公开(公告)号：US20150230335A1

公开(公告)日：2015-08-13

申请号：US14618681

申请日：2015-02-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Jik LEE ,  Jin Gu KIM ,  Myung Jae YOO ,  Ichiro OGURA ,  Hye Suk SHIN

IPC: H05K1/05 ,  H05K3/38 ,  H05K1/03

CPC classification number: H05K1/0373 ,  H05K1/0366 ,  H05K3/022 ,  H05K3/381 ,  H05K2201/0209 ,  H05K2201/0233 ,  Y10T428/2495 ,  Y10T428/31678

Abstract: Embodiments of the invention provide a copper clad laminate, and more particularly, to a copper clad laminate and a method for manufacturing the same capable of increasing a peel strength by adding a stress relaxation filler to an insulating layer of a copper clad laminate, along with an inorganic filler. To improve an adhesion of a substrate, the stress relaxation filler is distributed into the resin, along with the inorganic filler, and is entirely distributed into the varnish, and is more effectively added to the vicinity of a bonded interface between the insulating layer and the copper clad layer, thereby improving the overall adhesion.

Abstract translation: 本发明的实施方案提供一种覆铜层压板，更具体地说，涉及覆铜层压板及其制造方法，其能够通过向覆铜层压板的绝缘层添加应力松弛填料而提高剥离强度，以及 无机填料。 为了提高基材的粘附性，应力松弛填料与无机填料一起分配到树脂中，并且完全分散在清漆中，并且更有效地添加到绝缘层和绝缘层之间的键合界面附近 铜包覆层，从而提高整体粘合性。

公开(公告)号：US20190122977A1

公开(公告)日：2019-04-25

申请号：US15989564

申请日：2018-05-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Hwa PARK ,  Ichiro OGURA

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49894 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/564 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/18 ,  H01L2924/0001

Abstract: A semiconductor package includes: a semiconductor chip having connection pads; a connection member having a first surface on which the semiconductor chip is disposed and a second surface opposing the first surface and including an insulating member and a redistribution layer formed on the insulating member and electrically connected to the connection pads; an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip; and a barrier layer disposed on the second surface of the connection member and including an organic layer containing fluorine.

公开(公告)号：US20160130394A1

公开(公告)日：2016-05-12

申请号：US14824487

申请日：2015-08-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hoe Chul JUNG ,  Jun Young KIM ,  In Cheol CHANG ,  Ichiro OGURA ,  Seung Hyun KANG

IPC: C08G65/38 ,  H04N5/225

CPC classification number: C08G65/38 ,  C08G63/547 ,  C08G64/045 ,  C08G65/405 ,  H04N5/2254

Abstract: An isoflavone-based polymer, a lens containing the isoflavone-based polymer, and a camera module including the lens are provided. The isoflavone-based polymer includes an isoflavone-based skeleton in a main chain thereof, and includes at least one linking group selected from the group consisting of an ester group and a carbonate group. Whereby, the isoflavone-based polymer exhibits excellent optical properties.

Abstract translation: 提供了基于异黄酮的聚合物，含有异黄酮类聚合物的透镜和包括该透镜的相机模块。 异黄酮类聚合物在其主链中含有异黄酮类骨架，并且包括选自酯基和碳酸酯基中的至少一种连接基团。 由此，基于异黄酮的聚合物显示出优异的光学性能。

公开(公告)号：US20160276090A1

公开(公告)日：2016-09-22

申请号：US15072812

申请日：2016-03-17

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jin-Gu KIM ,  Ichiro OGURA ,  Hong-Won KIM ,  Sang-Moon LEE ,  Kwang-Jik LEE ,  Myung-Jae YOO

IPC: H01F27/255 ,  H01F41/04 ,  H01F41/02 ,  H01F41/10 ,  H01F27/28 ,  H01F27/29

CPC classification number: H01F27/255 ,  H01F17/0013 ,  H01F17/0033 ,  H01F17/04 ,  H01F27/292 ,  H01F41/046

Abstract: A coil component and a method of manufacturing a coil component are disclosed. The coil component includes an insulation layer including a coil conductor, and a magnetic-resin composite layer disposed on the insulation layer. The magnetic-resin composite layer includes a magnetic core.

Abstract translation: 公开了一种线圈部件和制造线圈部件的方法。 线圈部件包括包括线圈导体的绝缘层和设置在绝缘层上的磁性树脂复合层。 磁性树脂复合层包括磁芯。

公开(公告)号：US20160254086A1

公开(公告)日：2016-09-01

申请号：US15054600

申请日：2016-02-26

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jin-Gu KIM ,  Ichiro OGURA ,  Hong-Won KIM ,  Seung-Wook PARK ,  Jeong-Min CHO

IPC: H01F27/22 ,  H01F27/255 ,  H01F27/28

CPC classification number: H01F27/22 ,  H01F17/0013 ,  H01F27/255 ,  H01F27/292 ,  H01F2017/0066

Abstract: A coil component includes an insulation layer having a coil conductor, and a magnetic-resin composite layer disposed on the insulation layer. The magnetic-resin composite layer includes a heat-dissipating filler.

Abstract translation: 线圈部件包括具有线圈导体的绝缘层和设置在绝缘层上的磁性树脂复合层。 磁性树脂复合层包括散热填料。

公开(公告)号：US20160023978A1

公开(公告)日：2016-01-28

申请号：US14807269

申请日：2015-07-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hoe Chul JUNG ,  Jun Young KIM ,  In Cheol CHANG ,  Ichiro OGURA

IPC: C07C39/14 ,  C08G61/10 ,  G02B1/04 ,  C07C43/23

CPC classification number: G02B1/041 ,  C07C39/17 ,  C07C43/23 ,  C07C2603/18 ,  C08G63/197 ,  C08G63/672

Abstract: Disclosed herein are 6-hydroxy-2-naphthalenyl fluorene derivatives and a lens and a camera module using the same.

Abstract translation: 本文公开了6-羟基-2-萘基芴衍生物和使用其的透镜和相机模块。