公开(公告)号：US20120275150A1

公开(公告)日：2012-11-01

申请号：US13457724

申请日：2012-04-27

Applicant: Ryoji YOKOTANI ,  Keiji KIBA

Inventor： Ryoji YOKOTANI ,  Keiji KIBA

IPC: F21V5/04 ,  F21V9/08 ,  F21V21/00 ,  F21V21/005

CPC classification number: F21V5/007 ,  F21V3/0625 ,  F21V3/12 ,  F21V5/04 ,  F21V5/043 ,  F21V7/0091 ,  F21V9/08 ,  F21V13/02 ,  F21V13/12 ,  F21Y2103/10 ,  F21Y2103/33 ,  F21Y2115/10 ,  G02B19/0028 ,  G02B19/0066 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device includes a plurality of solid-state light emitting elements; a board on which the solid-state light emitting elements are arranged in the form of an array; and a light distribution adjusting member for adjusting a distribution of lights outputted from the solid-state light emitting elements. The light distribution adjusting member is provided to commonly cover at least two of the solid-state light emitting elements, and includes an accommodating portion which accommodates the solid-state light emitting elements; a concave curved surface portion provided above light output surfaces of the solid-state light emitting elements and immediately above the solid-state light emitting elements; and a pair of convex curved surface portions which are provided in opposite sides of the concave curved surface portion, each of the convex curved surface portions being smoothly connected to the concave curved surface portion.

Abstract translation: 发光器件包括多个固态发光元件; 固态发光元件以阵列的形式布置在其上的板; 以及用于调节从固体发光元件输出的光的分布的配光调节构件。 光分配调整构件设置成共同地覆盖固态发光元件中的至少两个，并且包括容纳固态发光元件的容纳部分; 设置在固态发光元件的光输出表面上方并紧靠固态发光元件的凹曲面部分; 以及设置在所述凹曲面部的相对侧的一对凸曲面部，所述凸曲面部与所述凹曲面部平滑地连接。

公开(公告)号：US20120274203A1

公开(公告)日：2012-11-01

申请号：US13456334

申请日：2012-04-26

Applicant: Ryoji YOKOTANI

Inventor： Ryoji YOKOTANI

IPC: H01J1/70

CPC classification number: H01L33/505 ,  H01L24/45 ,  H01L33/508 ,  H01L33/54 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A light emitting device includes a solid-state light emitting element; and a wavelength converting member made of a transparent resin containing a fluorescent material, the transparent resin being coated on an output surface of the solid-state light emitting element. The wavelength converting member is formed to have a thickness larger in a vertical direction of the solid-state light emitting element than that in a lateral direction of the solid-state light emitting element in a cross section that is parallel to a light output direction of the solid-state light emitting element and have a zenith in the light output direction.

Abstract translation: 发光器件包括固态发光元件; 以及由包含荧光材料的透明树脂制成的波长转换部件，所述透明树脂被涂覆在所述固态发光元件的输出表面上。 波长转换部件形成为具有与固体发光元件的垂直方向相比在固体发光元件的横向方向上的厚度大于与固体发光元件的光输出方向平行的截面的厚度 该固态发光元件具有在光输出方向上的天顶。

公开(公告)号：US20120153313A1

公开(公告)日：2012-06-21

申请号：US13331028

申请日：2011-12-20

Applicant: Ryoji YOKOTANI ,  Yoji Urano ,  Ikko Kuzuhara ,  Kenichiro Tanaka

Inventor： Ryoji YOKOTANI ,  Yoji Urano ,  Ikko Kuzuhara ,  Kenichiro Tanaka

IPC: H01L33/62 ,  H01L33/08

CPC classification number: H01L33/486 ,  H01L24/45 ,  H01L25/0753 ,  H01L33/507 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/01019 ,  H01L2924/01047 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A light emitting device includes a solid light-emitting element; a mounting substrate mounting the solid light-emitting element thereon; an encapsulating member encapsulating the solid light-emitting element; and a lead frame electrically connected to the solid light-emitting element through a wire. The lead frame is arranged on a rear surface of the mounting substrate, and the mounting substrate includes a front mounting surface on which the solid light-emitting element is mounted. The front mounting surface having a smooth surface region covered with the encapsulating member. The mounting substrate further includes a wire hole through which the wire extends from the front mounting surface of the mounting substrate to the rear surface thereof.

Abstract translation: 发光器件包括固体发光元件; 将固体发光元件安装在其上的安装基板; 封装所述固体发光元件的封装构件; 以及通过线电连接到固体发光元件的引线框架。 引线框布置在安装基板的后表面上，安装基板包括安装有固体发光元件的前安装面。 前安装表面具有被封装构件覆盖的光滑表面区域。 安装基板还包括线，该线从安装基板的前安装表面延伸到其后表面。