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1.发明授权Compliant mold fill head with integrated cavity venting and solder cooling 有权具有集成腔体排气和焊锡冷却的合适的模具填充头公开(公告)号：US08011563B2
公开(公告)日：2011-09-06
申请号：US11696753
申请日：2007-04-05
CPC分类号： B23K3/0607 , B23K2101/40
摘要： A mold fill head includes a solder delivery head and an interface portion having a compliant portion secured to the solder delivery head and a dispensing region associated with the compliant portion. The dispensing region is formed with at least one aperture configured to interface with cavities in a mold plate, the at least one aperture being in fluid communication with the solder delivery head. The compliant portion is configured and dimensioned to urge the dispensing region against the mold plate when held a predetermined distance therefrom and to substantially tolerate variations in flatness of the mold plate, variations in the predetermined distance, and/or variations in an angular orientation of the interface portion and the mold plate.
摘要翻译： 模具填充头包括焊料输送头和具有固定到焊料输送头的顺应部分和与柔顺部分相关联的分配区域的界面部分。 分配区域形成有至少一个孔，其被配置为与模板中的空腔相接触，所述至少一个孔与焊料输送头流体连通。 顺应部分的构造和尺寸被设计成当从其延伸预定距离时将分配区域推靠在模板上，并且基本上容许模板的平坦度变化，预定距离的变化和/或角度取向的变化 界面部分和模板。
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公开(公告)号：US20090183849A1
公开(公告)日：2009-07-23
申请号：US12018421
申请日：2008-01-23
CPC分类号： H05K3/3457 , B23K1/0016 , B23K3/0638 , H05K2203/0113 , H05K2203/0126 , H05K2203/0338
摘要： A system, apparatus, and method, are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译： 提供一种系统，装置和方法，以将导电接合材料沉积在模具中的空腔中。 填充头被放置成与包括空腔的模具基本接触。 填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。 导电接合材料被迫从模具顶端朝向模具。 导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。
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公开(公告)号：US07980445B2
公开(公告)日：2011-07-19
申请号：US12018421
申请日：2008-01-23
CPC分类号： H05K3/3457 , B23K1/0016 , B23K3/0638 , H05K2203/0113 , H05K2203/0126 , H05K2203/0338
摘要： A system, apparatus, and method, are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译： 提供一种系统，装置和方法，以将导电接合材料沉积在模具中的空腔中。 填充头被放置成与包括空腔的模具基本接触。 填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。 导电接合材料被迫从模具顶端朝向模具。 导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。
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4.发明授权公开(公告)号：US08286855B2
公开(公告)日：2012-10-16
申请号：US13442322
申请日：2012-04-09
CPC分类号： H05K3/3457 , B23K1/0016 , B23K3/0638 , H05K2203/0113 , H05K2203/0126 , H05K2203/0338
摘要： A method are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The fill head and mold are transitioned so that the fill head is situated substantially directly above the mold and so that the plurality of cavities are facing in an upward direction with respect to the sealing member. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译： 提供了一种将导电接合材料沉积在模具中的空腔中的方法。 填充头被放置成与包括空腔的模具基本接触。 填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。 填充头和模具被过渡，使得填充头基本上位于模具的正上方，并且使得多个空腔相对于密封构件向上的方向面对。 导电接合材料被迫从模具顶端朝向模具。 导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。
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公开(公告)号：US09314864B2
公开(公告)日：2016-04-19
申请号：US11774713
申请日：2007-07-09
申请人： Russell A. Budd , John P. Karidis
发明人： Russell A. Budd , John P. Karidis
CPC分类号： B23K3/0638 , B23K1/0016 , B23K3/0607 , B23K2101/40 , H05K2203/0126
摘要： A seal, fill head, and system are provided. The seal is adapted to cooperate with a fill head that is configured to place conductive bonding material into cavities on a mold. The seal comprises a first outer wall that is configured to abut a first adjacent wall of a support groove in a fill head. A second outer wall is configured to abut a second adjacent wall of a support groove in a fill head. An outer horizontal wall is situated between the first outer wall and the second outer wall. The outer horizontal wall comprises at least a first portion that is configured to abut an upper portion of the support groove. A convex bottom portion extends from the first and second outer walls. The convex bottom portion is configured to cooperate with a top surface of a mold.
摘要翻译： 提供密封，填充头和系统。 该密封件适于与配置成将导电粘合材料置于模具中的空腔中的填充头配合。 密封件包括第一外壁，其被构造成邻接填充头中的支撑槽的第一相邻壁。 第二外壁构造成邻接填充头中的支撑槽的第二相邻壁。 外部水平壁位于第一外壁和第二外壁之间。 外部水平壁包括至少第一部分，其构造成邻接支撑槽的上部。 凸起的底部部分从第一和第二外壁延伸。 凸底部构造成与模具的顶表面配合。
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公开(公告)号：US08181846B2
公开(公告)日：2012-05-22
申请号：US13100133
申请日：2011-05-03
IPC分类号： B23K31/02
CPC分类号： H05K3/3457 , B23K1/0016 , B23K3/0638 , H05K2203/0113 , H05K2203/0126 , H05K2203/0338
摘要： A method and apparatus are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译： 提供了一种方法和装置，以将导电接合材料沉积在模具中的空腔中。 填充头被放置成与包括空腔的模具基本接触。 填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。 导电接合材料被迫从模具顶端朝向模具。 导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。
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公开(公告)号：US20090014146A1
公开(公告)日：2009-01-15
申请号：US11774713
申请日：2007-07-09
申请人： Russell A. Budd , John P. Karidis
发明人： Russell A. Budd , John P. Karidis
CPC分类号： B23K3/0638 , B23K1/0016 , B23K3/0607 , B23K2101/40 , H05K2203/0126
摘要： A seal, fill head, and system are provided. The seal is adapted to cooperate with a fill head that is configured to place conductive bonding material into cavities on a mold. The seal comprises a first outer wall that is configured to abut a first adjacent wall of a support groove in a fill head. A second outer wall is configured to abut a second adjacent wall of a support groove in a fill head. An outer horizontal wall is situated between the first outer wall and the second outer wall. The outer horizontal wall comprises at least a first portion that is configured to abut an upper portion of the support groove. A convex bottom portion extends from the first and second outer walls. The convex bottom portion is configured to cooperate with a top surface of a mold.
摘要翻译： 提供密封，填充头和系统。 该密封件适于与配置成将导电粘合材料置于模具中的空腔中的填充头配合。 密封件包括第一外壁，其被构造成邻接填充头中的支撑槽的第一相邻壁。 第二外壁构造成邻接填充头中的支撑槽的第二相邻壁。 外部水平壁位于第一外壁和第二外壁之间。 外部水平壁包括至少第一部分，其构造成邻接支撑槽的上部。 凸起的底部部分从第一和第二外壁延伸。 凸底部构造成与模具的顶表面配合。
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8.发明申请Compliant Mold Fill Head with Integrated Cavity Venting and Solder Cooling 有权符合标准的模具填充头，集成腔体通风和焊接冷却公开(公告)号：US20080245847A1
公开(公告)日：2008-10-09
申请号：US11696753
申请日：2007-04-05
IPC分类号： B23K1/00
CPC分类号： B23K3/0607 , B23K2101/40
摘要： A mold fill head includes a solder delivery head and an interface portion having a compliant portion secured to the solder delivery head and a dispensing region associated with the compliant portion. The dispensing region is formed with at least one aperture configured to interface with cavities in a mold plate, the at least one aperture being in fluid communication with the solder delivery head. The compliant portion is configured and dimensioned to urge the dispensing region against the mold plate when held a predetermined distance therefrom and to substantially tolerate variations in flatness of the mold plate, variations in the predetermined distance, and/or variations in an angular orientation of the interface portion and the mold plate.
摘要翻译： 模具填充头包括焊料输送头和具有固定到焊料输送头的顺应部分和与柔顺部分相关联的分配区域的界面部分。 分配区域形成有至少一个孔，其被配置为与模板中的空腔相接触，所述至少一个孔与焊料输送头流体连通。 顺应部分的构造和尺寸被设计成当从其延伸预定距离时将分配区域推靠在模板上，并且基本上容许模板的平坦度变化，预定距离的变化和/或角度取向的变化 界面部分和模板。
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公开(公告)号：US08411719B2
公开(公告)日：2013-04-02
申请号：US13358963
申请日：2012-01-26
申请人： Russell A. Budd , Paul Fortier , Frank R. Libsch
发明人： Russell A. Budd , Paul Fortier , Frank R. Libsch
IPC分类号： H01S5/00
CPC分类号： H01L27/1446 , G02B6/4201 , G02B6/4206 , G02B6/4245 , G02B6/4249 , G02B6/4257 , G02B6/4266 , G02B6/4269 , G02B6/428 , G02B6/4292 , H01L23/367 , H01L25/16 , H01L27/14625 , H01L2224/131 , H01L2924/01046 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/15153 , H01L2924/15192 , H01L2924/15311 , H01L2924/3011 , H01L2924/014 , H01L2924/00
摘要： An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with a wiring layer. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. One or more first OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the first OE elements positioned in optical alignment with the optical via for receiving the light. A second OE element embedded within the wiring layer. A carrier may be interposed between electrical interconnect elements and positioned between the wiring layer and a circuit board.
摘要翻译： 公开了一种用于制造的光电（OE）封装或系统和方法，其包括具有布线层的硅层。 硅层具有允许光通过的光通孔。 光耦合层结合到硅层，并且光耦合层包括多个微透镜，用于聚焦和/或准直光穿过光通孔。 一个或多个第一OE元件耦合到硅层并与布线电连通。 位于与用于接收光的光通孔光学对准的第一OE元件中的至少一个。 嵌入在布线层内的第二个OE元件。 载体可以介于电互连元件之间并且位于布线层和电路板之间。
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公开(公告)号：US20130044979A1
公开(公告)日：2013-02-21
申请号：US13277767
申请日：2011-10-20
申请人： Russell A. Budd , Frank R. Libsch
发明人： Russell A. Budd , Frank R. Libsch
CPC分类号： G02B6/38 , G02B6/3817 , G02B6/4293 , G02B6/43
摘要： An optical cable including connectors includes a plurality of waveguide layers each including a plurality of optical channels each having a first end and a second end. First and second connectors each include a plurality of electrically conductive pins, and each of the plurality of optical channels of each of the waveguides, at their first and second ends, are connected to a specified pin on each of the first and second connectors, respectively. A first optical channel connection pattern on the first connector, and a second optical channel connection pattern on the second connector. The first optical channel connection pattern on the first connector is a different pattern than the second optical channel connection pattern on the second connector in relation to a connection hole pattern which is the same for both the first and second connectors.
摘要翻译： 包括连接器的光缆包括多个波导层，每个波导层包括多个光通道，每个光通道具有第一端和第二端。 第一和第二连接器各自包括多个导电引脚，并且每个波导的多个光通道中的每一个在其第一和第二端分别连接到第一和第二连接器中的每一个上的指定引脚 。 第一连接器上的第一光通道连接图案和第二连接器上的第二光通道连接图案。 第一连接器上的第一光通道连接图案是与第二连接器上的第二光通道连接图案相对于第一和第二连接器两者相同的连接孔图案不同的图案。
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