公开(公告)号：US4842959A

公开(公告)日：1989-06-27

申请号：US107944

申请日：1987-10-13

申请人： Ryu Maeda ,  Shingoro Fukuoka ,  Hiroshi Yatabe

发明人： Ryu Maeda ,  Shingoro Fukuoka ,  Hiroshi Yatabe

IPC分类号： H05K1/05

CPC分类号： H05K1/053 ,  Y10S428/901 ,  Y10T428/12597 ,  Y10T428/12736 ,  Y10T428/12757

摘要： This invention provides an aluminum enamel board having an electrically insulating glass layer formed on an Al-Si alloy plate containing at least 5 wt % of Si or a composite metal plate having an aluminum or alloy layer formed on at least one side of a metal plate made of a metal other than aluminum. Since the Al-Si alloy plate containing at least 5 wt % of Si or a composite metal plate having the aluminum or aluminum alloy layer is used as a board, the adhesion strength between the metal plate and the electrically insulating glass layer can be increased. At the same time, a predetermined material is used to form the electrically insulating glass layer, thereby minimizing a difference in thermal conductivity and thermal expansion coefficient between the electrically insulating glass layer and the metal plate. This improves the heat conduction characteristics of the board and prevents warping of the board.

摘要翻译： 本发明提供一种铝搪瓷板，其具有在包含至少5重量％的Si的Al-Si合金板上形成的电绝缘玻璃层或具有在金属板的至少一侧上形成的铝或合金层的复合金属板 由铝以外的金属制成。 由于使用含有至少5重量％的Si的Al-Si合金板或具有铝或铝合金层的复合金属板作为基板，所以可以提高金属板和电绝缘玻璃层之间的粘附强度。 同时，使用预定的材料形成电绝缘玻璃层，从而最小化电绝缘玻璃层和金属板之间的导热性和热膨胀系数的差异。 这样可以改善电路板的导热特性，防止电路板翘曲。

公开(公告)号：US4894184A

公开(公告)日：1990-01-16

申请号：US043096

申请日：1987-04-27

申请人： Shingoro Fukuoka ,  Kouichi Shintomi ,  Ryu Maeda ,  Kaisuke Shiroyama

发明人： Shingoro Fukuoka ,  Kouichi Shintomi ,  Ryu Maeda ,  Kaisuke Shiroyama

IPC分类号： C09D5/24 ,  H01B1/16 ,  H05K1/09

CPC分类号： H05K1/092 ,  H01B1/16

摘要： A low-temperature burnt conductive paste prepared by dispersing, in an organic vehicle, a base material comprising 50 to 95% by weight of a powder of at least one conductive material selected from the group consisting of a copper alloy, a copper oxide and a copper alloy oxide and 5 to 50% by weight of a glass powder having a softening point of 300.degree. to 600.degree. C. and a coefficient of thermal expansion of 6 to 13.times.10.sup.-6 .degree.C..sup.-1, and a method of manufacturing a printed circuit board using this paste.

摘要翻译： 一种低温烧制导电膏，其通过在有机载体中分散包含50至95重量％的至少一种选自铜合金，氧化铜和 铜合金氧化物和5〜50重量％的软化点为300〜600℃，热膨胀系数为6〜13×10 -6℃-1的玻璃粉末，以及制造方法 印刷电路板使用这种膏。

公开(公告)号：US5624268A

公开(公告)日：1997-04-29

申请号：US590078

申请日：1996-01-17

申请人： Ryu Maeda ,  Akira Tateishi ,  Shunsuke Tazai

发明人： Ryu Maeda ,  Akira Tateishi ,  Shunsuke Tazai

IPC分类号： H01R11/01 ,  H01L23/498 ,  H01R4/18 ,  H01R13/24 ,  H01R43/00 ,  H05K3/32 ,  H01R9/09

CPC分类号： H01L23/49827 ,  H01R13/2414 ,  H05K3/325 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079

摘要： This invention presents a new anisotropic conductive film for conductive connections, its method of manufacture, and connectors which use the same, which reduces the connection resistance of semiconductor and similar devices, to the circuit substrates, and simultaneously simplifies the repair. Copper foil 2 is bonded on both sides to an electrical insulating film 3. Holes are formed in the copper foil 2 by etching, and through-holes 5 are formed in the aforesaid electrical insulating film 3, using copper foil 2 as a mask for etching. Next, the through-holes 5 are filled with a conductive elastomer 6, and hardened. The copper foil 2 is then etched to form protuberances 4 of elastomer 6 having the same viscosity. The conducting elastomer 6 protuberance 4 on one side makes contact with the semiconductor device pad, while the protuberance 4 on the other side makes contact with the substrate-side pad. A conductive connection is made by pressing both together.

摘要翻译： 本发明提出了一种用于导电连接的新的各向异性导电膜，其制造方法和使用它们的连接器，其将半导体和类似器件的连接电阻降低到电路基板，并且同时简化了修复。 铜箔2的两面粘合到电绝缘膜3上。通过蚀刻在铜箔2中形成孔，并且使用铜箔2作为蚀刻掩模在上述电绝缘膜3中形成通孔5 。 接下来，通孔5填充有导电弹性体6，并硬化。 然后蚀刻铜箔2以形成具有相同粘度的弹性体6的突起4。 一方的导电弹性体6突起4与半导体器件焊盘接触，而另一侧的突起4与衬底侧焊盘接触。 通过一起按压导电连接。

公开(公告)号：US6152744A

公开(公告)日：2000-11-28

申请号：US310721

申请日：1999-05-12

申请人： Ryu Maeda

发明人： Ryu Maeda

IPC分类号： H01R33/76 ,  G01R1/04 ,  G01R31/28 ,  H01L23/32 ,  H05K3/32 ,  H01R12/00

CPC分类号： G01R31/2863 ,  G01R1/0483 ,  H05K3/326

摘要： Disclosed is an improved integrated circuit socket having electrically conductive pads formed on a resilient circuitry component for contacting the terminals of an integrated circuit (IC) package which is positioned on the resilient circuitry. The electrically conductive pads are arranged around the center area of the resilient circuitry to be in one-to-one correspondence with the terminals of the IC package. The electrically conductive pads have individual circuit paths of substantially the same length and which are extending outwardly from the center area of the flexible circuitry, and additional electrically conductive pads are formed on the back side of the flexible circuitry in order to effect the required electrical connections to exterior circuits. These electrically conductive pads on the back side are connected to the conductor pattern on the front side by conductive through holes or vias. With this arrangement all conductors have the same, reduced inductance. An insulative apertured film is preferably positioned intermediate the IC package and the flexible circuitry having the electrically conductive pads in order to perform certain alignment and pressure application functions.

摘要翻译： 公开了一种改进的集成电路插座，其具有形成在弹性电路部件上的导电焊盘，用于接触位于弹性电路上的集成电路（IC）封装的端子。 导电焊盘围绕弹性电路的中心区域布置成与IC封装的端子一一对应。 导电焊盘具有基本上相同长度的单独的电路路径，并且从柔性电路的中心区域向外延伸，并且在柔性电路的背面上形成附加的导电焊盘，以便实现所需的电连接 到外部电路。 背侧的这些导电焊盘通过导电通孔或通孔连接到前侧的导体图案。 通过这种安排，所有的导体都具有相同的电感。 绝缘多孔膜优选地位于IC封装之间，并且柔性电路具有导电焊盘，以便执行某些对准和压力施加功能。