摘要:
In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.
摘要:
An optoelectronic module is seated onto a substrate connector by guiding the module along an initial path portion that is misaligned with respect to the mating direction defined by the substrate connector and further includes providing a positive pressure drive along an end path portion with sufficient force to secure the optoelectronic module to the substrate connector. Where the mating is via a pin-and-socket arrangement, the positive pressure drive requires sufficient force to push the main body of the module to ensure entry of the pins into the sockets. Typically, there is a conversion from force applied in one direction to module motion in the orthogonal direction. However, a rocking cam embodiment is also described.
摘要:
A process for improving uniformity across the surface of a substrate during a plasma process such as plasma etching. A conductive plane is formed at the back surface of the substrate. A plasma process is then performed to the front surface of the substrate. The conductive plane may then be removed upon completion of the plasma process and before final processing steps.
摘要:
A process for preparing a urea-formaldehyde base resin having a F/U molar ratio of 1.0:1-1.2:1, that is hydrolytically stable, which comprises adjusting a formaldehyde solution to a pH of 0.5-2.5, slowly charging urea to said formaldehyde solution while maintaining the temperature at 40.degree.-70.degree. C., neutralizing the reaction mixture after obtaining a Gardner viscosity in the range of T+-V+, then adding the final charge of urea and permitting equilibration.
摘要:
This foaming system includes a foaming agent solution and a resin solution. The foaming agent includes the relative amounts of 15 to 30 parts by weight of a salt of an alkyl diphenyl oxide sulfonate, 10 to 25 parts of 85% phosphoric acid and 15 to 25 parts urea, all in an aqueous solution. The resin solution includes a resin prepared by reacting 1 to 2.4 mols of formaldehyde per 1 mol of urea, 6.5 to 500 mmols polyethylene glycol as foam charring agent, 0.3 to 1.2 mmols of calcium carbonate as uniform foam cell size agent, 3 to 310 mmols of dicyandiamide as foam hydrolysis resistance agent, 2 to 30 mmols of sodium bromide as foam aging agent, and sufficient water to make a 35 to 45% solution. In preparing the foam, one part by weight of the foaming agent solution of about 5% solids concentration is aerated and then 1.0 to 1.5 parts by weight of the resin solution is sprayed thereon to obtain foam with an average linear shrinkage of about 0.25%.
摘要:
This foaming system includes a foaming agent solution and a resin solution. The foaming agent includes the relative amounts of 15 to 30 parts by weight of a salt of an alkyl diphenyl oxide sulfonate, 10 to 25 parts of 85% phosphoric acid and 15 to 25 parts urea, all in an aqueous solution. The resin solution includes a resin prepared by reacting 1 to 2.4 mols of formaldehyde per 1 mol of urea, 6.5 to 500 mmols polyethylene glycol as foam charring agent, 0.3 to 1.2 mmols of calcium carbonate as uniform foam cell size agent, 3 to 310 mmols of dicyandiamide as foam hydrolysis resistance agent, 2 to 30 mmols of sodium bromide as foam aging agent, and sufficient water to make a 35 to 45% solution. In preparing the foam, one part by weight of the foaming agent solution of about 5% solids concentration is aerated and then 1.0 to 1.5 parts by weight of the resin solution is sprayed thereon to obtain foam with an average linear shrinkage of about 0.25%.
摘要:
In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.
摘要:
In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.
摘要:
A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.
摘要:
A weighted insole with a pair of flat weights encapsulated inside a flexible material which is formed into an insole for placement in a shoe. A first weight is encapsulated in front, and a second weight is encapsulated behind, the ball-of-the-foot area. The second weight additionally has cutouts at the arch and heel areas of the foot. These unweighted areas throughout their thickness include insole material which provides extra comfort and cushioning where the user typically places more weight on the foot. The front and back weighted construction additionally allows for flexibility of the insole at the ball area. A pattern of nodes is projected from the bottom of the insole to frictionally hold the insole in place in the shoe.