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1.发明授权Surface emitting laser package having integrated optical element and alignment post 有权具有集成光学元件和对准柱的表面发射激光器封装公开(公告)号：US07358109B2
公开(公告)日：2008-04-15
申请号：US10993894
申请日：2004-11-18
申请人： Kendra Gallup , Brenton A. Baugh , Robert E. Wilson , James A. Matthews , James H. Williams , Tak Kui Wang
发明人： Kendra Gallup , Brenton A. Baugh , Robert E. Wilson , James A. Matthews , James H. Williams , Tak Kui Wang
IPC分类号： H01L21/00
CPC分类号： H01S5/02288 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/48091 , H01L2924/00014 , H01S5/02272 , H01S5/02284 , H01S5/183 , H01S5/423 , H01L2224/05599
摘要： A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.
摘要翻译： 用于表面发射激光器的封装将模具封装在子安装座和盖子之间。 可以使用允许将多个管芯附接到子安装晶片的晶片级封装工艺的晶片处理技术来形成子安装座和盖子，将分开的或作为盖子晶片的一部分的盖子附接到子安装晶片， 并切割结构以分离单个包装。 该盖包括透明板，该透明板可被加工成结合诸如透镜的光学元件。 安装在盖上的对准柱表示来自激光器的光信号的位置，并且紧密地配合在套筒的一端，而光纤连接器适合于另一端。
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2.发明授权Surface emitting laser package having integrated optical element and alignment post 有权具有集成光学元件和对准柱的表面发射激光器封装公开(公告)号：US06982437B2
公开(公告)日：2006-01-03
申请号：US10665662
申请日：2003-09-19
申请人： Kendra Gallup , Brenton A. Baugh , Robert E. Wilson , James A. Matthews , James H. Williams , Tak Kui Wang
发明人： Kendra Gallup , Brenton A. Baugh , Robert E. Wilson , James A. Matthews , James H. Williams , Tak Kui Wang
IPC分类号： H01L33/00 , H01L31/0232
CPC分类号： H01S5/02288 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/48091 , H01L2924/00014 , H01S5/02272 , H01S5/02284 , H01S5/183 , H01S5/423 , H01L2224/05599
摘要： A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.
摘要翻译： 用于表面发射激光器的封装将模具封装在子安装座和盖子之间。 可以使用允许将多个管芯附接到子安装晶片的晶片级封装工艺的晶片处理技术来形成子安装座和盖子，将分开的或作为盖子晶片的一部分的盖子附接到子安装晶片， 并切割结构以分离单个包装。 该盖包括透明板，该透明板可被加工成结合诸如透镜的光学元件。 安装在盖上的对准柱表示来自激光器的光信号的位置，并且紧密地配合在套筒的一端，而光纤连接器适合于另一端。
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公开(公告)号：US07520679B2
公开(公告)日：2009-04-21
申请号：US10665680
申请日：2003-09-19
申请人： Kendra Gallup , Brenton A. Baugh , Robert E. Wilson , James A. Matthews , Christopher L. Coleman , Tanya J. Snyder , James H. Williams
发明人： Kendra Gallup , Brenton A. Baugh , Robert E. Wilson , James A. Matthews , Christopher L. Coleman , Tanya J. Snyder , James H. Williams
CPC分类号： G02B6/4292 , G02B6/3849 , G02B6/4214 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2224/05599
摘要： An optoelectronic package or sub-assembly includes an edge-emitting laser and a reflector that directs a beam from the laser through a sub-mount. The sub-mount contains passive or active circuit elements that are electrically connected to the laser. The laser can be protected from the environment using either a cap in which the reflector is integrated or using an encapsulant encasing the laser. An alignment post that is sized to fit into a sleeve is mounted where the optical signal emerges from the sub-mount. Plugging the post into one end of the sleeve and inserting an optical fiber into the other end of the sleeve so that the optical fiber abuts the post will then align the optical fiber to receive the optical signal.
摘要翻译： 光电子封装或子组件包括边缘发射激光器和将来自激光束的光束引导通过子安装座的反射器。 子安装座包含电连接到激光器的无源或有源电路元件。 可以使用其中反射器集成的盖或使用封装激光的密封剂来保护激光器免受环境的影响。 尺寸适合装配到套筒中的对准柱安装在光信号从副底座出来的位置。 将柱塞到套筒的一端并将光纤插入套筒的另一端，使得光纤抵靠柱子然后对准光纤以接收光信号。
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公开(公告)号：US06955934B2
公开(公告)日：2005-10-18
申请号：US10938291
申请日：2004-09-09
IPC分类号： H01L31/02 , G02B6/36 , H01L21/00 , H01L23/02 , H01L27/14 , H01L29/84 , H01L31/0203 , H01L31/0232 , H01S5/022 , H04B10/02
CPC分类号： G02B6/4204 , G02B6/4201 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/48091 , H01L2924/00014 , H01L2924/01322 , H01L2924/10253 , H01L2924/00 , H01L2224/05599
摘要： A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor on the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.
摘要翻译： 用于光收发器的接收部分中的管芯的子组件或封装包括电连接到管芯的半导体副安装座和接合到副安装座上的帽，以将管芯密封在空腔中。 芯片可以倒装芯片接合到子座，并且可以包括在模具的背面制造的衍射光学元件。 诸如用于来自芯片上的光电传感器的输出信号的放大器的有源电路可以集成到子安装座中。 对于OSA，可以沿着光信号的路径将光柱附加到光传感器。 支柱有利于光纤的对准。 柔性或刚性电路可以焊接到子安装座的外部端子。
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公开(公告)号：US06900509B2
公开(公告)日：2005-05-31
申请号：US10665660
申请日：2003-09-19
IPC分类号： H01L31/02 , G02B6/36 , H01L21/00 , H01L23/02 , H01L27/14 , H01L29/84 , H01L31/0203 , H01L31/0232 , H01S5/022 , H04B10/02
CPC分类号： G02B6/4204 , G02B6/4201 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/48091 , H01L2924/00014 , H01L2924/01322 , H01L2924/10253 , H01L2924/00 , H01L2224/05599
摘要： A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor one the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.
摘要翻译： 用于光收发器的接收部分中的管芯的子组件或封装包括电连接到管芯的半导体副安装座和接合到副安装座上的帽，以将管芯密封在空腔中。 芯片可以倒装芯片接合到子座，并且可以包括在模具的背面制造的衍射光学元件。 诸如用于来自光电传感器的输出信号的放大器的有源电路可以将芯片集成到子安装件中。 对于OSA，可以沿着光信号的路径将光柱附加到光传感器。 支柱有利于光纤的对准。 柔性或刚性电路可以焊接到子安装座的外部端子。
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公开(公告)号：US07427524B2
公开(公告)日：2008-09-23
申请号：US11202596
申请日：2005-08-11
IPC分类号： H01L33/00
CPC分类号： H01S5/4031 , G02B6/4201 , G02B6/4204 , G02B6/4245 , G02B6/4251 , G02B6/426 , G02B6/4266 , G02B6/4267 , G02B6/4272 , G02B6/4274 , G02B6/428 , H01L2224/48465 , H01L2224/49175 , H01S5/005 , H01S5/02272 , H01S5/02276 , H01S5/02284 , H01L2924/00
摘要： Optoelectronic device packaging assemblies and methods of making the same are described. In one aspect, an optoelectronic device packaging assembly includes an electrical sub-mount that includes a mounting area, a device turning mount, and a light-emitting device. The device turning mount has a sub-mount mounting side that is attached to the mounting area of the electrical sub-mount and a device mounting side that has a device mounting area that is oriented in a plane that is substantially perpendicular to the mounting area of the electrical sub-mount. The light-emitting device includes one or more semiconductor layers that terminate at a common light-emitting surface and are operable to emit light from the light-emitting surface. The light-emitting device is attached to the device mounting area of the device turning mount with the light-emitting surface oriented in a plane that is substantially parallel to the mounting area of the electrical sub-mount.
摘要翻译： 描述了光电器件封装组件及其制造方法。 在一个方面，一种光电子器件封装组件包括一个包括安装区域的电子安装座，一个装置转动架和一个发光装置。 装置转向架具有安装在电子安装座的安装区域上的副安装安装侧和装置安装侧，该装置安装侧具有在与基本上垂直于 电子底座。 发光器件包括一个或多个半导体层，其终止于共同的发光表面并且可操作以从发光表面发射光。 发光装置被附接到装置转向架的装置安装区域，其中发光表面定向在基本上平行于电子安装座的安装区域的平面内。
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公开(公告)号：US06908232B2
公开(公告)日：2005-06-21
申请号：US10393809
申请日：2003-03-21
申请人： Laurence R. McColloch , James A. Matthews , Robert E. Wilson , Brenton A. Baugh , Tanya J. Snyder
发明人： Laurence R. McColloch , James A. Matthews , Robert E. Wilson , Brenton A. Baugh , Tanya J. Snyder
CPC分类号： G02B6/4246 , G02B6/3873 , G02B6/4249
摘要： Fiber optic connectors and methods of making the same are described. In one aspect, a fiber optic connector includes a support surface and at least one alignment pin. The support surface has at least one optical communication port. Each alignment pin has an elongated distal end and a flanged proximal end with a bottom surface that is fixedly attached to the support surface.
摘要翻译： 描述了光纤连接器及其制造方法。 在一个方面，光纤连接器包括支撑表面和至少一个对准销。 支撑表面具有至少一个光通信端口。 每个对准销具有细长的远端和带凸缘的近端，底端表面固定地附接到支撑表面。
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公开(公告)号：US07061025B2
公开(公告)日：2006-06-13
申请号：US10386185
申请日：2003-03-10
CPC分类号： H01S5/4031 , G02B6/4201 , G02B6/4204 , G02B6/4245 , G02B6/4251 , G02B6/426 , G02B6/4266 , G02B6/4267 , G02B6/4272 , G02B6/4274 , G02B6/428 , H01L2224/48465 , H01L2224/49175 , H01S5/005 , H01S5/02272 , H01S5/02276 , H01S5/02284 , H01L2924/00
摘要： Optoelectronic device packaging assemblies and methods of making the same are described. In one aspect, an optoelectronic device packaging assembly includes an electrical sub-mount that includes a mounting area, a device turning mount, and a light-emitting device. The device turning mount has a sub-mount mounting side that is attached to the mounting area of the electrical sub-mount and a device mounting side that has a device mounting area that is oriented in a plane that is substantially perpendicular to the mounting area of the electrical sub-mount. The light-emitting device includes one or more semiconductor layers that terminate at a common light-emitting surface and are operable to emit light from the light-emitting surface. The light-emitting device is attached to the device mounting area of the device turning mount with the light-emitting surface oriented in a plane that is substantially parallel to the mounting area of the electrical sub-mount.
摘要翻译： 描述了光电器件封装组件及其制造方法。 在一个方面，一种光电子器件封装组件包括一个包括安装区域的电子安装座，一个装置转动架和一个发光装置。 装置转向架具有安装在电子安装座的安装区域上的副安装安装侧和装置安装侧，该装置安装侧具有在与基本上垂直于 电子底座。 发光器件包括一个或多个半导体层，其终止于共同的发光表面并且可操作以从发光表面发射光。 发光装置被附接到装置转向架的装置安装区域，其中发光表面定向在基本上平行于电子安装座的安装区域的平面内。
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公开(公告)号：US5691051A
公开(公告)日：1997-11-25
申请号：US551423
申请日：1995-11-01
申请人： James A. Matthews
发明人： James A. Matthews
CPC分类号： B32B29/02 , C09J7/04 , C09J2400/263 , Y10T428/19 , Y10T428/192 , Y10T428/24802 , Y10T428/28 , Y10T428/2848 , Y10T428/31504 , Y10T428/31855 , Y10T442/3016
摘要： A heat bond seaming tape has a base formed of a strip of paper or a paper-like material and an overlying strip of an open mesh material. A plurality of transversely spaced, longitudinally extending beads of a hot melt thermoplastic adhesive material is placed on a top surface of the mesh for adhering the tape to the backs of adjacent carpet edges. A strip of a rigid thermoplastic material is sandwiched between the base strip and the strip of open mesh and extends longitudinally along the center of the strip and extends transversely across the carpet seam to prevent seam buckling. The plastic strip is formed by a plurality of separate or flexibly connected hard plastic members to enable the tape to be formed into a roll for transportation and storage. The invention also relates to the method of forming the improved heat bond seaming tape.
摘要翻译： 热粘合缝合带具有由纸条或纸状材料形成的基底和开放的网状材料的覆盖带。 多个横向间隔开的纵向延伸的热熔性热塑性粘合剂材料的珠粒被放置在网的顶表面上，用于将带粘附到相邻地毯边缘的后部。 刚性热塑性材料条被夹在基底条和开放网状物条之间，并沿着条带的中心纵向延伸，横向穿过地毯接缝，以防止接缝弯曲。 塑料条由多个单独或柔性连接的硬塑料构件形成，以使带能够形成为用于运输和储存的卷。 本发明还涉及形成改进的热粘合缝合带的方法。
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10.发明授权
公开(公告)号：US5386140A
公开(公告)日：1995-01-31
申请号：US114980
申请日：1993-08-31
申请人： James A. Matthews
发明人： James A. Matthews
IPC分类号： H01L29/73 , H01L21/331 , H01L29/10 , H01L29/36 , H01L29/732 , H01L29/70
CPC分类号： H01L29/66272 , H01L29/1004 , H01L29/36 , H01L29/732 , Y10S148/01
摘要： A bipolar transistor having an emitter, a base, and a collector includes an intrinsic base region having narrow side areas and a wider central area. The side areas are located adjacent to the extrinsic base region, while the central area is disposed underneath the emitter. The lateral doping profile of the base is tailored so that the doping concentrations in the extrinsic region and the central area are relatively high compared to the doping concentration of the narrow side areas of the intrinsic base. The combination of the narrow side areas and the lateral base doping profile constrains the depletion region within the base thereby lowering punch-through voltage of the transistor without loss of beta.
摘要翻译： 具有发射极，基极和集电极的双极晶体管包括具有窄侧面区域和较宽中心区域的本征基极区域。 侧面区域位于外部基极区域附近，而中央区域设置在发射体下方。 定制基极的横向掺杂分布，使得与本征基极的窄边区域的掺杂浓度相比，外在区域和中心区域中的掺杂浓度相对较高。 窄边区域和横向基极掺杂曲线的组合限制了基极内的耗尽区域，从而降低晶体管的穿通电压而不损失β。
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