公开(公告)号：US20130168134A1

公开(公告)日：2013-07-04

申请号：US13665473

申请日：2012-10-31

申请人： Ryojiro TOMINAGA ,  Kenji Sakai ,  Naoaki Fujii

发明人： Ryojiro TOMINAGA ,  Kenji Sakai ,  Naoaki Fujii

IPC分类号： H05K1/02 ,  H05K3/10 ,  H05K1/11

CPC分类号： H01L23/15 ,  H01L23/49827 ,  H01L2224/16 ,  H05K3/4602 ,  H05K3/4673 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/029 ,  Y10T29/49155

摘要： A printed wiring board includes a core substrate, a first conductive pattern formed on the substrate, an insulation structure having a first insulation layer and formed on the substrate such that the first insulation layer covers the first pattern, a second conductive pattern formed on the structure, and a second insulation layer formed on the structure such that the second insulation layer covers the second pattern. The structure has a via conductor connecting the first and second patterns through the first insulation layer, the first insulation layer includes a first layer containing a reinforcing fiber material and a second layer formed on the first layer such that the first layer is on the substrate side and a second layer is on the second insulation layer side, and the second layer is made of an insulating material which is the same material as an insulating material forming the second insulation layer.

摘要翻译： 印刷布线板包括芯基板，形成在基板上的第一导电图案，具有第一绝缘层并形成在基板上的绝缘结构，使得第一绝缘层覆盖第一图案，形成在该结构上的第二导电图案 以及形成在所述结构上的第二绝缘层，使得所述第二绝缘层覆盖所述第二图案。 该结构具有通过第一绝缘层连接第一和第二图案的通孔导体，第一绝缘层包括含有增强纤维材料的第一层和形成在第一层上的第二层，使得第一层位于衬底侧 并且第二层位于第二绝缘层侧，第二层由与形成第二绝缘层的绝缘材料相同的材料的绝缘材料制成。

公开(公告)号：US20130192879A1

公开(公告)日：2013-08-01

申请号：US13560239

申请日：2012-07-27

申请人： Haruhiko MORITA ,  Ryojiro TOMINAGA ,  Atsushi ISHIDA ,  Satoshi WATANABE

发明人： Haruhiko MORITA ,  Ryojiro TOMINAGA ,  Atsushi ISHIDA ,  Satoshi WATANABE

IPC分类号： H05K1/11 ,  H05K3/10

CPC分类号： H05K1/115 ,  H05K3/10 ,  H05K3/4602 ,  H05K3/4655 ,  Y10T29/49155

摘要： A multilayer printed wiring board has a core substrate including first insulation layers, first conductive patterns formed on the first insulation layers, and first via conductors formed through the first insulation layers and connecting the first conductive patterns, and a buildup layer formed on the core substrate and including second insulation layers, second conductive patterns formed on the second insulation layers, and second via conductors formed through the second insulation layers and connecting the second conductive patterns. Each of the first insulation layers includes an inorganic reinforcing fiber material, each of the second insulation layers does not include an inorganic reinforcing fiber material, and the core substrate includes an inductor having the first conductive patterns and the first via conductors.

摘要翻译： 多层印刷电路板具有芯基板，其包括第一绝缘层，形成在第一绝缘层上的第一导电图案和通过第一绝缘层形成并连接第一导电图案的第一通孔导体以及形成在芯基板上的积层 并且包括第二绝缘层，形成在第二绝缘层上的第二导电图案，以及通过第二绝缘层形成并连接第二导电图案的第二通孔导体。 每个第一绝缘层包括无机增强纤维材料，每个第二绝缘层不包括无机增强纤维材料，并且芯基板包括具有第一导电图案和第一通孔导体的电感器。