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公开(公告)号:US20170358449A1
公开(公告)日:2017-12-14
申请号:US15466330
申请日:2017-03-22
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor: Byung Soo So , Mee Jae Kang , Ho Seok Lee , Jae Gyun Lim , Sang Ho Jeon , Yeon Hee Jeon
CPC classification number: H01L21/02675 , H01L21/67115 , H01L27/1274 , H01S3/005 , H01S3/03 , H01S3/0346 , H01S3/038 , H01S3/0407 , H01S3/041 , H01S3/0971 , H01S3/225
Abstract: A laser crystallization method includes exciting gas medium in an airtight container to generate laser beams; amplifying the laser beams by reflecting the laser beams between a high reflection mirror and a low reflection mirror respectively disposed facing opposite end portions of the airtight container, wherein a first transparent window and a second transparent window are fixed to respective end portions of the airtight container, and outputting the amplified laser beams; and disposing a cleaning mirror in a path of the laser beams that have propagated through the second transparent window.
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公开(公告)号:US11087980B2
公开(公告)日:2021-08-10
申请号:US15466330
申请日:2017-03-22
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor: Byung Soo So , Mee Jae Kang , Ho Seok Lee , Jae Gyun Lim , Sang Ho Jeon , Yeon Hee Jeon
IPC: H01L21/02 , H01S3/034 , H01L21/67 , H01L27/12 , H01S3/00 , H01S3/03 , H01S3/038 , H01S3/0971 , H01S3/225 , H01S3/04 , H01S3/041
Abstract: A laser crystallization method includes exciting gas medium in an airtight container to generate laser beams; amplifying the laser beams by reflecting the laser beams between a high reflection mirror and a low reflection mirror respectively disposed facing opposite end portions of the airtight container, wherein a first transparent window and a second transparent window are fixed to respective end portions of the airtight container, and outputting the amplified laser beams; and disposing a cleaning mirror in a path of the laser beams that have propagated through the second transparent window.
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公开(公告)号:US11942481B2
公开(公告)日:2024-03-26
申请号:US17510995
申请日:2021-10-26
Applicant: Samsung Display Co., LTD.
Inventor: Dong-Sung Lee , Jongoh Seo , Byung Soo So , Dong-min Lee , Yeon Hee Jeon , Jonghoon Choi
IPC: H01L21/00 , H01L21/02 , H01L27/12 , H01L29/04 , H01L29/786
CPC classification number: H01L27/1222 , H01L21/02592 , H01L21/02675 , H01L27/1274 , H01L29/045 , H01L29/78675
Abstract: A display device may include a thin film transistor disposed on a substrate, and a display element electrically connected to the thin film transistor. The thin film transistor may include an active pattern including polycrystalline silicon, a gate insulation layer disposed on the active pattern, and a gate electrode disposed on the gate insulation layer. An average value of grain sizes of the active pattern may be in a range of about 400 nm to about 800 nm. An RMS value of a surface roughness of the active pattern may be about 4 nm or less. A method of manufacturing a polycrystalline silicon layer may include cleaning an amorphous silicon layer with hydrofluoric acid, rinsing the amorphous silicon layer with hydrogenated deionized water, and irradiating the amorphous silicon layer with a laser beam having an energy density of about 440 mJ/cm2 to about 490 mJ/cm2.
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公开(公告)号:US11183515B2
公开(公告)日:2021-11-23
申请号:US16821484
申请日:2020-03-17
Applicant: Samsung Display Co., LTD.
Inventor: Dong-Sung Lee , Jongoh Seo , Byung Soo So , Dong-min Lee , Yeon Hee Jeon , Jonghoon Choi
IPC: H01L21/00 , H01L27/12 , H01L29/786 , H01L21/02 , H01L29/04
Abstract: A display device may include a thin film transistor disposed on a substrate, and a display element electrically connected to the thin film transistor. The thin film transistor may include an active pattern including polycrystalline silicon, a gate insulation layer disposed on the active pattern, and a gate electrode disposed on the gate insulation layer. An average value of grain sizes of the active pattern may be in a range of about 400 nm to about 800 nm. An RMS value of a surface roughness of the active pattern may be about 4 nm or less. A method of manufacturing a polycrystalline silicon layer may include cleaning an amorphous silicon layer with hydrofluoric acid, rinsing the amorphous silicon layer with hydrogenated deionized water, and irradiating the amorphous silicon layer with a laser beam having an energy density of about 440 mJ/cm2 to about 490 mJ/cm2.
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