摘要:
A ferroelectric memory array (20) monolithically integrated with a field programmable gate array (32) into a semiconductor circuit (10). The ferroelectric memory array (20) is suitable for a semiconductor manufacturer to program the configuration data that is used in the field programmable gate array (32) prior to shipment and installation in an electronic system. The memory array (20) provides the data that configures the field programmable gate array (32) for functionality of the Configurable Logic Blocks (CLBs) in the field programmable gate array (32). Should the field programmable gate array (32) circuit lose power, the non-volatile memory array (20) provides a shift register (26) with the data to reconfigure the field programmable gate array (32).
摘要:
Ferroelectric transistors are combined with MOSFETs to perform logic functions. The logic functions include a non-volatile ferroelectric latch (30), a clocked non-volatile ferroelectric latch (50), a programmable switch (60), an edge-triggered complementary flip-flop (78), a tri-state logic circuit (80), a ferroelectric logic NAND-gate (100), a clocked ferroelectric logic NAND-gate (140), and a programmable logic function (150). The programmable logic function (150) includes a programming terminal (156) to select between a NOR-gate function and a NAND-gate function.
摘要:
A switch network (22) in a Field Programmable Gate Array (FPGA) which operates as a combination of a programming transistor (34) and a ferroelectric transistor (32). The programming transistor (34) is selected to transfer a polarizing voltage to a gate terminal of the ferroelectric transistor (32) for programming the ferroelectric transistor (32) in an on-state. The ferroelectric transistor (32) functions as a nonvolatile latch and pass device to provide the electrical interconnect path that links multiple Configurable Logic Blocks (CLBs). The programming transistor (34) is selected to transfer a depolarizing voltage to the gate terminal of the ferroelectric transistor (32) for programming the ferroelectric transistor (32) in an off-state.
摘要:
A thermoelectric power generator and method of generating thermoelectric power in a steam power cycle utilizing latent steam heat including a condenser, a heat source, such as steam, and at least one thermoelectric module. The condenser includes a plurality of condenser tubes each having included therein a heat extractor. The heat source is in communication with the condenser and is characterized as providing thermal energy to the condenser. The at least one thermoelectric module, including a plurality of thermoelectric elements, is positioned in communication with at least one of the plurality of condenser tubes so that thermal energy flows through the thermoelectric elements thereby generating electrical power.
摘要:
A ferroelectric semiconductor device (10) and a method of manufacturing the ferroelectric semiconductor device (10). The ferroelectric semiconductor device (10) is manufactured from a substrate (11) that has a layer (14) of ferroelectric material sandwiched between a substrate (13) and a layer (16) of silicon. A gate structure (24) is formed on the layer (16) of silicon. A source region is formed in a portion of the layer (16) of silicon adjacent one side of the gate structure (24) and a drain region is formed in a portion of the layer (16) of silicon adjacent an opposing side of the gate structure (24).
摘要:
A layered bismuth ferroelectric structure (12) and a method for forming the bismuth layered ferroelectric structure (12). A monolayer (12A) of bismuth is formed in intimate contact with a single crystalline semiconductor material (11). A layered ferroelectric material (12) is grown on the monolayer (12A) of bismuth such that the monolayer (12A) of bismuth becomes a part of the layered ferroelectric material (12). The ferroelectric material (12) forms a layered ferroelectric material which is not a pure perovskite, wherein the crystalline structure at the interface between the single crystalline semiconductor material (11) and the monolayer (12A) of bismuth are substantially the same.
摘要:
A method of forming a thin silicide layer on a silicon substrate 12 including heating the surface of the substrate to a temperature of approximately 500.degree. C. to 750.degree. C. and directing an atomic beam of silicon 18 and an atomic beam of an alkaline-earth metal 20 at the heated surface of the substrate in a molecular beam epitaxy chamber at a pressure in a range below 10.sup.-9 Torr. The silicon to alkaline-earth metal flux ratio is kept constant (e.g. Si/Ba flux ratio is kept at approximately 2:1) so as to form a thin alkaline-earth metal silicide layer (e.g. BaSi.sub.2) on the surface of the substrate. The thickness is determined by monitoring in situ the surface of the single crystal silicide layer with RHEED and terminating the atomic beam when the silicide layer is a selected submonolayer to one monolayer thick.
摘要:
A layered bismuth ferroelectric structure (12) and a method for forming the bismuth layered ferroelectric structure (12). A monolayer (12A) of bismuth is formed in intimate contact with a single crystalline semiconductor material (11). A layered ferroelectric material (12) is grown on the monolayer (12A) of bismuth such that the monolayer (12A) of bismuth becomes a part of the layered ferroelectric material (12). The ferroelectric material (12) forms a layered ferroelectric material which is not a pure perovskite, wherein the crystalline structure at the interface between the single crystalline semiconductor material (11) and the monolayer (12A) of bismuth are substantially the same.
摘要:
A ferroelectric semiconductor device (10) and a method of manufacturing the ferroelectric semiconductor device (10). The ferroelectric semiconductor device (10) is manufactured from a substrate (11) that has a layer (14) of ferroelectric material sandwiched between a substrate (13) and a layer (16) of silicon. A gate structure (24) is formed on the layer (16) of silicon. A source region is formed in a portion of the layer (16) of silicon adjacent one side of the gate structure (24) and a drain region is formed in a portion of the layer (16) of silicon adjacent an opposing side of the gate structure (24).
摘要:
A method of fabricating a field effect transistor including doping a continuous blanket layer in a semiconductor substrate structure adjacent the surface to include a source area and a drain area spaced from the source area. A high dielectric constant insulator layer is positioned on the surface of the semiconductor substrate structure overlying the continuous blanket layer to define a gate area between the source and drain areas. A gate contact on the insulator layer is selected to provide a work function difference that depletes the doped layer beneath the insulator layer. Further, the doped layer depth and dosage are designed such that the doped layer is depleted beneath the insulator layer by the selected work function difference of the gate contact and the semiconductor substrate.