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    LED MODULE
    2.
    发明申请
    LED MODULE 审中-公开
    LED模块

    公开(公告)号：US20150311184A1

    公开(公告)日：2015-10-29

    申请号：US14793092

    申请日：2015-07-07

    Applicant: ROHM CO., LTD.

    Inventor： Masahiko KOBAYAKAWA ,  Hidekazu TODA

    IPC: H01L25/075 ,  H01L33/62 ,  H01L33/48

    CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00

    Abstract: An LED module 100 includes LED chips 21, 22 spaced apart from each other, and an LED chip 23 offset from a straight line connecting the LED chips 21 and 22 and located between the LED chips 21, 22 in the direction in which the LED chips 21, 22 are spaced. The module further includes a lead 31 with a bonding portion 31a and a mounting terminal surface 31d, a lead 32 with a bonding portion 32a and a mounting terminal surface 32d, and a lead 33 with a bonding portion 33a and a mounting terminal surface 33d. The mounting terminal surfaces 31d, 32d, 33d are flush with each other. Light from the LED chips 21, 22, 23 is emitted in the direction in which the mounting terminal surfaces 31d, 32d and 33d extend. Thus, light of different colors properly mixed can be emitted from a compact LED module.

    Abstract translation: LED模块100包括彼此间隔开的LED芯片21,22，以及LED芯片23，其偏离连接LED芯片21和22的直线，并且位于LED芯片21,22之间，LED芯片 21,22间隔开。 模块还包括具有接合部分31a和安装端子表面31d的引线31，具有接合部分32a和安装端子表面32d的引线32以及具有接合部分33a和安装端子表面33d的引线33。 安装端子表面31d，32d，33d彼此齐平。 来自LED芯片21,22,23的光沿安装端子面31d，32d，33d延伸的方向发射。 因此，可以从紧凑的LED模块发射适当混合的不同颜色的光。

    LED MODULE
    3.
    发明申请
    LED MODULE 审中-公开

    公开(公告)号：US20190280177A1

    公开(公告)日：2019-09-12

    申请号：US16420999

    申请日：2019-05-23

    Applicant: Rohm Co., Ltd.

    Inventor： Masahiko KOBAYAKAWA ,  Hidekazu TODA

    IPC: H01L33/62 ,  H01L33/48 ,  H01L25/16 ,  H01L33/54 ,  H01L33/60 ,  H01L25/075

    Abstract: An LED module 100 includes LED chips 21, 22 spaced apart from each other, and an LED chip 23 offset from a straight line connecting the LED chips 21 and 22 and located between the LED chips 21, 22 in the direction in which the LED chips 21, 22 are spaced. The module further includes a lead 31 with a bonding portion 31a and a mounting terminal surface 31d, a lead 32 with a bonding portion 32a and a mounting terminal surface 32d, and a lead 33 with a bonding portion 33a and a mounting terminal surface 33d. The mounting terminal surfaces 31d, 32d, 33d are flush with each other. Light from the LED chips 21, 22, 23 is emitted in the direction in which the mounting terminal surfaces 31d, 32d and 33d extend. Thus, light of different colors properly mixed can be emitted from a compact LED module.

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