公开(公告)号：US12176302B2

公开(公告)日：2024-12-24

申请号：US18475946

申请日：2023-09-27

Applicant: ROHM CO., LTD.

Inventor： Hidetoshi Abe ,  Makoto Ikenaga ,  Kensei Takamoto

IPC: H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495

Abstract: A semiconductor device includes a semiconductor element, a lead frame, a conductive member, a resin composition and a sealing resin. The semiconductor element has an element front surface and an element back surface facing away in a first direction. The semiconductor element is mounted on the lead frame. The conductive member is bonded to the lead frame, electrically connecting the semiconductor element and the lead frame. The resin composition covers a bonded region where the conductive member and lead frame are bonded while exposing part of the element front surface. The sealing resin covers part of the lead frame, the semiconductor element, and the resin composition. The resin composition has a greater bonding strength with the lead frame than a bonding strength between the sealing resin and lead frame and a greater bonding strength with the conductive member than a bonding strength between the sealing resin and conductive member.

公开(公告)号：US11776936B2

公开(公告)日：2023-10-03

申请号：US17644452

申请日：2021-12-15

Applicant: ROHM CO., LTD.

Inventor： Kenji Hayashi ,  Akihiro Suzaki ,  Masaaki Matsuo ,  Ryuta Watanabe ,  Makoto Ikenaga

IPC: H01L25/07 ,  H01L23/049 ,  H01L23/29 ,  H01L23/31 ,  H01L23/373 ,  H01L23/00

CPC classification number: H01L25/072 ,  H01L23/049 ,  H01L23/296 ,  H01L23/3107 ,  H01L23/3735 ,  H01L23/564 ,  H01L24/32 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/40139 ,  H01L2224/40225 ,  H01L2224/48096 ,  H01L2224/48139 ,  H01L2224/48225 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2924/13091 ,  H01L2924/14252

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate, amounting layer, switching elements, a moisture-resistant layer and a sealing resin. The substrate has a front surface facing in a thickness direction. The mounting layer is electrically conductive and disposed on the front surface. Each switching element includes an element front surface facing in the same direction in which the front surface faces along the thickness direction, a back surface facing in the opposite direction of the element front surface, and a side surface connected to the element front surface and the back surface. The switching elements are electrically bonded to the mounting layer with their back surfaces facing the front surface. The moisture-resistant layer covers at least one side surface. The sealing resin covers the switching elements and the moisture-resistant layer. The moisture-resistant layer is held in contact with the mounting layer and the side surface so as to be spanned between the mounting layer and the side surface in the thickness direction.

公开(公告)号：US11545446B2

公开(公告)日：2023-01-03

申请号：US17260499

申请日：2019-07-18

Applicant: ROHM CO., LTD.

Inventor： Hidetoshi Abe ,  Makoto Ikenaga ,  Kensei Takamoto

IPC: H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495

Abstract: A semiconductor device includes a semiconductor element, a lead frame, a conductive member, a resin composition and a sealing resin. The semiconductor element has an element front surface and an element back surface facing away in a first direction. The semiconductor element is mounted on the lead frame. The conductive member is bonded to the lead frame, electrically connecting the semiconductor element and the lead frame. The resin composition covers a bonded region where the conductive member and lead frame are bonded while exposing part of the element front surface. The sealing resin covers part of the lead frame, the semiconductor element, and the resin composition. The resin composition has a greater bonding strength with the lead frame than a bonding strength between the sealing resin and lead frame and a greater bonding strength with the conductive member than a bonding strength between the sealing resin and conductive member.

公开(公告)号：US11804453B2

公开(公告)日：2023-10-31

申请号：US18074399

申请日：2022-12-02

Applicant: ROHM CO., LTD.

Inventor： Hidetoshi Abe ,  Makoto Ikenaga ,  Kensei Takamoto

IPC: H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L23/562 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49513 ,  H01L23/49562

Abstract: A semiconductor device includes a semiconductor element, a lead frame, a conductive member, a resin composition and a sealing resin. The semiconductor element has an element front surface and an element back surface facing away in a first direction. The semiconductor element is mounted on the lead frame. The conductive member is bonded to the lead frame, electrically connecting the semiconductor element and the lead frame. The resin composition covers a bonded region where the conductive member and lead frame are bonded while exposing part of the element front surface. The sealing resin covers part of the leadframe, the semiconductor element, and the resin composition. The resin composition has a greater bonding strength with the lead frame than a bonding strength between the sealing resin and lead frame and a greater bonding strength with the conductive member than a bonding strength between the sealing resin and conductive member.

公开(公告)号：US11233037B2

公开(公告)日：2022-01-25

申请号：US16492307

申请日：2018-04-18

Applicant: ROHM CO., LTD.

Inventor： Kenji Hayashi ,  Akihiro Suzaki ,  Masaaki Matsuo ,  Ryuta Watanabe ,  Makoto Ikenaga

IPC: H01L25/07 ,  H01L23/049 ,  H01L23/29 ,  H01L23/31 ,  H01L23/373 ,  H01L23/00

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate, amounting layer, switching elements, a moisture-resistant layer and a sealing resin. The substrate has a front surface facing in a thickness direction. The mounting layer is electrically conductive and disposed on the front surface. Each switching element includes an element front surface facing in the same direction in which the front surface faces along the thickness direction, a back surface facing in the opposite direction of the element front surface, and a side surface connected to the element front surface and the back surface. The switching elements are electrically bonded to the mounting layer with their back surfaces facing the front surface. The moisture-resistant layer covers at least one side surface. The sealing resin covers the switching elements and the moisture-resistant layer. The moisture-resistant layer is held in contact with the mounting layer and the side surface so as to be spanned between the mounting layer and the side surface in the thickness direction.

公开(公告)号：US09088444B2

公开(公告)日：2015-07-21

申请号：US14297878

申请日：2014-06-06

Applicant: Rohm Co., Ltd.

Inventor： Akio Sasabe ,  Hirotaka Takihara ,  Makoto Ikenaga ,  Toshiyuki Ishikawa

IPC: H03K19/0175 ,  H04L25/02 ,  H03K19/16

CPC classification number: H04L25/0274 ,  H03K19/16

Abstract: A signal-transferring device having a first circuit and a second circuit that operate on different ground references, and a third circuit for transferring signals while providing insulation between the first circuit and the second circuit. The second circuit switches a logic level of an output signal in accordance with the logic level of an input signal notified by the first circuit, and notifies the first circuit about the logic level of the output signal. The first circuit notifies the second circuit about the logic level of the input signal not only when the logic level of the input signal has been switched, but also when the logic level of the output signal notified by the second circuit does not match the logic level of the input signal.

Abstract translation: 一种具有在不同接地基准上工作的第一电路和第二电路的信号传送装置，以及用于在第一电路和第二电路之间提供绝缘的同时传送信号的第三电路。 第二电路根据由第一电路通知的输入信号的逻辑电平切换输出信号的逻辑电平，并将第一电路通知输出信号的逻辑电平。 第一电路不仅在输入信号的逻辑电平已被切换时通知第二电路关于输入信号的逻辑电平，而且当第二电路通知的输出信号的逻辑电平与逻辑电平不匹配时， 的输入信号。