公开(公告)号：US4812897A

公开(公告)日：1989-03-14

申请号：US93159

申请日：1987-09-01

申请人： Ryoichi Narita ,  Toshio Sonobe ,  Hitoshi Ito ,  Junji Ishikawa ,  Osamu Takenaka ,  Junji Sugiura

发明人： Ryoichi Narita ,  Toshio Sonobe ,  Hitoshi Ito ,  Junji Ishikawa ,  Osamu Takenaka ,  Junji Sugiura

IPC分类号： H01L23/29 ,  C08L83/07 ,  H01L21/56 ,  H01L21/60 ,  H01L23/24 ,  H01L23/31 ,  H01L23/28 ,  B32B9/04 ,  B32B27/38 ,  C08F8/00 ,  C08F283/00 ,  C08G8/28 ,  H01L23/02

CPC分类号： H01L24/81 ,  H01L23/24 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/31511 ,  Y10T428/31663

摘要： A semiconductor element mounted on a substrate is sealed with a silicone gel which has a complex modulus of elasticity such that breakage of solder bumps due to thermal fatique occurs preferentially by shear stress thereto due to a difference between thermal expansion coefficients of the semiconductor element and the substrate, not by tension thereto due to thermal expansion of the silicone gel between the semiconductor element and the substrate.

摘要翻译： 安装在基板上的半导体元件用具有复数弹性模量的硅凝胶密封，使得由于热负荷导致的焊料凸块的破裂优先地由于半导体元件的热膨胀系数与 基板，而不是由于硅氧烷凝胶在半导体元件和基板之间的热膨胀而受到张力。

公开(公告)号：US5349240A

公开(公告)日：1994-09-20

申请号：US965919

申请日：1992-10-26

申请人： Ryoichi Narita ,  Yutaka Fukuda

发明人： Ryoichi Narita ,  Yutaka Fukuda

IPC分类号： H01L23/24 ,  H01L23/29 ,  H01L23/31 ,  H01L23/42 ,  H01L23/28 ,  H01L23/02

CPC分类号： H01L23/24 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/01014

摘要： A semiconductor element mounted on a board is sealed with a sealing resin, The semiconductor element is electrically bonded to the board through a soldering bump. The sealing resin includes a silicone gel as a base resin and a filler filled into a silicone gel. A diameter of the filler is equal to or shorter than the distance between the semiconductor element and the board, and a shape of the filler is spherical to improve a thermal conductivity of the sealing resin. The relationship between a coefficient .alpha. of a linear expansion and a complex modulus of elasticity G* of the sealing resin is defined as follows to reduce a force pushing up the semiconductor element:.alpha..ltoreq.0.033(G*-451).sup.-0.56.

摘要翻译： 安装在板上的半导体元件用密封树脂密封。半导体元件通过焊接凸块电连接到板上。 密封树脂包括作为基础树脂的硅凝胶和填充到硅凝胶中的填料。 填料的直径等于或短于半导体元件和板之间的距离，并且填料的形状是球形的，以提高密封树脂的导热性。 密封树脂的线性膨胀系数α和复弹性弹性模量G *之间的关系定义如下，以减少推动半导体元件的力：α<0.033（G * -451）-0.56。

公开(公告)号：US5532910A

公开(公告)日：1996-07-02

申请号：US502580

申请日：1995-07-14

申请人： Yasutoshi Suzuki ,  Kenichi Ao ,  Yoshimi Yoshino ,  Ryoichi Narita ,  Hiroshi Omi

发明人： Yasutoshi Suzuki ,  Kenichi Ao ,  Yoshimi Yoshino ,  Ryoichi Narita ,  Hiroshi Omi

IPC分类号： C23C18/16 ,  H01G4/228 ,  H01L21/00 ,  H01L23/50 ,  H01L25/00 ,  H01L25/16 ,  H05K1/02 ,  H05K1/18 ,  H05K3/20 ,  H05K3/24 ,  H05K3/32 ,  H05K3/34 ,  H05K5/02

CPC分类号： H01L21/67121 ,  H01L25/16 ,  H05K3/321 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/181 ,  H05K2201/0397 ,  H05K2201/10636 ,  H05K2201/10924 ,  H05K2203/0315 ,  H05K2203/1157 ,  H05K3/202 ,  H05K3/244 ,  Y02P70/611

摘要： A hybrid integrated circuit having a lead frame electrically connected to electronic components by means of a silver (Ag) paste, the hybrid integrated circuit comprising: an electroless-plated coating on the lead frame, the coating being free from an insulating surface oxide layer at least in a connection area in which the electrical connection is provided. A process of producing this hybrid integrated circuit comprises: a first step of electroless-plating a lead frame by using a phosphorus-containing reducing agent to form a coating on the lead frame; a second step of mounting electronic components on the lead frame and then electrically and mechanically connecting the former to the latter by means of an electroconductive paste; and a third step of maintaining the surface of the electroless-plated coating free from a phosphorus-containing oxide layer during the connecting operation.

摘要翻译： 一种混合集成电路，其具有通过银（Ag）糊电连接到电子部件的引线框架，所述混合集成电路包括：引线框架上的无电镀层，所述涂层不含绝缘表面氧化物层 至少在提供电连接的连接区域中。 制造该混合集成电路的方法包括：通过使用含磷还原剂对引线框架进行无电镀以在引线框架上形成涂层的第一步骤; 将电子部件安装在引线框架上，然后通过导电浆料将前者与后者电连接和机械连接的第二步骤; 以及在连接操作期间保持无电镀涂层的表面不含磷的氧化物层的第三步骤。

公开(公告)号：US5150616A

公开(公告)日：1992-09-29

申请号：US575526

申请日：1990-08-31

申请人： Munenari Kondo ,  Masahito Imai ,  Ryoichi Narita ,  Takushi Maeda

发明人： Munenari Kondo ,  Masahito Imai ,  Ryoichi Narita ,  Takushi Maeda

IPC分类号： G01P15/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/09

CPC分类号： G01P15/08 ,  G01P1/023

摘要： A semiconductor strain sensor having a stem with a lead hole in which a lead terminal is installed and electrically coupled to an external circuit. A sensor chip having piezo-resistors to a bride circuit is joined with a front surface of the stem. A shell is joined with the front surface of the stem by projection welding after the back surface of the stem is flattened to within a predetermined limit. A space formed by the shell and stem is filled with a damping liquid. The stem is integrally coupled to the sensor chip through an adhesive, and spacers are added to the adhesive to keep the thickness of the adhesive to a predetermined value. This arrangement can effectively prevent propagation of the welding strain of the stem from adversely affecting the sensor chip.

摘要翻译： 一种半导体应变传感器，其具有带引线孔的杆，引线端子安装在该引线端子中并电耦合到外部电路。 具有新娘电路的压电阻的传感器芯片与杆的前表面相连接。 在杆的后表面平坦化到预定极限之后，壳体通过凸起焊接与杆的前表面接合。 由壳体和杆形成的空间填充有阻尼液体。 杆通过粘合剂一体地联接到传感器芯片，并且将间隔物添加到粘合剂中以将粘合剂的厚度保持在预定值。 这种布置可以有效地防止杆的焊接应变的传播不利地影响传感器芯片。