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    CMOS-compatible MEM switches and method of making
    3.
    发明授权
    CMOS-compatible MEM switches and method of making 失效
    CMOS兼容MEM开关及制作方法

    公开(公告)号：US06396368B1

    公开(公告)日：2002-05-28

    申请号：US09438085

    申请日：1999-11-10

    申请人： Lap-Wai Chow ,  Tsung-Yuan Hsu ,  Daniel J. Hyman ,  Robert Y. Loo ,  Paul Ouyang ,  James H. Schaffner ,  Adele Schmitz ,  Robert N. Schwartz

    发明人： Lap-Wai Chow ,  Tsung-Yuan Hsu ,  Daniel J. Hyman ,  Robert Y. Loo ,  Paul Ouyang ,  James H. Schaffner ,  Adele Schmitz ,  Robert N. Schwartz

    IPC分类号： H01P110

    CPC分类号： B81C1/00246 ,  B81B2201/014 ,  B81C2201/014 ,  B81C2203/0714 ,  B81C2203/0735 ,  H01H1/58 ,  H01H59/0009 ,  H01H2001/0057

    摘要： A microelectromechanical (MEM) switch is fabricated inexpensively by using processing steps which are standard for fabricating multiple metal layer integrated circuits, such as CMOS. The exact steps may be adjusted to be compatible with the process of a particular foundry, resulting in a device which is both low cost and readily integrable with other circuits. The processing steps include making contacts for the MEM switch from metal plugs which are ordinarily used as vias to connect metal layers which are separated by a dielectric layer. Such contact vias are formed on either side of a sacrificial metallization area, and then the interconnect metallization is removed from between the contact vias, leaving them separated. Dielectric surrounding the contacts is etched back so that they protrude toward each other. Thus, when the contacts are moved toward each other by actuating the MEM switch, they connect firmly without obstruction. Tungsten is typically used to form vias in CMOS processes, and it makes an excellent contact material, but other via metals may also be employed as contacts. Interconnect metallization may be employed for other structural and interconnect needs of the MEM switch, and is preferably standard for the foundry and process used. Various metals and dielectric materials may be used to create the switches, but in a preferred embodiment the interconnect metal layers are aluminum and the dielectric material is SiO2, materials which are fully compatible with standard four-layer CMOS fabrication processes.

    摘要翻译： 通过使用标准制造多个金属层集成电路（如CMOS）的处理步骤，廉价地制造了微机电（MEM）开关。 可以将精确的步骤调整为与特定代工厂的过程兼容，从而导致低成本且易于与其他电路集成的装置。 处理步骤包括通过通常用作通孔的金属插头进行MEM开关的接触，以连接由电介质层分离的金属层。 这种接触通孔形成在牺牲金属化区域的任一侧，然后从接触通孔之间移除互连金属化，使它们分离。 围绕触点的介质被回蚀，使得它们彼此突出。 因此，当通过致动MEM开关使触点彼此移动时，它们牢固地连接而不阻塞。 钨通常用于在CMOS工艺中形成通孔，并且它制成优良的接触材料，但也可以使用其它通孔金属作为接触。 互连金属化可以用于MEM开关的其他结构和互连需求，并且优选地是用于所使用的铸造和工艺的标准。 可以使用各种金属和介电材料来制造开关，但是在优选实施例中，互连金属层是铝，并且介电材料是SiO 2，与标准四层CMOS制造工艺完全兼容的材料。

    CMOS-compatible MEM switches and method of making
    4.
    发明授权
    CMOS-compatible MEM switches and method of making 失效

    公开(公告)号：US06667245B2

    公开(公告)日：2003-12-23

    申请号：US10016894

    申请日：2001-12-13

    申请人： Lap-Wai Chow ,  Tsung-Yuan Hsu ,  Daniel J. Hyman ,  Robert Y. Loo ,  Paul Ouyang ,  James H. Schaffner ,  Adele Schmitz ,  Robert N. Schwartz

    发明人： Lap-Wai Chow ,  Tsung-Yuan Hsu ,  Daniel J. Hyman ,  Robert Y. Loo ,  Paul Ouyang ,  James H. Schaffner ,  Adele Schmitz ,  Robert N. Schwartz

    IPC分类号： H01L2100

    CPC分类号： B81C1/00246 ,  B81B2201/014 ,  B81C2201/014 ,  B81C2203/0714 ,  B81C2203/0735 ,  H01H1/58 ,  H01H59/0009 ,  H01H2001/0057

    摘要： A microelectromechanical (MEM) switch is fabricated inexpensively by using processing steps which are standard for fabricating multiple metal layer integrated circuits, such as CMOS. The exact steps may be adjusted to be compatible with the process of a particular foundry, resulting in a device which is both low cost and readily integrable with other circuits. The processing steps include making contacts for the MEM switch from metal plugs which are ordinarily used as vias to connect metal layers which are separated by a dielectric layer. Such contact vias are formed on either side of a sacrificial metallization area, and then the interconnect metallization is removed from between the contact vias, leaving them separated. Dielectric surrounding the contacts is etched back so that they protrude toward each other. Thus, when the contacts are moved toward each other by actuating the MEM switch, they connect firmly without obstruction. Tungsten is typically used to form vias in CMOS processes, and it makes an excellent contact material, but other via metals may also be employed as contacts. Interconnect metallization may be employed for other structural and interconnect needs of the MEM switch, and is preferably standard for the foundry and process used. Various metals and dielectric materials may be used to create the switches, but in a preferred embodiment the interconnect metal layers are aluminum and the dielectric material is SiO2, materials which are fully compatible with standard four-layer CMOS fabrication processes.

    Torsion spring for electro-mechanical switches and a cantilever-type RF micro-electromechanical switch incorporating the torsion spring
    9.
    发明授权
    Torsion spring for electro-mechanical switches and a cantilever-type RF micro-electromechanical switch incorporating the torsion spring 失效
    用于机电开关的扭转弹簧和结合扭簧的悬臂式RF微机电开关

    公开(公告)号：US06768403B2

    公开(公告)日：2004-07-27

    申请号：US10097632

    申请日：2002-03-12

    申请人： Tsung-Yuan Hsu ,  Robert Loo ,  Adele Schmitz

    发明人： Tsung-Yuan Hsu ,  Robert Loo ,  Adele Schmitz

    IPC分类号： H01H5122

    CPC分类号： H01H59/0009 ,  H01G5/18 ,  H01G5/40 ,  H01H1/06 ,  H01H1/20 ,  H01P1/127

    摘要： A torsion spring for an electro-mechanical switch is presented. The torsion spring comprises a set of tines including at least one tine extending from the free end of the armature of a switch. A terminus portion is rotatably suspended between the tines, and includes a conducting transmission line, at least a portion of which is exposed for electrical contact. The conducting transmission line has a length selected such that the exposed portion of the transmission line forms a circuit between the input and output of the micro-electro-mechanical switch when the micro-electro-mechanical switch is urged into a closed position, with the terminus portion rotating via the tines to form a conformal connection between the exposed portion of the conducting transmission line and the input and output of the switch, thus optimizing the electrical flow therebetween. The switch is also applied to MEMS devices.

    摘要翻译： 提出了一种用于机电开关的扭簧。 扭转弹簧包括一组尖齿，其包括从开关的电枢的自由端延伸的至少一个齿。 末端部分可旋转地悬挂在尖齿之间，并且包括导电传输线，其至少一部分暴露以进行电接触。 导电传输线具有选定的长度，使得当微机电开关被迫进入关闭位置时，传输线的暴露部分形成微机电开关的输入和输出之间的电路， 通过齿旋转，以在导电传输线的暴露部分与开关的输入和输出之间形成共形连接，从而优化其间的电流。 该开关也适用于MEMS器件。

    Micro-electro-mechanical switch
    10.
    发明授权
    Micro-electro-mechanical switch 失效
    微机电开关

    公开(公告)号：US07405641B1

    公开(公告)日：2008-07-29

    申请号：US11112925

    申请日：2005-04-21

    申请人： Tsung-Yuan Hsu ,  Adele Schmitz ,  David Chang ,  Robert Loo

    发明人： Tsung-Yuan Hsu ,  Adele Schmitz ,  David Chang ,  Robert Loo

    IPC分类号： H01H51/22

    CPC分类号： H01H59/0009

    摘要： A micro-electro-mechanical switch is described. The switch comprises a substrate, with a signal transmission portion and an activation portion attached with the substrate. The activation portion includes an armature activation electrode positioned above a substrate activation electrode. The signal transmission portion includes a metal contact extending from a conducting transmission line and through a bottom insulating layer of the signal transmission portion, thereby being exposed for electrical contact. A mechanical linkage connects the activation portion with the signal transmission portion so that the activation portion and the signal transmission portion move in concert. When an activation signal is applied along the activation portion, both the activation portion and the signal transmission portion are drawn toward the substrate to a substantially closed position, where the metal contact of the signal transmission portion electrically contacts a signal transmission electrode.

    摘要翻译： 描述了微机电开关。 开关包括具有信号传输部分和与基板连接的激活部分的基板。 激活部分包括位于基板激活电极上方的电枢激活电极。 信号传输部分包括从导电传输线延伸并通过信号传输部分的底部绝缘层的金属接触，从而暴露于电接触。 机械连杆将激活部分与信号传输部分相连接，使得激活部分和信号传输部分一起移动。 当沿着激活部分施加激活信号时，激活部分和信号传输部分都朝向基板被拉到基本关闭的位置，其中信号传输部分的金属接点与信号传输电极电接触。