公开(公告)号：US20100127814A1

公开(公告)日：2010-05-27

申请号：US12639886

申请日：2009-12-16

Applicant: Ronald W. Whittaker ,  Joe D. Guerra ,  Ciprian Marcoci

Inventor： Ronald W. Whittaker ,  Joe D. Guerra ,  Ciprian Marcoci

IPC: H01F27/28

CPC classification number: H01F17/0033 ,  H01F17/062 ,  H01F19/04 ,  H01F27/266 ,  H01F27/2804 ,  H01F41/046 ,  H01F2017/002 ,  H05K1/165 ,  H05K1/189 ,  H05K3/389 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/0179 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/09809 ,  H05K2201/10416

Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.

Abstract translation: 微型电路和电感器部件，其中在支撑面板的每一侧，通常是印刷电路板或刚性柔性件上形成多层印刷电路。 磁性构件嵌入在所述支撑面板中的一个或多个空腔中。 由多个电镀通孔导体提供多层电路与磁性构件周围的多个绕组之间的电连接。 小的通孔开口容纳多个电镀通孔导体，因为它们通过非常薄的真空沉积的有机层（例如具有高介电强度的聚对二甲苯）绝缘。 通过首先在有机层的表面上施加粘合剂促进剂，然后真空沉积有机层，来提供该镀铜的有机层的附着力。

公开(公告)号：US20090015364A1

公开(公告)日：2009-01-15

申请号：US12233553

申请日：2008-09-18

Applicant: Ronald W. Whittaker ,  Joe D. Guerra ,  Ciprian Marcoci

Inventor： Ronald W. Whittaker ,  Joe D. Guerra ,  Ciprian Marcoci

IPC: H01F27/28

CPC classification number: H01F17/0033 ,  H01F17/062 ,  H01F19/04 ,  H01F27/266 ,  H01F27/2804 ,  H01F41/046 ,  H01F2017/002 ,  H05K1/165 ,  H05K1/189 ,  H05K3/389 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/0179 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/09809 ,  H05K2201/10416

Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.

Abstract translation: 微型电路和电感器部件，其中在支撑面板的每一侧，通常是印刷电路板或刚性柔性件上形成多层印刷电路。 磁性构件嵌入在所述支撑面板中的一个或多个空腔中。 由多个电镀通孔导体提供多层电路与磁性构件周围的多个绕组之间的电连接。 小的通孔开口容纳多个电镀通孔导体，因为它们通过非常薄的真空沉积的有机层（例如具有高介电强度的聚对二甲苯）绝缘。 通过首先在有机层的表面上施加粘合剂促进剂，然后真空沉积有机层来提供该镀铜的有机层的附着力。

公开(公告)号：US07436282B2

公开(公告)日：2008-10-14

申请号：US11774180

申请日：2007-07-06

Applicant: Ronald W. Whittaker ,  Joe D. Guerra ,  Ciprian Marcoci

Inventor： Ronald W. Whittaker ,  Joe D. Guerra ,  Ciprian Marcoci

IPC: H01F5/00

CPC classification number: H01F17/0033 ,  H01F17/062 ,  H01F19/04 ,  H01F27/266 ,  H01F27/2804 ,  H01F41/046 ,  H01F2017/002 ,  H05K1/165 ,  H05K1/189 ,  H05K3/389 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/0179 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/09809 ,  H05K2201/10416

Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.

Abstract translation: 微型电路和电感器部件，其中在支撑面板的每一侧，通常是印刷电路板或刚性柔性件上形成多层印刷电路。 磁性构件嵌入在所述支撑面板中的一个或多个空腔中。 由多个电镀通孔导体提供多层电路与磁性构件周围的多个绕组之间的电连接。 小的通孔开口容纳多个电镀通孔导体，因为它们通过非常薄的真空沉积的有机层（例如具有高介电强度的聚对二甲苯）绝缘。 通过首先在有机层的表面上施加粘合剂促进剂，然后真空沉积有机层来提供该镀铜的有机层的附着力。

公开(公告)号：US6155369A

公开(公告)日：2000-12-05

申请号：US48551

申请日：1998-03-26

Applicant: Ronald W. Whittaker

Inventor： Ronald W. Whittaker

IPC: B62J99/00 ,  B62M6/60 ,  B62M6/85 ,  B62M6/90 ,  B62M7/02 ,  B62M7/06 ,  F01N3/22 ,  F01N3/34 ,  B62D61/02 ,  B62D11/00

CPC classification number: B62M6/90 ,  B60L11/007 ,  B60L11/1864 ,  B60L11/1877 ,  B62M7/02 ,  B60L2200/12 ,  Y02T10/7005 ,  Y02T10/7061

Abstract: An electric bicycle assembly provided with a lightweight, high performance DC electric motor and a tuned centrifugal slip clutch assembly in combination therewith. This bicycle assembly includes a two-stage start-run electric control circuitry which prevents high motor zero rpm in-rush currents which may damage the motor. Another embodiment of this invention utilizes a variable ratio V-belt drive assembly having a centrifugal clutch capability so as to engage and disengage at a predetermined RPM. Another embodiment of this invention is provided with a front wheel mounted regenerating wheel rotor assembly which is adapted to recharge batteries as needed. Another embodiment of this invention utilizes a mechanically actuated multi-stage power control switch so as to selectively provide a start circuit and two or more power control levels in the operational use thereof.

Abstract translation: 一种电动自行车组件，其组装有一个重量轻，高性能的直流电动机和一个调节的离心式滑动离合器组件。 该自行车组件包括两级起动电控制电路，其防止可能损坏电动机的高电动机零转速冲击电流。 本发明的另一个实施例利用具有离心离合器能力的可变比率的V形带驱动组件，以便以预定的RPM接合和分离。 本发明的另一个实施例提供有一个前轮安装的再生轮转子组件，其适于根据需要对电池进行充电。 本发明的另一个实施例利用机械致动的多级功率控制开关，以在其操作使用中选择性地提供启动电路和两个或更多功率控制电平。

公开(公告)号：US20100146782A1

公开(公告)日：2010-06-17

申请号：US12711180

申请日：2010-02-23

Applicant: Ronald W. Whittaker ,  Joe D. Guerra ,  Ciprian Marcoci

Inventor： Ronald W. Whittaker ,  Joe D. Guerra ,  Ciprian Marcoci

IPC: H05K3/42

CPC classification number: H01F27/266 ,  H01F17/0033 ,  H01F17/062 ,  H01F19/04 ,  H01F27/2804 ,  H01F41/046 ,  H01F2017/002 ,  H05K1/165 ,  H05K1/189 ,  H05K3/389 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/0179 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/09809 ,  H05K2201/10416 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.

Abstract translation: 微型电路和电感器部件，其中在支撑面板的每一侧，通常是印刷电路板或刚性柔性件上形成多层印刷电路。 多层电路和磁性构件周围的多个绕组之间的电连接由多个电镀通孔导体提供。 小的通孔开口容纳多个电镀通孔导体，因为它们通过非常薄的真空沉积的有机层（例如具有高介电强度的聚对二甲苯）绝缘。 通过首先在有机层的表面上施加粘合剂促进剂，然后真空沉积有机层来提供该镀铜的有机层的附着力。

公开(公告)号：US07690110B2

公开(公告)日：2010-04-06

申请号：US11895355

申请日：2007-08-24

Applicant: Ronald W. Whittaker ,  Joe D Guerra ,  Ciprian Marcoci

Inventor： Ronald W. Whittaker ,  Joe D Guerra ,  Ciprian Marcoci

IPC: H05K3/42

CPC classification number: H01F27/266 ,  H01F17/0033 ,  H01F17/062 ,  H01F19/04 ,  H01F27/2804 ,  H01F41/046 ,  H01F2017/002 ,  H05K1/165 ,  H05K1/189 ,  H05K3/389 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/0179 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/09809 ,  H05K2201/10416 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method for making plural plated through holes in a single circuit board via is provided. The method includes plating copper in the walls of said circuit board via to form a first plated through hole and applying a thin layer of first adhesive promotor to the surface of said plated via. The method further includes vacuum depositing an organic layer having a high dielectric strength unto said layer of first adhesive promoter and applying a second layer of adhesive promoter over said organic layer. The method even further includes plating copper over said second layer of adhesive promoter to form a second plated through hole in said circuit board via.

Abstract translation: 提供一种用于在单个电路板通孔中制造多个电镀通孔的方法。 该方法包括在所述电路板的壁中电镀铜以形成第一电镀通孔，并将第一粘合剂促进剂的薄层施加到所述电镀通孔的表面。 该方法还包括将具有高介电强度的有机层真空沉积到所述第一粘合促进剂层上并在所述有机层上施加第二层粘合促进剂。 该方法还包括在所述第二层粘合剂促进剂上镀铜，以在所述电路板通孔中形成第二电镀通孔。

公开(公告)号：US07656263B2

公开(公告)日：2010-02-02

申请号：US12233553

申请日：2008-09-18

Applicant: Ronald W. Whittaker ,  Joe D. Guerra ,  Ciprian Marcoci

Inventor： Ronald W. Whittaker ,  Joe D. Guerra ,  Ciprian Marcoci

IPC: H01F5/00

CPC classification number: H01F17/0033 ,  H01F17/062 ,  H01F19/04 ,  H01F27/266 ,  H01F27/2804 ,  H01F41/046 ,  H01F2017/002 ,  H05K1/165 ,  H05K1/189 ,  H05K3/389 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/0179 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/09809 ,  H05K2201/10416

Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.

Abstract translation: 微型电路和电感器部件，其中在支撑面板的每一侧，通常是印刷电路板或刚性柔性件上形成多层印刷电路。 磁性构件嵌入在所述支撑面板中的一个或多个空腔中。 由多个电镀通孔导体提供多层电路与磁性构件周围的多个绕组之间的电连接。 小的通孔开口容纳多个电镀通孔导体，因为它们通过非常薄的真空沉积的有机层（例如具有高介电强度的聚对二甲苯）绝缘。 通过首先在有机层的表面上施加粘合剂促进剂，然后真空沉积有机层，来提供该镀铜的有机层的附着力。

公开(公告)号：US07602272B2

公开(公告)日：2009-10-13

申请号：US11895447

申请日：2007-08-24

Applicant: Ronald W. Whittaker ,  Joe D Guerra ,  Ciprian Marcoci

Inventor： Ronald W. Whittaker ,  Joe D Guerra ,  Ciprian Marcoci

IPC: H01F5/00

CPC classification number: H01F27/266 ,  H01F17/0033 ,  H01F17/062 ,  H01F19/04 ,  H01F27/2804 ,  H01F41/046 ,  H01F2017/002 ,  H05K1/165 ,  H05K1/189 ,  H05K3/389 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/0179 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/09809 ,  H05K2201/10416 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.

Abstract translation: 微型电路和电感器部件，其中在支撑面板的每一侧，通常是印刷电路板或刚性柔性件上形成多层印刷电路。 多层电路和磁性构件周围的多个绕组之间的电连接由多个电镀通孔导体提供。 小的通孔开口容纳多个电镀通孔导体，因为它们通过非常薄的真空沉积的有机层（例如具有高介电强度的聚对二甲苯）绝缘。 通过首先在有机层的表面上施加粘合剂促进剂，然后真空沉积有机层来提供该镀铜的有机层的附着力。

公开(公告)号：US07271697B2

公开(公告)日：2007-09-18

申请号：US11296579

申请日：2005-12-07

Applicant: Ronald W. Whittaker ,  Joe D Guerra ,  Ciprian Marcoci

Inventor： Ronald W. Whittaker ,  Joe D Guerra ,  Ciprian Marcoci

IPC: H01F27/28

CPC classification number: H01F27/266 ,  H01F17/0033 ,  H01F17/062 ,  H01F19/04 ,  H01F27/2804 ,  H01F41/046 ,  H01F2017/002 ,  H05K1/165 ,  H05K1/189 ,  H05K3/389 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/0179 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/09809 ,  H05K2201/10416 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.

Abstract translation: 微型电路和电感器部件，其中在支撑面板的每一侧，通常是印刷电路板或刚性柔性件上形成多层印刷电路。 多层电路和磁性构件周围的多个绕组之间的电连接由多个电镀通孔导体提供。 小的通孔开口容纳多个电镀通孔导体，因为它们通过非常薄的真空沉积的有机层（例如具有高介电强度的聚对二甲苯）绝缘。 通过首先在有机层的表面上施加粘合剂促进剂，然后真空沉积有机层来提供该镀铜的有机层的附着力。