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    SEMICONDUCTOR LIGHT-EMITTING DEVICE
    2.
    发明申请
    SEMICONDUCTOR LIGHT-EMITTING DEVICE 有权

    公开(公告)号：US20210043818A1

    公开(公告)日：2021-02-11

    申请号：US16939537

    申请日：2020-07-27

    Applicant: ROHM CO., LTD.

    Inventor： Dai MIYAZAKI ,  Masahiko KOBAYAKAWA

    IPC: H01L33/62 ,  H01L33/52

    Abstract: There is provided a semiconductor light-emitting device including: a main lead including a main surface; a semiconductor light-emitting element mounted on the main surface of the main lead; a bonding material that bonds the semiconductor light-emitting element to the main surface of the main lead; a sub lead arranged in a first direction with respect to the main lead and including a main surface facing the same side as the main surface of the main lead; a first wire including a first end connected to the main surface of the sub lead and a second end connected to the semiconductor light-emitting element; a resin case including a case main surface facing the same direction as the main surfaces of the main lead and the sub lead and supporting the main lead and the sub lead.

    LED MODULE
    3.
    发明申请
    LED MODULE 审中-公开

    公开(公告)号：US20190280177A1

    公开(公告)日：2019-09-12

    申请号：US16420999

    申请日：2019-05-23

    Applicant: Rohm Co., Ltd.

    Inventor： Masahiko KOBAYAKAWA ,  Hidekazu TODA

    IPC: H01L33/62 ,  H01L33/48 ,  H01L25/16 ,  H01L33/54 ,  H01L33/60 ,  H01L25/075

    Abstract: An LED module 100 includes LED chips 21, 22 spaced apart from each other, and an LED chip 23 offset from a straight line connecting the LED chips 21 and 22 and located between the LED chips 21, 22 in the direction in which the LED chips 21, 22 are spaced. The module further includes a lead 31 with a bonding portion 31a and a mounting terminal surface 31d, a lead 32 with a bonding portion 32a and a mounting terminal surface 32d, and a lead 33 with a bonding portion 33a and a mounting terminal surface 33d. The mounting terminal surfaces 31d, 32d, 33d are flush with each other. Light from the LED chips 21, 22, 23 is emitted in the direction in which the mounting terminal surfaces 31d, 32d and 33d extend. Thus, light of different colors properly mixed can be emitted from a compact LED module.

    LED MODULE
    7.
    发明申请
    LED MODULE 审中-公开
    LED模块

    公开(公告)号：US20150235996A1

    公开(公告)日：2015-08-20

    申请号：US14703169

    申请日：2015-05-04

    Applicant: ROHM CO., LTD.

    Inventor： Masahiko KOBAYAKAWA ,  Takashi MORIGUCHI

    IPC: H01L25/075 ,  H01L33/62 ,  H01L33/60 ,  H01L33/48 ,  H01L33/54

    CPC classification number: H01L25/0753 ,  H01L33/486 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

    Abstract: An LED module includes a substrate, one or more LED chips supported by a main surface of the substrate, and wirings. The substrate has one or more through holes penetrating from the main surface to a rear surface. The wirings are formed on the substrate and make electrical conduction with the LED chips. The wirings include pads which are formed on the main surface and make electrical conduction with the LED chips, rear surface electrodes which are formed on the rear surface, and through wirings which make electrical conduction between the pads and the rear surface electrodes and are formed on the inner sides of the through holes.

    Abstract translation: LED模块包括基板，由基板的主表面支撑的一个或多个LED芯片和布线。 基板具有从主表面贯穿到后表面的一个或多个通孔。 布线形成在基板上并与LED芯片导通。 布线包括形成在主表面上并与LED芯片，后表面上形成的后表面电极以及在焊盘和后表面电极之间形成导电并且形成在 通孔的内侧。

    SEMICONDUCTOR LIGHT-EMITTING DEVICE
    9.
    发明申请
    SEMICONDUCTOR LIGHT-EMITTING DEVICE 有权
    半导体发光器件

    公开(公告)号：US20140008695A1

    公开(公告)日：2014-01-09

    申请号：US14021501

    申请日：2013-09-09

    Applicant: ROHM CO., LTD.

    Inventor： Masahiko KOBAYAKAWA

    IPC: H01L33/62

    CPC classification number: H01L33/62 ,  H01L23/49541 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00

    Abstract: A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region.

    Abstract translation: 半导体发光装置包括引线框架，安装在接合区域的顶表面上的半导体发光元件和引线框架的覆盖部分的壳体。 接合区域的底面暴露于外壳外。 引线框架包括从接合区域延伸的薄延伸部，并且具有与接合区域的顶表面齐平的顶表面。 薄延伸部具有从接合区域的底面向接合区域的上表面偏移的底面。

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