公开(公告)号：US4681654A

公开(公告)日：1987-07-21

申请号：US865316

申请日：1986-05-21

申请人： Robert J. Clementi ,  Charles E. Gazdik ,  William Lafer ,  Roy L. Lovesky ,  Donald G. McBride ,  Joel V. Munson ,  Eugene P. Skarvinko

发明人： Robert J. Clementi ,  Charles E. Gazdik ,  William Lafer ,  Roy L. Lovesky ,  Donald G. McBride ,  Joel V. Munson ,  Eugene P. Skarvinko

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K3/00 ,  H05K3/38 ,  C23F1/02 ,  B29C37/00 ,  B44C1/22 ,  C03C15/00

CPC分类号： H01L21/4846 ,  H01L23/4985 ,  H01L23/5387 ,  H05K1/0271 ,  H05K3/0097 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0317 ,  H05K2203/0156 ,  H05K2203/066 ,  H05K2203/1152 ,  H05K2203/1545 ,  H05K3/002 ,  H05K3/007 ,  H05K3/388 ,  Y10T156/1057 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T428/12396

摘要： A method is disclosed for making circuitized, flexible film substrates in a continuous tape format using a transfer technique. The tape is made with window-like openings having a relatively thin layer of polyimide spanning the openings. The relatively thin layer of polyimide is transferred to the tape from a metal carrier foil, preferably by using a special adhesive system. After the polyimide is transferred to the tape, the polyimide spanning the window-like openings in the tape is circuitized to form individual, circuitized, flexible film substrates which may be handled in the tape format for further processing. Preferably, the tape includes perforations for engaging sprockets of automated manufacturing equipment, or the like.

摘要翻译： 公开了一种使用转移技术制造连续磁带格式的电路化柔性薄膜基片的方法。 胶带由具有相对薄的聚酰亚胺层横跨开口的窗口状开口制成。 优选通过使用特殊的粘合剂系统将相对薄的聚酰亚胺层从金属载体箔转移到带上。 在将聚酰亚胺转移到带之后，跨过带中的窗口状开口的聚酰亚胺被电路化以形成可以以带格式处理以进一步处理的单独的，电路化的柔性膜基底。 优选地，带包括用于接合自动化制造设备的链轮等的穿孔。

公开(公告)号：US5145553A

公开(公告)日：1992-09-08

申请号：US696435

申请日：1991-05-06

申请人： Stanley M. Albrechta ,  Robert J. Clementi ,  Thomas E. Kindl

发明人： Stanley M. Albrechta ,  Robert J. Clementi ,  Thomas E. Kindl

IPC分类号： H01B5/02 ,  C23F1/28 ,  G11B5/48 ,  H01B7/04 ,  H05K1/00 ,  H05K1/05 ,  H05K3/06 ,  H05K3/44

CPC分类号： C23F1/28 ,  G11B5/484 ,  H05K1/056 ,  H05K3/067 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2203/0323 ,  H05K2203/1572

摘要： A method of making a flexible circuit member including a stainless steel base member, a dielectric layer (polyimide) on the base member and a conductive circuit (copper) on the dielectric. The circuit member may be first formed as a laminate structure wherein the dielectric polyimide is coated on the stainless steel and appropriately treated (cured). The copper circuitry is then formed utilizing resist application and exposure techniques. Significantly, the copper-containing circuitry and stainless steel base member are simultaneously etched using a cupric chloride etchant solution to effectively remove desired portions of these metallic materials and produce the desired flexible circuit member.

摘要翻译： 一种制造柔性电路构件的方法，该电路构件包括不锈钢基底构件，在基底构件上的介电层（聚酰亚胺）和电介质上的导电电路（铜）。 电路构件可以首先形成为层压结构，其中电介质聚酰亚胺涂覆在不锈钢上并进行适当处理（固化）。 然后利用抗蚀剂应用和曝光技术形成铜电路。 重要的是，使用氯化铜蚀刻剂溶液同时蚀刻含铜电路和不锈钢基底构件，以有效地去除这些金属材料的所需部分并产生所需的柔性电路构件。