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31 条记录 (耗时 0.016 秒)

    Metallization process and component
    1.
    发明授权
    Metallization process and component 失效
    金属化过程和组件

    公开(公告)号：US06174647B1

    公开(公告)日：2001-01-16

    申请号：US09013364

    申请日：1998-01-26

    申请人： John P. Cahalen ,  Wade Sonnenberg

    发明人： John P. Cahalen ,  Wade Sonnenberg

    IPC分类号： G03F726

    CPC分类号： H05K3/4661 ,  G03F7/095 ,  G03F7/40 ,  G03F7/405 ,  H05K3/0023 ,  H05K2203/0716 ,  H05K2203/121

    摘要： This invention is directed to a process for the selective metallization which utilizes multiple photoresist layers, using a buried palladium ligand which is then catalyzed using a PdBr selective catalyst. The Pd in the catalyst is then reduced to Pd0 and metallized using for example electroless copper.

    摘要翻译： 本发明涉及一种利用多个光致抗蚀剂层的选择性金属化方法，该方法是使用掩埋的钯配体，然后使用PdBr选择性催化剂进行催化。 然后将催化剂中的Pd还原为Pd0，并使用例如无电解铜进行金属化。

    Plating bath and method for depositing a metal layer on a substrate
    2.
    发明授权
    Plating bath and method for depositing a metal layer on a substrate 有权
    电镀浴和在基板上沉积金属层的方法

    公开(公告)号：US06773573B2

    公开(公告)日：2004-08-10

    申请号：US09970224

    申请日：2001-10-02

    申请人： David R. Gabe ,  Andrew J. Cobley ,  Leon R. Barstad ,  Mark J. Kapeckas ,  Erik Reddington ,  Wade Sonnenberg ,  Thomas Buckley

    发明人： David R. Gabe ,  Andrew J. Cobley ,  Leon R. Barstad ,  Mark J. Kapeckas ,  Erik Reddington ,  Wade Sonnenberg ,  Thomas Buckley

    IPC分类号： C25D338

    CPC分类号： C25D3/02 ,  C25D3/38 ,  H05K3/241

    摘要： A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.

    摘要翻译： 含有抑制或延缓电镀浴添加剂消耗的醇化合物的金属电镀液。 添加剂是改善电镀金属的亮度，电镀金属的物理性质，特别是相对于延展性和微投能力以及电镀液的宏投射功率的化学化合物。 抑制或延缓添加剂消耗的酒精化合物会增加镀液的使用寿命，并提高电镀工艺的效率。 可以使用含有抑制或延迟添加剂消耗的醇化合物的电镀浴来镀铜，金，银，钯，铂，钴，镉，铬，铋，铟，铑，钌和铱。

    Electroplating composition and process for plating through holes in printed circuit boards
    4.
    发明授权
    Electroplating composition and process for plating through holes in printed circuit boards 失效
    电镀组合物和电镀印刷电路板上的孔的方法

    公开(公告)号：US4897165A

    公开(公告)日：1990-01-30

    申请号：US235051

    申请日：1988-08-23

    申请人： Roger F. Bernards ,  Gordon Fisher ,  Wade Sonnenberg

    发明人： Roger F. Bernards ,  Gordon Fisher ,  Wade Sonnenberg

    IPC分类号： C25D3/38 ,  H05K3/42

    CPC分类号： C25D3/38 ,  H05K3/42 ,  H05K3/423 ,  H05K2203/162

    摘要： A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.Also disclosed is a device for measuring throwing power of a plating solution. The device comprises two anodes and a cathode suspended in a chamber adapted to contain a plating solution. The cathode is suspended between said anodes and comprises two flat electrode portions in electrical contact with each other, in parallel relationship to each other and spaced apart from each other to define a space containing plating solution. Each of said flat electrode portions has electrode portions electrically isolated from a center electrode and means for measuring the current on said first electrode portions and center electrode.

    Conductive polymer colloidal compositions with selectivity for non-conductive surfaces
    5.
    发明授权
    Conductive polymer colloidal compositions with selectivity for non-conductive surfaces 有权
    导电聚合物胶体组合物，对非导电表面具有选择性

    公开(公告)号：US06899829B2

    公开(公告)日：2005-05-31

    申请号：US09998117

    申请日：2001-11-30

    申请人： James G. Shelnut ,  Wade Sonnenberg ,  Patrick J. Houle

    发明人： James G. Shelnut ,  Wade Sonnenberg ,  Patrick J. Houle

    IPC分类号： C25D5/54 ,  H05K3/18 ,  H01B1/04 ,  B05D5/12 ,  C25D5/02 ,  H01B1/24

    CPC分类号： C25D5/54 ,  H05K3/188

    摘要： A conductive polymer colloidal composition that selectively forms a coating on a non-conductive surface. The conductive polymer colloidal composition is composed of a polymer and a sulfonate dopant. The conductive polymer colloidal composition may also contain conductive colloidal particles such as conductive carbon or metal salt particles, oxidants, stabilizers, and preservatives. The conductive polymer colloidal composition may be employed to selectively coat the non-conductive parts of printed wiring boards such that a uniform metal layer can be deposited on the conductive polymer coat. In addition to a uniform metal layer being formed over the conductive polymer, adhesion between the metal layer and the printed wiring board is improved.

    摘要翻译： 导电聚合物胶体组合物，其选择性地在非导电表面上形成涂层。 导电聚合物胶体组合物由聚合物和磺酸盐掺杂剂组成。 导电聚合物胶体组合物还可以含有导电胶体颗粒，例如导电碳或金属盐颗粒，氧化剂，稳定剂和防腐剂。 可以使用导电聚合物胶体组合物来选择性地涂覆印刷线路板的非导电部分，使得可以在导电聚合物涂层上沉积均匀的金属层。 除了在导电聚合物上形成均匀的金属层之外，还提高了金属层和印刷线路板之间的粘附性。

    Method and apparatus for determining throwing power of an electroplating solution
    7.
    发明授权
    Method and apparatus for determining throwing power of an electroplating solution 失效
    用于确定电镀溶液的投射功率的方法和装置

    公开(公告)号：US4932518A

    公开(公告)日：1990-06-12

    申请号：US438021

    申请日：1989-11-20

    申请人： Roger F. Bernards ,  Gordon Fisher ,  Wade Sonnenberg

    发明人： Roger F. Bernards ,  Gordon Fisher ,  Wade Sonnenberg

    IPC分类号： C25D3/38 ,  H05K3/42

    CPC分类号： H05K3/42 ,  C25D3/38 ,  H05K2203/162

    摘要： A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.

    摘要翻译： 一种用于将铜电镀到包含溶液可溶性铜盐和酸性电解质的导电表面上的组合物，所述铜盐以每升溶液约1至10克的浓度存在，并且所述酸以浓度存在，其中酸 铜比优选在约30至1和50至1之间变化。该组合物特别可用于电镀具有至少10比1的高度与直径的比率以及至少0.100英寸的长度的圆柱形开口的壁。

    Process for treating adhesion promoted metal surfaces
    10.
    发明授权
    Process for treating adhesion promoted metal surfaces 失效
    处理粘合的方法促进金属表面

    公开(公告)号：US06752878B2

    公开(公告)日：2004-06-22

    申请号：US09956386

    申请日：2001-09-19

    申请人： Joseph R. Montano ,  Wade Sonnenberg ,  Mark J. Kapeckas

    发明人： Joseph R. Montano ,  Wade Sonnenberg ,  Mark J. Kapeckas

    IPC分类号： C23C2200

    CPC分类号： C23C22/52 ,  C23C22/83 ,  H05K3/383 ,  H05K3/385 ,  H05K3/389

    摘要： A method for treating a micro-roughened metal surface to improve bonding between the metal surface and a polymer material. The method involves post-treating the micro-roughened conversion coated metal surface with an aqueous wetting agent composition after having formed the micro-roughened conversion coated metal surface with an adhesion promotion composition. The method can be employed in the circuit board industry to improve bonding between layers in multilayer circuit boards.

    摘要翻译： 一种用于处理微粗化金属表面以改善金属表面和聚合物材料之间的结合的方法。 该方法包括在用粘附促进组合物形成微粗糙化转化涂覆的金属表面后，用水性润湿剂组合物对微粗糙化转化涂覆的金属表面进行后处理。 该方法可用于电路板工业中以改善多层电路板中的层之间的结合。