公开(公告)号：US20160163956A1

公开(公告)日：2016-06-09

申请号：US14937134

申请日：2015-11-10

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Sang LEE

IPC: H01L41/09 ,  H01L41/053 ,  H01L41/047

CPC classification number: H03H9/1021 ,  H03H9/132

Abstract: The crystal vibrator package includes a base substrate, a crystal piece, and a reinforcing patter. The base substrate includes first and second electrode pads formed on an upper surface of the base substrate. The crystal piece includes exciting electrodes formed on upper and lower surfaces thereof and electrically connected to the first and second electrode pads, respectively, at one side of the crystal piece. The reinforcing pattern is formed at corner portions of the crystal piece.

Abstract translation: 晶体振荡器封装包括基底，晶片和加强图案。 基底基板包括形成在基底基板的上表面上的第一和第二电极焊盘。 晶片包括形成在其上表面和下表面上的激励电极，并分别在晶片的一侧电连接到第一和第二电极焊盘。 加强图案形成在晶片的角部。

公开(公告)号：US20170070208A1

公开(公告)日：2017-03-09

申请号：US15179248

申请日：2016-06-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Sang LEE ,  Ho Phil JUNG ,  Sung Wook KIM ,  Tae Joon PARK ,  In Young KANG ,  Dong Joon OH ,  Je Hong KYOUNG ,  Kyo Yeol LEE ,  Jong Pil LEE ,  Seung Mo LIM

IPC: H03H9/19 ,  H03H3/02 ,  H03H9/13

CPC classification number: H03H9/19 ,  H03H3/02 ,  H03H9/02023 ,  H03H9/02157 ,  H03H2003/022

Abstract: A piezoelectric oscillator, and method of making the same, includes an oscillation substrate comprising an oscillating part and a surrounding part, wherein a the surrounding part is thinner than the oscillating part, and oscillating electrodes disposed on an upper surface and a lower surface of the oscillating part. The oscillation substrate is configured according to H=400.59×X+1.75±1.5, wherein H=100×(T2/T1) and S=T2/(L1−L2), wherein L1 represents an entire length of the oscillation substrate, L2 represents a length of the oscillating part, T1 represents a thickness of the oscillating part, and T2 represents a step height between the oscillating part and the surrounding part.

Abstract translation: 压电振荡器及其制造方法包括振荡基板，其包括振荡部和周围部，其中周围部比振荡部更薄，振荡电极设置在振荡部的上表面和下表面 摆动部分。 振荡基板根据H = 400.59×X + 1.75±1.5配置，其中H = 100×（T2 / T1）和S = T2 /（L1-L2），其中L1表示振荡基板的整个长度，L2 表示振荡部的长度，T1表示振动部的厚度，T2表示振动部与周围部之间的台阶高度。

公开(公告)号：US20170373665A1

公开(公告)日：2017-12-28

申请号：US15452090

申请日：2017-03-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Kyung LEE ,  Jae Sang LEE ,  Sung HAN ,  Sung Sun KIM ,  In Young KANG ,  Ran Hee SHIN

IPC: H03H9/17 ,  H03H9/54

CPC classification number: H03H9/17 ,  H03H9/13 ,  H03H9/173 ,  H03H9/54 ,  H03H9/60 ,  H03H9/605

Abstract: A bulk acoustic wave resonator includes a substrate, a first electrode and a second electrode formed on the substrate, and a piezoelectric layer provided between the first electrode and the second electrode. Either one or both of the first electrode and the second electrode include a molybdenum-tungsten alloy having a weight ratio of molybdenum to tungsten in a range of 3:1 to 1:3.

公开(公告)号：US20160156312A1

公开(公告)日：2016-06-02

申请号：US14881490

申请日：2015-10-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Mo LIM ,  Jae Sang LEE ,  Sung Wook KIM ,  Jong Pil LEE

IPC: H03B5/32 ,  H03H9/13

CPC classification number: H03H9/13 ,  H03H9/0509 ,  H03H9/1021 ,  H03H9/17

Abstract: There is provided a crystal oscillator package including: a crystal oscillator on which excitation electrodes are provided; one or more leg members extended from the crystal oscillator; and conductive adhesive members provided to connect the leg members and connection pads to each other, whereby the vibrational reliability of the crystal oscillator may be improved.

Abstract translation: 提供了一种晶体振荡器封装，包括：晶体振荡器，其上设有激励电极; 从晶体振荡器延伸的一个或多个支腿构件; 以及设置用于将腿部构件和连接垫彼此连接的导电性粘合构件，由此可以提高晶体振荡器的振动可靠性。

公开(公告)号：US20140185244A1

公开(公告)日：2014-07-03

申请号：US13866619

申请日：2013-04-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Sang LEE ,  Ji Hyuk Lim ,  Suk Jin Ham

IPC: H05K1/02 ,  H01B1/22 ,  H01B1/24

CPC classification number: H05K1/0209 ,  H01L23/36 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K3/0061 ,  H05K2201/0187 ,  H05K2201/0209 ,  H01L2924/00

Abstract: There is provided a circuit board module including a heat radiation member, a thermally conductive film that is disposed on the heat radiation member and includes a thermally conductive filler, a circuit board formed on the thermally conductive film, and a heat generation device disposed on the circuit board, wherein the thermally conductive filler is distributed in an area of the thermally conductive film corresponding to the heat generation device and another area that is extended from the area corresponding to the heat generation device by a predetermined distance on a plane.

Abstract translation: 提供了一种电路板模块，包括散热构件，设置在散热构件上并包括导热填料的导热膜，形成在导热膜上的电路板，以及设置在导热膜上的发热装置 电路板，其中所述导热填料分布在对应于所述发热装置的导热膜的区域中，以及从与所述发热装置相对应的区域在平面上延伸预定距离的另一区域。