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公开(公告)号：US10999684B1
公开(公告)日：2021-05-04
申请号：US16745429
申请日：2020-01-17
发明人： Lik Hang Ken Wan , Masashi Shiraishi , Akio Nakao
摘要： A MEMS microphone includes a MEMS transducer, a sealing cover, and a package substrate. The MEMS transducer includes an element substrate, a plurality of cantilevered beams, and a weight. An airtight sealing structure is formed with the sealing cover and the package substrate, which is formed by mounting the MEMS transducer on the package substrate, and adhering the sealing cover to the package substrate so as to surround the MEMS transducer.
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公开(公告)号：US10934159B2
公开(公告)日：2021-03-02
申请号：US16429132
申请日：2019-06-03
发明人： Masashi Shiraishi , Akio Nakao
摘要： A MEMS package has a MEMS chip, a package substrate, a dammed-seal part. The MEMS chip has an element substrate which a movable element is formed, the element substrate has an element hole-part which the movable element is arranged. The dammed-seal part has an annular dam-member which is formed on the element substrate so as to surround the element hole-part and a gel member. The gel member is formed by hardening of gel which is applied on the annular dam-member.
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3.发明申请公开(公告)号：US20200377364A1
公开(公告)日：2020-12-03
申请号：US16429132
申请日：2019-06-03
发明人： Masashi Shiraishi , Akio Nakao
摘要： A MEMS package has a MEMS chip, a package substrate, a dammed-seal part. The MEMS chip has an element substrate which a movable element is formed, the element substrate has an element hole-part which the movable element is arranged. The dammed-seal part has an annular dam-member which is formed on the element substrate so as to surround the element hole-part and a gel member. The gel member is formed by hardening of gel which is applied on the annular dam-member.
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公开(公告)号：US10785576B1
公开(公告)日：2020-09-22
申请号：US16398301
申请日：2019-04-30
发明人： Akio Nakao , Masashi Shiraishi
摘要： A MEMS package has a MEMS chip, a package substrate, a dammed-seal part. The MEMS chip has an element substrate which a movable element is formed, the package substrate has a sound hole. The dammed-seal part has an annular dam-member which is formed on the element substrate so as to surround the movable element, and a gel member. The MEMS chip is mounted on the package substrate so that the movable element opposes to the sound hole. The gel member is formed by hardening of gel which is applied on the annular dam-member from outside so as to surround the annular dam-member.
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公开(公告)号：US09848496B2
公开(公告)日：2017-12-19
申请号：US14978709
申请日：2015-12-22
发明人： Akio Nakao
CPC分类号： H05K3/284 , H01L21/561 , H01L21/568 , H01L23/552 , H01L24/97 , H01L2924/15159 , H01L2924/15313 , H05K1/0218 , H05K3/0097 , H05K2201/0317 , H05K2201/0715 , H05K2201/09145 , H05K2201/09845
摘要： An electronic component module includes a substrate; at least one electronic component mounted on an electronic component mounting surface of the substrate; an insulating body covering the electronic component on the electronic component mounting surface of the substrate; and a metal film formed by sputtering, the metal film covering at least one exterior surface of the insulating body and at least one side surface of the substrate. The substrate has a recess portion formed on a periphery of the surface of the substrate that is opposite to the electronic component mounting surface, and the recess portion has a top surface parallel to the electronic component mounting surface and a side surface perpendicular to the top surface, and the metal film is extended to cover the top surface of the recess portion, without covering the side surface thereof. It obtains improved electromagnetic wave shielding effect and improved manufacturing efficiency.
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公开(公告)号：US09392701B2
公开(公告)日：2016-07-12
申请号：US14289932
申请日：2014-05-29
发明人： Akio Nakao , Hidenobu Takemoto
CPC分类号： H05K3/284 , H01L2924/3025 , H05K1/0216 , H05K9/0024 , H05K9/0045 , H05K2201/0209 , H05K2201/0242 , H05K2201/2072
摘要： An electronic component package includes a substrate having at least one electronic circuit; a sealing resin for sealing the electronic circuit, at least one filler on which at least one crack is formed being filled in the sealing; and a metal film formed on a top surface of the sealing resin, a root of the metal film being embedded in the crack on the filler. The electronic component package can shield the environmental electromagnetic noise and satisfy with lightweight requirement for the integrated circuit modules.
摘要翻译： 电子部件封装包括具有至少一个电子电路的基板; 用于密封电子电路的密封树脂，至少一个其上形成有至少一个裂纹的填料被填充在密封中; 以及形成在密封树脂的顶表面上的金属膜，金属膜的根部嵌入在填料上的裂纹中。 电子元件封装可以屏蔽环境电磁噪声，满足集成电路模块的轻量化要求。
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