平均提供与更昂贵和复杂的运动学对准技术相同的精度。
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3.发明授权公开(公告)号：US07454105B2
公开(公告)日：2008-11-18
申请号：US10994764
申请日：2004-11-22
CPC分类号： G02B6/423 , G02B6/4232
摘要： In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.
摘要翻译： 在其中一个或多个光束路径将与相应数量的有源光学元件对准的光电组件中，柔性对准特征和固定对准特征之间的协作实现弹性平均，以便提供目标精度。 通过在柔性和固定对准特征的大量局部耦合上平均尺寸和位置误差，弹性平均提供与更昂贵和复杂的运动学对准技术相同的精度。
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4.发明授权公开(公告)号：US07764853B2
公开(公告)日：2010-07-27
申请号：US12248102
申请日：2008-10-09
CPC分类号： G02B6/423 , G02B6/4232
摘要： In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.
摘要翻译： 在其中一个或多个光束路径将与相应数量的有源光学元件对准的光电组件中，柔性对准特征和固定对准特征之间的协作实现弹性平均，以便提供目标精度。 通过在柔性和固定对准特征的大量局部耦合上平均尺寸和位置误差，弹性平均提供与更昂贵和复杂的运动学对准技术相同的精度。
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5.发明申请公开(公告)号：US20090028506A1
公开(公告)日：2009-01-29
申请号：US12248102
申请日：2008-10-09
IPC分类号： G02B6/26
CPC分类号： G02B6/423 , G02B6/4232
摘要： In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.
摘要翻译： 在其中一个或多个光束路径将与相应数量的有源光学元件对准的光电组件中，柔性对准特征和固定对准特征之间的协作实现弹性平均，以便提供目标精度。 通过在柔性和固定对准特征的大量局部耦合上平均尺寸和位置误差，弹性平均提供与更昂贵和复杂的运动学对准技术相同的精度。
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公开(公告)号：US07520679B2
公开(公告)日：2009-04-21
申请号：US10665680
申请日：2003-09-19
申请人： Kendra Gallup , Brenton A. Baugh , Robert E. Wilson , James A. Matthews , Christopher L. Coleman , Tanya J. Snyder , James H. Williams
发明人： Kendra Gallup , Brenton A. Baugh , Robert E. Wilson , James A. Matthews , Christopher L. Coleman , Tanya J. Snyder , James H. Williams
CPC分类号： G02B6/4292 , G02B6/3849 , G02B6/4214 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2224/05599
摘要： An optoelectronic package or sub-assembly includes an edge-emitting laser and a reflector that directs a beam from the laser through a sub-mount. The sub-mount contains passive or active circuit elements that are electrically connected to the laser. The laser can be protected from the environment using either a cap in which the reflector is integrated or using an encapsulant encasing the laser. An alignment post that is sized to fit into a sleeve is mounted where the optical signal emerges from the sub-mount. Plugging the post into one end of the sleeve and inserting an optical fiber into the other end of the sleeve so that the optical fiber abuts the post will then align the optical fiber to receive the optical signal.
摘要翻译： 光电子封装或子组件包括边缘发射激光器和将来自激光束的光束引导通过子安装座的反射器。 子安装座包含电连接到激光器的无源或有源电路元件。 可以使用其中反射器集成的盖或使用封装激光的密封剂来保护激光器免受环境的影响。 尺寸适合装配到套筒中的对准柱安装在光信号从副底座出来的位置。 将柱塞到套筒的一端并将光纤插入套筒的另一端，使得光纤抵靠柱子然后对准光纤以接收光信号。
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7.发明授权Surface emitting laser package having integrated optical element and alignment post 有权具有集成光学元件和对准柱的表面发射激光器封装公开(公告)号：US06982437B2
公开(公告)日：2006-01-03
申请号：US10665662
申请日：2003-09-19
申请人： Kendra Gallup , Brenton A. Baugh , Robert E. Wilson , James A. Matthews , James H. Williams , Tak Kui Wang
发明人： Kendra Gallup , Brenton A. Baugh , Robert E. Wilson , James A. Matthews , James H. Williams , Tak Kui Wang
IPC分类号： H01L33/00 , H01L31/0232
CPC分类号： H01S5/02288 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/48091 , H01L2924/00014 , H01S5/02272 , H01S5/02284 , H01S5/183 , H01S5/423 , H01L2224/05599
摘要： A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.
摘要翻译： 用于表面发射激光器的封装将模具封装在子安装座和盖子之间。 可以使用允许将多个管芯附接到子安装晶片的晶片级封装工艺的晶片处理技术来形成子安装座和盖子，将分开的或作为盖子晶片的一部分的盖子附接到子安装晶片， 并切割结构以分离单个包装。 该盖包括透明板，该透明板可被加工成结合诸如透镜的光学元件。 安装在盖上的对准柱表示来自激光器的光信号的位置，并且紧密地配合在套筒的一端，而光纤连接器适合于另一端。
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公开(公告)号：US06955934B2
公开(公告)日：2005-10-18
申请号：US10938291
申请日：2004-09-09
IPC分类号： H01L31/02 , G02B6/36 , H01L21/00 , H01L23/02 , H01L27/14 , H01L29/84 , H01L31/0203 , H01L31/0232 , H01S5/022 , H04B10/02
CPC分类号： G02B6/4204 , G02B6/4201 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/48091 , H01L2924/00014 , H01L2924/01322 , H01L2924/10253 , H01L2924/00 , H01L2224/05599
摘要： A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor on the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.
摘要翻译： 用于光收发器的接收部分中的管芯的子组件或封装包括电连接到管芯的半导体副安装座和接合到副安装座上的帽，以将管芯密封在空腔中。 芯片可以倒装芯片接合到子座，并且可以包括在模具的背面制造的衍射光学元件。 诸如用于来自芯片上的光电传感器的输出信号的放大器的有源电路可以集成到子安装座中。 对于OSA，可以沿着光信号的路径将光柱附加到光传感器。 支柱有利于光纤的对准。 柔性或刚性电路可以焊接到子安装座的外部端子。
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公开(公告)号：US06900509B2
公开(公告)日：2005-05-31
申请号：US10665660
申请日：2003-09-19
IPC分类号： H01L31/02 , G02B6/36 , H01L21/00 , H01L23/02 , H01L27/14 , H01L29/84 , H01L31/0203 , H01L31/0232 , H01S5/022 , H04B10/02
CPC分类号： G02B6/4204 , G02B6/4201 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/48091 , H01L2924/00014 , H01L2924/01322 , H01L2924/10253 , H01L2924/00 , H01L2224/05599
摘要： A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor one the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.
摘要翻译： 用于光收发器的接收部分中的管芯的子组件或封装包括电连接到管芯的半导体副安装座和接合到副安装座上的帽，以将管芯密封在空腔中。 芯片可以倒装芯片接合到子座，并且可以包括在模具的背面制造的衍射光学元件。 诸如用于来自光电传感器的输出信号的放大器的有源电路可以将芯片集成到子安装件中。 对于OSA，可以沿着光信号的路径将光柱附加到光传感器。 支柱有利于光纤的对准。 柔性或刚性电路可以焊接到子安装座的外部端子。
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10.发明授权公开(公告)号：US07473039B2
公开(公告)日：2009-01-06
申请号：US11776002
申请日：2007-07-11
IPC分类号： G02B6/36
CPC分类号： H01R13/62938 , G02B6/4201 , G02B6/4261 , G02B6/4284 , G02B6/4292 , H01R13/62922 , H01R13/62977
摘要： An optoelectronic module is seated onto a substrate connector by guiding the module along an initial path portion that is misaligned with respect to the mating direction defined by the substrate connector and further includes providing a positive pressure drive along an end path portion with sufficient force to secure the optoelectronic module to the substrate connector. Where the mating is via a pin-and-socket arrangement, the positive pressure drive requires sufficient force to push the main body of the module to ensure entry of the pins into the sockets. Typically, there is a conversion from force applied in one direction to module motion in the orthogonal direction. However, a rocking cam embodiment is also described.
摘要翻译： 通过沿相对于由衬底连接器限定的配合方向不对准的初始路径部分引导模块而将光电子模块安置在衬底连接器上，并且还包括沿着端部路径部分提供具有足够力的正压力驱动以固定 将光电模块连接到基板连接器。 在配合通过插针和插座布置的情况下，正压驱动器需要足够的力来推动模块的主体，以确保销进入插座。 通常，存在从在一个方向上施加的力到正交方向上的模块运动的转换。 然而，还描述了摆动凸轮实施例。
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