公开(公告)号：US08624132B2

公开(公告)日：2014-01-07

申请号：US13109745

申请日：2011-05-17

申请人： Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

发明人： Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

IPC分类号： H05K1/11

CPC分类号： H05K3/3478 ,  B23K3/0623 ,  B23K2101/42 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/544 ,  H01L24/81 ,  H01L2223/54473 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/3452 ,  H05K2201/0191 ,  H05K2201/099 ,  H05K2203/041 ,  H05K2203/0557 ,  H01L2924/00 ,  H01L2224/05599

摘要： A printed wiring board including a wiring substrate provided with at least one conductor circuit, a solder resist layer provided on the surface of the wiring substrate, at least one conductor pad formed from a part of the conductor circuit exposed from an opening provided in the solder resist layer, and at least one solder bump for mounting electronic parts on the conductor pad. In the printed wiring board, since the at least one conductor pad is aligned at a pitch of about 200 μm or less, and a ratio (W/D) of a diameter W of the solder bump to an opening diameter D of the opening formed in the solder resist layer is about 1.05 to about 1.7, connection reliability and insulation reliability can be easily improved.

摘要翻译： 一种印刷电路板，包括设置有至少一个导体电路的布线基板，设置在所述布线基板的表面上的阻焊层，至少一个导体焊盘，所述导体焊盘由设置在所述焊料中的开口露出的所述导体电路的一部分形成 抗蚀剂层和用于将电子部件安装在导体焊盘上的至少一个焊料凸块。 在印刷布线板中，由于至少一个导体焊盘以约200μm或更小的间距对准，并且焊料凸块的直径W与形成的开口的开口直径D的比（W / D） 在阻焊层中约1.05〜约1.7，可以容易地提高连接可靠性和绝缘可靠性。

公开(公告)号：US08198546B2

公开(公告)日：2012-06-12

申请号：US11944498

申请日：2007-11-23

申请人： Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

发明人： Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

IPC分类号： H05K1/16

CPC分类号： H01L21/4846 ,  H01L21/563 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/381 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0278 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T428/2804 ,  Y10T428/31511 ,  Y10T428/31681 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of manufacturing a printed wiring board includes preparing a wiring substrate having a conductive circuit, coating a solder-resist layer over the conductive circuit, leveling a surface of the solder-resist layer so as to obtain a maximum surface roughness in a predetermined range, removing the resin film from the surface of the solder-resist layer, and forming multiple openings in the surface of the solder-resist layer to expose multiple portions of the conductive circuit so as to form multiple conductive pads for mounting an electronic components.

摘要翻译： 一种制造印刷电路板的方法包括制备具有导电电路的布线基板，在导电电路上涂覆阻焊层，使阻焊层的表面平整，以获得预定范围内的最大表面粗糙度 从阻焊层的表面除去树脂膜，在阻焊层的表面形成多个开口以暴露导电电路的多个部分，以形成用于安装电子部件的多个导电焊盘。

公开(公告)号：US20110247208A1

公开(公告)日：2011-10-13

申请号：US13167305

申请日：2011-06-23

申请人： Tomoyuki IKEDA ,  Naoaki Fujii ,  Seiji Izawa

发明人： Tomoyuki IKEDA ,  Naoaki Fujii ,  Seiji Izawa

IPC分类号： H05K3/40

CPC分类号： H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/3011 ,  H05K1/112 ,  H05K1/115 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24322 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of manufacturing a multilayered printed wiring board including forming a multilayered core substrate including insulation layers and one or more stacked via structures formed through the insulation layers, the stacked via structure including vias formed in the insulation layers, respectively, the insulation layers in the multilayered core substrate including at least three insulation layers and each of the insulation layers in the multilayered core substrate including a core material impregnated with a resin, and forming a build-up structure over the multilayered core substrate and including interlaminar insulation layers and conductor circuits, each of the interlaminar insulation layers including a resin material without a core material.

摘要翻译： 一种制造多层印刷布线板的方法，包括形成包括绝缘层和通过绝缘层形成的一个或多个堆叠的通孔结构的多层芯基板，分别形成在绝缘层中的通孔的堆叠通孔结构分别包括在绝缘层中的绝缘层 所述多层芯基板包括至少三个绝缘层，所述多层芯基板中的每个所述绝缘层包括浸渍有树脂的芯材，并且在所述多层芯基板上形成堆积结构，并且包括层间绝缘层和导体电路， 每个层间绝缘层包括没有芯材的树脂材料。

公开(公告)号：US08017875B2

公开(公告)日：2011-09-13

申请号：US11476559

申请日：2006-06-29

申请人： Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

发明人： Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

IPC分类号： H05K1/16

CPC分类号： H05K3/3478 ,  B23K3/0623 ,  B23K2101/42 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/544 ,  H01L24/81 ,  H01L2223/54473 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/3452 ,  H05K2201/0191 ,  H05K2201/099 ,  H05K2203/041 ,  H05K2203/0557 ,  H01L2924/00 ,  H01L2224/05599

摘要： A printed wiring board includes a wiring substrate, one or more conductor circuits provided on the wiring substrate, a solder resist layer provided on a surface of the wiring substrate and having multiple openings, the openings exposing multiple parts of the conductor circuits forming multiple conductor pads for mounting electronic parts, and multiple solder bumps formed on the conductor pads, respectively. The conductor pads are aligned at a pitch of about 200 μm or less, and a ratio W/D of a diameter W of the solder bumps to an opening diameter D of the openings formed in the solder resist layer is about 1.05 to about 1.7.

摘要翻译： 印刷电路板包括布线基板，设置在布线基板上的一个或多个导体电路，设置在布线基板的表面上并具有多个开口的阻焊层，所述开口暴露导体电路的多个部分，形成多个导体焊盘 用于安装电子部件，以及形成在导体焊盘上的多个焊料凸块。 导体焊盘以约200μm以下的间距排列，并且焊料凸块的直径W与形成在阻焊层中的开口的开口直径D的比率W / D为约1.05至约1.7。

公开(公告)号：US07935893B2

公开(公告)日：2011-05-03

申请号：US12351929

申请日：2009-01-12

申请人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

发明人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

IPC分类号： H05K1/16

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L24/82 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K1/0231 ,  H05K1/188 ,  H05K3/382 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed wiring board is manufactured by a method in which a laminate body having a first insulation layer and a conductive film is provided. An alignment mark is formed in the laminate body by removing at least a portion of the conductive film. An electronic component is placed on an adhesive layer provided on the first insulation layer at a position determined based on the alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.

摘要翻译： 通过提供具有第一绝缘层和导电膜的层叠体的方法制造印刷线路板。 通过去除导电膜的至少一部分，在层压体中形成对准标记。 将电子部件放置在基于对准标记确定的位置上设置在第一绝缘层上的粘合剂层上。 在将电子部件封装在第二绝缘层的开口内之后，在基于用于确定电子部件的位置的对准标记确定的位置处形成暴露电子部件的端子的通孔。 通孔导体形成在通孔中，导电层形成在导电膜上并被图案化以形成连接到通孔导体的导电电路。

公开(公告)号：US07795295B2

公开(公告)日：2010-09-14

申请号：US11631564

申请日：2005-06-30

申请人： Rodney Kiplin Guy ,  Naoaki Fujii ,  Liang You ,  David M. Jablons

发明人： Rodney Kiplin Guy ,  Naoaki Fujii ,  Liang You ,  David M. Jablons

IPC分类号： A61K31/415 ,  C07D413/00 ,  C07D279/10

CPC分类号： C07D209/12 ,  C07B2200/11 ,  C40B40/00 ,  Y10T436/24

摘要： Novel compounds that have been found effective in inhibiting PDZ domain interactions, and particularly interactions of PDZ domains in MAGIs with the oncogenic (tumor suppressor) protein PTEN and interactions between the PDZ domain in the Dishevelled (Dvl) protein and other proteins such as the Frizzled (Fz) protein, have the general formula (I) or (III) The invention also includes combinatorial libraries, arrays and methods for screening and studying proteins using such compounds. Compounds of the invention have produced apoptosis in certain cell lines that overexpress the Dishevelled protein (Dvl), inhibiting Wnt signaling.

摘要翻译： 已经发现已经发现有效抑制PDZ结构域相互作用的新型化合物，特别是MAGI中PDZ结构域与致癌（肿瘤抑制基因）蛋白PTEN的相互作用以及Dishedvelled（Dvl）蛋白质中的PDZ结构域和其它蛋白质之间的相互作用 （Fz）蛋白，具有通式（I）或（III）本发明还包括用于筛选和研究使用这些化合物的蛋白质的组合文库，阵列和方法。 本发明化合物在过表达蛋白质（Dv1）的某些细胞系中产生凋亡，抑制Wnt信号传导。

公开(公告)号：US20100065323A1

公开(公告)日：2010-03-18

申请号：US12622049

申请日：2009-11-19

申请人： Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

发明人： Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

IPC分类号： H05K1/11

CPC分类号： H05K3/3478 ,  B23K3/0623 ,  B23K2101/42 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/544 ,  H01L24/81 ,  H01L2223/54473 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/3452 ,  H05K2201/0191 ,  H05K2201/099 ,  H05K2203/041 ,  H05K2203/0557 ,  H01L2924/00 ,  H01L2224/05599

摘要： A printed wiring board comprises a wiring substrate provided with at least one conductor circuit, a solder resist layer provided on the surface of the wiring substrate, at least one conductor pad formed from a part of the conductor circuit exposed from an opening provided in the solder resist layer, and at least one solder bump for mounting electronic parts on the conductor pad. In the printed wiring board, since the at least one conductor pad is aligned at a pitch of about 200 μm or less, and a ratio (W/D) of a diameter W of the solder bump to an opening diameter D of the opening formed in the solder resist layer is about 1.05 to about 1.7, connection reliability and insulation reliability can be easily improved.

摘要翻译： 一种印刷电路板，包括配置有至少一个导体电路的布线基板，设置在布线基板的表面上的阻焊层，至少一个导体焊盘，由导体电路的一部分露出， 抗蚀剂层和用于将电子部件安装在导体焊盘上的至少一个焊料凸块。 在印刷电路板中，由于至少一个导体焊盘以约200μm以下的间距排列，并且焊料凸块的直径W与形成的开口的开口直径D的比（W / D） 在阻焊层中约1.05〜约1.7，可以容易地提高连接可靠性和绝缘可靠性。

公开(公告)号：US20070096327A1

公开(公告)日：2007-05-03

申请号：US11476557

申请日：2006-06-29

申请人： Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

发明人： Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/3478 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/3452 ,  H05K2201/0191 ,  H05K2201/099 ,  H05K2203/041 ,  H05K2203/0557 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599

摘要： A printed wiring board comprises a wiring substrate provided with at least one conductor circuit, a solder resist layer formed on the surface of the wiring substrate, covering the at least one conductor circuit, conductor pads formed on a part of the at least one conductor circuit exposed from respective openings provided in the solder resist layer for mounting electronic parts, and solder bumps formed on the respective conductor pads. Connection reliability and insulation reliability are easily improved by making the ratio (H/D) of a height H from solder resist layer surface the solder bump to an opening diameter of the opening about 0.55 to about 1.0 even in narrow pitch structure under the pitch of the opening provided in the solder resist layer of about 200 μm or less.

摘要翻译： 一种印刷电路板，包括设置有至少一个导体电路的布线基板，形成在所述布线基板的表面上的阻焊层，覆盖所述至少一个导体电路，形成在所述至少一个导体电路的一部分上的导体焊盘 从设置在用于安装电子部件的阻焊层中的各个开口露出，以及形成在各个导体焊盘上的焊料凸块。 通过使窄阻抗层的高度H与焊锡凸块的比例（H / D）在开口直径大约0.55至1.0左右，在窄间距结构下，在距离 设置在阻焊层中的开口约为200μm以下。

公开(公告)号：US20050043371A1

公开(公告)日：2005-02-24

申请号：US10959171

申请日：2004-10-07

申请人： Kiyoshi Taniguchi ,  Naoaki Fujii ,  Minoru Sakurai ,  Yasuyo Tomishima ,  Hisashi Takasugi

发明人： Kiyoshi Taniguchi ,  Naoaki Fujii ,  Minoru Sakurai ,  Yasuyo Tomishima ,  Hisashi Takasugi

IPC分类号： C07C215/54 ,  C07C217/30 ,  C07C217/60 ,  C07C217/62 ,  C07C217/72 ,  C07C217/86 ,  C07C229/38 ,  C07C233/43 ,  C07C237/08 ,  C07C271/28 ,  C07C275/40 ,  C07C311/08 ,  C07C317/28 ,  C07C317/32 ,  C07C323/25 ,  C07C323/32 ,  C07D209/08 ,  C07D213/38 ,  C07D213/64 ,  C07D213/65 ,  C07D213/73 ,  C07D213/75 ,  C07D235/26 ,  A61K31/445 ,  A61K31/165 ,  A61K31/18 ,  A61K31/235 ,  A61K31/40 ,  C07D213/55

CPC分类号： C07D209/08 ,  C07C215/54 ,  C07C217/30 ,  C07C217/60 ,  C07C217/62 ,  C07C217/72 ,  C07C217/86 ,  C07C229/38 ,  C07C233/43 ,  C07C237/08 ,  C07C271/28 ,  C07C275/40 ,  C07C311/08 ,  C07C317/28 ,  C07C317/32 ,  C07C323/25 ,  C07C323/32 ,  C07D213/38 ,  C07D213/64 ,  C07D213/65 ,  C07D213/73 ,  C07D213/75 ,  C07D235/26

摘要： This invention relates to new aminoalcohol derivatives or salts thereof represented by the following formula [I]: wherein each symbol is as defined in the specification or salts thereof which have gut selective sympathomimetic, anti-ulcerous, anti-pancreatitis, lipolytic, anti-urinary incontinence and anti-pollakiuria activities, to processes for the preparation thereof, to a pharmaceutical composition comprising the same and to a method for the prevention and/or treatment diseases indicated in the specification to a human being or an animal.

摘要翻译： 本发明涉及由下式[I]表示的新的氨基醇衍生物或其盐：其中每个符号如说明书或其盐中所定义，其具有肠选择性交感神经兴奋剂，抗溃疡性，抗胰腺炎，脂肪分解，抗尿液 失禁和抗尿频活动，其制备方法，包含其的药物组合物，以及用于预防和/或治疗本说明书中对人或动物表示的疾病的方法。

公开(公告)号：US06635634B2

公开(公告)日：2003-10-21

申请号：US10074020

申请日：2002-02-14

申请人： Kiyoshi Taniguchi ,  Minoru Sakurai ,  Naoaki Fujii ,  Kumi Hosoi ,  Yasuyo Tomishima ,  Hisashi Takasugi ,  Hajime Sogabe ,  Hirofumi Ishikawa ,  Naomi Hanioka

发明人： Kiyoshi Taniguchi ,  Minoru Sakurai ,  Naoaki Fujii ,  Kumi Hosoi ,  Yasuyo Tomishima ,  Hisashi Takasugi ,  Hajime Sogabe ,  Hirofumi Ishikawa ,  Naomi Hanioka

IPC分类号： A61K3154

摘要： This invention relates to new propanolamine derivatives or salts thereof represented by the following formula [I]: Wherein each symbol is as defined in the specification or salts thereof which have gut selective sympathomimetic, anti-ulcerous, anti-pancreatitis, lipolytic, anti-urinary incontinence and anti-pollakiuria activities, to processes for the preparation thereof, to a pharmaceutical composition comprising the same and to a method for the prevention and/or treatment diseases indicated in the specification to a human being or an animal.