公开(公告)号：US20150162134A1

公开(公告)日：2015-06-11

申请号：US14613233

申请日：2015-02-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Jik LEE ,  Suk Jin HAM ,  Ji Hyuk LIM

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/008

CPC classification number: H01G4/306 ,  B23B3/00 ,  H01G4/008 ,  H01G4/0085 ,  H01G4/012 ,  H01G4/1209 ,  H01G4/30 ,  Y10T29/49155 ,  Y10T428/265 ,  Y10T428/31678

Abstract: There are provided a multilayer thin film for a ceramic electronic component and a method of manufacturing the same. The multilayer thin film includes a substrate; and a ceramic layer and a metal layer alternately formed on at least one of upper and lower surfaces of the substrate, wherein at least one of the ceramic layer and the metal layer has a height corresponding to a thickness of at least one of a plurality of particles arranged on a plane. With the multilayer thin film for a ceramic electronic component, the number of layers increases and a distance between electrodes decreases, whereby capacitance may increase.

Abstract translation: 提供了一种用于陶瓷电子部件的多层薄膜及其制造方法。 多层薄膜包括基板; 以及交替地形成在所述基板的上表面和下表面中的至少一个上的陶瓷层和金属层，其中所述陶瓷层和所述金属层中的至少一个具有对应于多个 颗粒排列在平面上。 利用陶瓷电子部件的多层薄膜，层数增加，电极间距离减小，电容量增大。

公开(公告)号：US20180175591A1

公开(公告)日：2018-06-21

申请号：US15728104

申请日：2017-10-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hye Hun PARK ,  Kwang Jik LEE ,  Ju Hwan YANG ,  Jung Wook SEO ,  Sang Moon LEE

IPC: H01T4/02 ,  H01T4/08 ,  H01T21/00

CPC classification number: H01T4/02 ,  H01L27/0288 ,  H01T4/08 ,  H01T4/12 ,  H01T21/00

Abstract: A composite electronic component includes an element part and an electrostatic discharge (ESD) protection part disposed on the element part. The ESD protection part includes first and second discharge electrodes having a gap formed therebetween, a discharge layer disposed between the first and second discharge electrodes and in the gap, and a multilayer insulating layer covering the discharge layer and including at least two insulating layers having different breakdown voltage (BDV) values.

公开(公告)号：US20150230335A1

公开(公告)日：2015-08-13

申请号：US14618681

申请日：2015-02-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Jik LEE ,  Jin Gu KIM ,  Myung Jae YOO ,  Ichiro OGURA ,  Hye Suk SHIN

IPC: H05K1/05 ,  H05K3/38 ,  H05K1/03

CPC classification number: H05K1/0373 ,  H05K1/0366 ,  H05K3/022 ,  H05K3/381 ,  H05K2201/0209 ,  H05K2201/0233 ,  Y10T428/2495 ,  Y10T428/31678

Abstract: Embodiments of the invention provide a copper clad laminate, and more particularly, to a copper clad laminate and a method for manufacturing the same capable of increasing a peel strength by adding a stress relaxation filler to an insulating layer of a copper clad laminate, along with an inorganic filler. To improve an adhesion of a substrate, the stress relaxation filler is distributed into the resin, along with the inorganic filler, and is entirely distributed into the varnish, and is more effectively added to the vicinity of a bonded interface between the insulating layer and the copper clad layer, thereby improving the overall adhesion.

Abstract translation: 本发明的实施方案提供一种覆铜层压板，更具体地说，涉及覆铜层压板及其制造方法，其能够通过向覆铜层压板的绝缘层添加应力松弛填料而提高剥离强度，以及 无机填料。 为了提高基材的粘附性，应力松弛填料与无机填料一起分配到树脂中，并且完全分散在清漆中，并且更有效地添加到绝缘层和绝缘层之间的键合界面附近 铜包覆层，从而提高整体粘合性。

公开(公告)号：US20140054072A1

公开(公告)日：2014-02-27

申请号：US13800715

申请日：2013-03-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Jik LEE ,  Sang Hyun Shin ,  Hye Suk Shin ,  Joon Seok Kang

IPC: H05K1/05

CPC classification number: H05K1/05 ,  H05K1/0256 ,  H05K1/053 ,  H05K1/09 ,  H05K3/287

Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate; an Insulating layer formed on one surface or both surfaces of the base substrate; an electrode layer formed on a top surface of the insulating layer; and an insulating film covering a surface of the insulating layer except for a bonding surface between the electrode layer and the insulating layer so as to secure high dielectric breakdown voltage while keeping high thermal conductivity.

Abstract translation: 这里公开了一种印刷电路板及其制造方法。 印刷电路板包括：基底; 绝缘层，形成在所述基底基板的一个表面或两个表面上; 形成在所述绝缘层的上表面上的电极层; 以及绝缘膜，覆盖除了电极层和绝缘层之间的接合面以外的绝缘层的表面，以便确保高绝缘击穿电压同时保持高导热性。

公开(公告)号：US20140041906A1

公开(公告)日：2014-02-13

申请号：US13960277

申请日：2013-08-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Joon Seok KANG ,  Kwang Jik LEE ,  Sang Hyun SHIN ,  Hye Suk SHIN

IPC: H05K1/02 ,  H05K3/40

CPC classification number: H05K1/0204 ,  H05K1/053 ,  H05K3/4038 ,  H05K3/445 ,  Y10T29/49165

Abstract: Disclosed herein are a metal heat radiation substrate and a manufacturing method thereof. The metal heat radiation substrate includes: a metal substrate having a through-hole formed therein; a heat resistant insulating material filled in the through-hole and having a via hole formed at a filled portion; a metal oxide film formed on upper and lower surfaces of the metal substrate except for an inner wall of the through-hole by performing anodizing thereon; and a conductive layer filled in the via hole and formed over the metal oxide film.

Abstract translation: 本发明公开了一种金属散热基板及其制造方法。 金属散热基板包括：金属基板，其中形成有通孔; 填充在通孔中并具有形成在填充部分的通孔的耐热绝缘材料; 金属氧化物膜，其通过在其上进行阳极氧化而形成在金属基板的除了通孔的内壁之外的上表面和下表面上; 以及填充在通孔中并形成在金属氧化物膜上的导电层。

公开(公告)号：US20180137975A1

公开(公告)日：2018-05-17

申请号：US15674202

申请日：2017-08-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Il Ho CHA ,  Sang Jae LEE ,  Ho Sik PARK ,  Hye Hun PARK ,  Kwang Jik LEE ,  Hye Yeon CHA ,  Jae Ha KIM

IPC: H01F41/04 ,  H01F41/12 ,  H01F17/00 ,  H01F41/10

CPC classification number: H01F41/042 ,  H01F10/00 ,  H01F17/0006 ,  H01F17/0013 ,  H01F27/292 ,  H01F27/324 ,  H01F41/10 ,  H01F41/125 ,  H01F2017/002 ,  H01F2017/048

Abstract: A thin film-type inductor includes a body including a support member, a coil disposed. on at least one surface of the support member, and a filler embedding the support member on which the coil is disposed, and an external electrode disposed. on an external surface of the body. An insulating layer is not disposed on an edge portion of the support member and the edge portion is in direct contact with a filler. The insulating layer is only disposed on an upper surface of the coil to conform to a surface of the coil.

公开(公告)号：US20170338792A1

公开(公告)日：2017-11-23

申请号：US15409933

申请日：2017-01-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Jik LEE ,  Ju Hwan YANG ,  Jung Wook SEO

IPC: H03H7/42 ,  H01F3/08 ,  H01F17/04

CPC classification number: H03H7/427 ,  H01F3/08 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/255 ,  H01F2017/0093 ,  H01F2017/048

Abstract: A common mode filter includes: a body disposed on a substrate, wherein the body includes: a coil part including one or more coils and a through-hole formed in a central portion thereof; and a core part including a magnetic powder, disposed on the coil part, and filling the through-hole. A content of the magnetic powder in the core part has a gradient in a stacking direction. Impedance characteristics may be improved by reducing unfilled defect in the core part and securing permeability thereof at the same time.