摘要:
Provided is lead frame in which a wiring pattern supported by a support piece inside of a one-pitch outer frame section comprises a plurality of base units, each of which comprises a die pad on which a solid-state light emitting element is mounted, a heat sink extending from die pad so as to surround die pad electrically connected to one electrode of the element, and a lead electrically connected to the other electrode of the element. Lead of one base unit among adjacent base units and heat sink of the other base unit are coupled and electrically connected in series. Increase in temperature of the element is inhibited, light output is increased, and cost of a light emitting unit in which a plurality of solid-state light emitting elements connected in series are used is reduced. Also provided are wiring board, light emitting unit, and illuminating apparatus.
摘要:
A light emitting device includes a solid light-emitting element; a mounting substrate mounting the solid light-emitting element thereon; an encapsulating member encapsulating the solid light-emitting element; and a lead frame electrically connected to the solid light-emitting element through a wire. The lead frame is arranged on a rear surface of the mounting substrate, and the mounting substrate includes a front mounting surface on which the solid light-emitting element is mounted. The front mounting surface having a smooth surface region covered with the encapsulating member. The mounting substrate further includes a wire hole through which the wire extends from the front mounting surface of the mounting substrate to the rear surface thereof.
摘要:
A light emitting device includes a solid light-emitting element; a mounting substrate mounting the solid light-emitting element thereon; an encapsulating member encapsulating the solid light-emitting element; and a lead frame electrically connected to the solid light-emitting element through a wire. The lead frame is arranged on a rear surface of the mounting substrate, and the mounting substrate includes a front mounting surface on which the solid light-emitting element is mounted. The front mounting surface having a smooth surface region covered with the encapsulating member. The mounting substrate further includes a wire hole through which the wire extends from the front mounting surface of the mounting substrate to the rear surface thereof.
摘要:
Provided is lead frame in which a wiring pattern supported by a support piece inside of a one-pitch outer frame section comprises a plurality of base units, each of which comprises a die pad on which a solid-state light emitting element is mounted, a heat sink extending from die pad so as to surround die pad electrically connected to one electrode of the element, and a lead electrically connected to the other electrode of the element. Lead of one base unit among adjacent base units and heat sink of the other base unit are coupled and electrically connected in series. Increase in temperature of the element is inhibited, light output is increased, and cost of a light emitting unit in which a plurality of solid-state light emitting elements connected in series are used is reduced. Also provided are wiring board, light emitting unit, and illuminating apparatus.
摘要:
A lighting device is provided in accordance with the present invention having reduced luminance and color unevenness. A plurality of solid-state light emitting elements are mounted on a base substrate. An optical member is further mounted on the substrate and arranged so as to cover light emitting surfaces of the light emitting elements, the optical member having a semicircular or semielliptical cross-sectional surface, and gutter-shaped in a longitudinal direction with respect to the substrate. A wavelength converting member covers the semicircular or semielliptical cross-sectional surface of the optical member, and is excitable by light from the solid-state light emitting elements to thereby emit wavelength-converted light. In various embodiments light diffusion members may be further distributed among the light emitting elements.
摘要:
A lighting device is provided in accordance with the present invention having reduced luminance and color unevenness. A plurality of solid-state light emitting elements are mounted on a base substrate. An optical member is further mounted on the substrate and arranged so as to cover light emitting surfaces of the light emitting elements, the optical member having a semicircular or semielliptical cross-sectional surface, and gutter-shaped in a longitudinal direction with respect to the substrate. A wavelength converting member covers the semicircular or semielliptical cross-sectional surface of the optical member, and is excitable by light from the solid-state light emitting elements to thereby emit wavelength-converted light. In various embodiments light diffusion members may be further distributed among the light emitting elements.
摘要:
A lubricating device for a gear train (5) including a plurality of gears meshing with each other includes a shroud (7) configured to cover the gear train (5) and a housing (9) configured to cover the shroud (7). The shroud (7) includes: an oil supply nozzle (25) configured to supply oil (OL) to a meshing position (21) of the gear train (5); and oil-drain ports (41) through which the oil (OL) is discharged from the shroud. The housing (9) includes, at its lower part, a draw-out port (43) through which the oil (OL) discharged from the oil-drain ports (41) is drawn to the outside of the housing. Guide members (47) are provided between the shroud (7) and the housing (9). The guide members (47) guide the oil (OL) discharged from the respective oil-drain ports (41) of the shroud (7) such that the oil (OL) flows downward through space (S) between the shroud (7) and the housing (9).
摘要:
A lighting device including an LED chip having a light emitting surface, and being configured to emit a light from the light emitting surface, a mounting substrate being configured to mount the LED chip, a first color conversion member including a first light transmissive material and a first phosphor, the first phosphor being excited by the light which is emitted from the LED chip, thereby giving off a first light having a wavelength which is longer than a wavelength of the light emitted from the LED chip, the first color conversion member being directly disposed on the light emitting surface of the LED chip, a second color conversion member including a second light transmissive material and a second phosphor, the second phosphor being excited by the light which is emitted from the LED chip, thereby giving off a second light having a wavelength which is longer than the wavelength of the light emitted from the LED chip, the second color conversion member being shaped to have a dome-shape, wherein the LED chip and the first color conversion member are disposed between the mounting substrate and the second color conversion member.
摘要:
A method for manufacturing a transistor assembly includes the steps of: (a) forming a transistor; (b) polishing a base substrate; and (c) securing the transistor of which the base substrate is polished to a support substrate. The step (a) is a step of forming a first semiconductor layer and a second semiconductor layer on a principle surface of the base substrate. The step (b) is a step of polishing a surface of the base substrate opposite to the principle surface. The step (c) is a step of securing the transistor on the support substrate in the presence of a stress applied on the base substrate in such a direction that a warp of the base substrate is reduced. The base substrate is made of a material different from that of the first semiconductor layer and the second semiconductor layer, and a tensile stress is applied on the second semiconductor layer.
摘要:
A lighting device comprising an LED chip having a light emitting surface, and being configured to emit a light from the light emitting surface, a mounting substrate being configured to mount the LED chip, a first color conversion member comprising a first light transmissive material and a first phosphor, the first phosphor being excited by the light which is emitted from the LED chip, thereby giving off a first light having a wavelength which is longer than a wavelength of the light emitted from the LED chip, the first color conversion member being directly disposed on the light emitting surface of the LED chip, a second color conversion member comprising a second light transmissive material and a second phosphor, the second phosphor being excited by the light which is emitted from the LED chip, thereby giving off a second light having a wavelength which is longer than the wavelength of the light emitted from the LED chip, the second color conversion member being shaped to have a dome-shape, wherein the LED chip and the first color conversion member are disposed between the mounting substrate and the second color conversion member.