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公开(公告)号：US20180061581A1
公开(公告)日：2018-03-01
申请号：US15485682
申请日：2017-04-12
发明人： Kyo Yeol LEE , Seung Mo LIM , Dong Joon OH , Yun Sung KANG , Hai Joon LEE
摘要： A thin film capacitor includes a capacitor body formed by alternately stacking first and second electrode layers and a dielectric layer on a substrate, and having the second electrode layer disposed in an uppermost portion thereof, and a stress alleviation layer formed on the uppermost second electrode layer. The stress alleviation layer is formed of a material having a coefficient of thermal expansion higher than those of the substrate and the dielectric layer.
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公开(公告)号：US20180068798A1
公开(公告)日：2018-03-08
申请号：US15463652
申请日：2017-03-20
发明人： Kyo Yeol LEE , Yun Sung KANG , Hai Joon LEE , Dong Joon OH , Ho Phil JUNG , Seung Mo LIM
CPC分类号： H01G4/33 , H01G4/012 , H01G4/1227 , H01G4/1245
摘要： A thin film capacitor includes a body having first and second electrode layers and first and second dielectric layers alternately stacked on a substrate. A thickness of the first dielectric layer is 1.2 to 3 times that of the second dielectric layer. Therefore, leakage current characteristics of the dielectric layers may be improved, and capacitance of the thin film capacitor may be secured.
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公开(公告)号：US20170070208A1
公开(公告)日：2017-03-09
申请号：US15179248
申请日：2016-06-10
发明人： Jae Sang LEE , Ho Phil JUNG , Sung Wook KIM , Tae Joon PARK , In Young KANG , Dong Joon OH , Je Hong KYOUNG , Kyo Yeol LEE , Jong Pil LEE , Seung Mo LIM
CPC分类号： H03H9/19 , H03H3/02 , H03H9/02023 , H03H9/02157 , H03H2003/022
摘要： A piezoelectric oscillator, and method of making the same, includes an oscillation substrate comprising an oscillating part and a surrounding part, wherein a the surrounding part is thinner than the oscillating part, and oscillating electrodes disposed on an upper surface and a lower surface of the oscillating part. The oscillation substrate is configured according to H=400.59×X+1.75±1.5, wherein H=100×(T2/T1) and S=T2/(L1−L2), wherein L1 represents an entire length of the oscillation substrate, L2 represents a length of the oscillating part, T1 represents a thickness of the oscillating part, and T2 represents a step height between the oscillating part and the surrounding part.
摘要翻译： 压电振荡器及其制造方法包括振荡基板，其包括振荡部和周围部，其中周围部比振荡部更薄，振荡电极设置在振荡部的上表面和下表面 摆动部分。 振荡基板根据H = 400.59×X + 1.75±1.5配置，其中H = 100×（T2 / T1）和S = T2 /（L1-L2），其中L1表示振荡基板的整个长度，L2 表示振荡部的长度，T1表示振动部的厚度，T2表示振动部与周围部之间的台阶高度。
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公开(公告)号：US20220208465A1
公开(公告)日：2022-06-30
申请号：US17468240
申请日：2021-09-07
发明人： Kyo Yeol LEE , Seung Hun HAN , In Young KANG , Jung Min KIM , Jeong Ryeol KIM
摘要： A multilayer ceramic electronic component includes a ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked with a dielectric layer interposed therebetween, a first external electrode connected to the first internal electrode and including a first electrode layer, a first conductive layer, and a first metal layer, a second external electrode connected to the second internal electrode and including a second electrode layer, a second conductive layer, and a second metal layer, and a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer, wherein the first coating layer may include an alkyl(meth)acrylate-based polymer.
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公开(公告)号：US20220208464A1
公开(公告)日：2022-06-30
申请号：US17466508
申请日：2021-09-03
发明人： Kyo Yeol LEE , Seung Hun HAN , In Young KANG , Jung Min KIM , Jeong Ryeol KIM
摘要： A multilayer ceramic electronic component includes a ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked with a dielectric layer interposed therebetween; a first external electrode connected to the first internal electrode and including a first electrode layer, a first conductive layer, and a first metal layer; a second external electrode connected to the second internal electrode and including a second electrode layer, a second conductive layer, and a second metal layer; and a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer. The first conductive layer and the second conductive layer are sintered electrodes including a conductive metal and glass, and the first coating layer includes a plurality of openings disposed on the first electrode layer and the second electrode layer.
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公开(公告)号：US20170338042A1
公开(公告)日：2017-11-23
申请号：US15369493
申请日：2016-12-05
发明人： Hyun Ho SHIN , Kyo Yeol LEE , Dong Joon OH , Woong Do JUNG , Ho Phil JUNG , Hai Joon LEE , Seung Mo LIM , Jong Bong LIM
摘要： A thin-film capacitor includes: a body in which a plurality of dielectric layers and first and second internal electrodes are alternately disposed on a substrate; and first and second external electrode disposed on an external surface of the body. A plurality of vias are disposed in the body, a first via connects first internal electrodes to each other, and penetrates from the external surface of the body to the lowermost first internal electrode, a second via connects second internal electrodes to each other, and penetrates from the external surface of the body to the lowermost second internal electrode, and the plurality of vias have a multistage shape, and at least one internal electrode has an etched portion of 0.3 to 0.7 layer in relation to one layer of the internal electrode.
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公开(公告)号：US20180144872A1
公开(公告)日：2018-05-24
申请号：US15645339
申请日：2017-07-10
发明人： Hyun Ho SHIN , Yun Sung KANG , Seung Mo LIM , Kyo Yeol LEE , Dong Joon OH , Woong Do JUNG , Ho Phil JUNG , Hai Joon LEE
摘要： A thin-film capacitor includes a body having a plurality of dielectric layers and first and second electrode layers alternately stacked on a substrate, first and second electrode pads disposed on one surface of the body, a plurality of vias having a multistage shape being disposed in the body, a first via of the plurality of vias connects the first electrode layer to the first electrode pad, and penetrates from the surface of the body to a first lowermost electrode layer adjacent the substrate, a second via of the plurality of vias connects the second electrode layer to the second electrode pad, and penetrates from the surface of the body to a second lowermost electrode layer adjacent the substrate and an upper surface of the first electrode layer is exposed in the first via, and an upper surface of the second electrode layer is exposed in the second via.
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公开(公告)号：US20180144871A1
公开(公告)日：2018-05-24
申请号：US15634327
申请日：2017-06-27
发明人： Yun Sung KANG , Hai Joon LEE , Tae Joon PARK , Dong Joon OH , Yun Hee KIM , Kyo Yeol LEE , Seung Mo LIM , In Young KANG
CPC分类号： H01G4/33 , H01G4/005 , H01G4/1227
摘要： A thin-film ceramic capacitor includes: a body in which a plurality of dielectric layers and first and second electrode layers are alternately disposed on a substrate; and first and second electrode pads disposed on an external surface of the body. The dielectric layer contains a mixed phase of a perovskite phase having ferroelectric properties and a pyrochlore phase having paraelectric properties, the pyrochlore phase being disposed on interfaces between the dielectric layers and the first and second electrode layers in lower portions of the dielectric layers.
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公开(公告)号：US20170330688A1
公开(公告)日：2017-11-16
申请号：US15409872
申请日：2017-01-19
发明人： Seung Mo LIM , Hai Joon LEE , Ho Phil JUNG , Jong Beom KIM , Kyo Yeol LEE , Dong Joon OH
摘要： A thin film capacitor includes a body including a lower electrode formed on a substrate, a plurality of first electrode layers, and a plurality of second electrode layers stacked alternately with the plurality of first electrode layers, with one of the dielectric layers interposed therebetween. The lower electrode and the first electrode layer have the same polarity as each other, and surface roughness of the first and second electrode layers is less than that of the dielectric layers, thereby securing capacitance and characteristics of the dielectric layers.
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公开(公告)号：US20220208456A1
公开(公告)日：2022-06-30
申请号：US17338370
申请日：2021-06-03
发明人： Kyo Yeol LEE , Seung Hun HAN , Sang Wook LEE , Jung Min KIM , Jeong Ryeol KIM
摘要： A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other and alternately stacked with the respective dielectric layers interposed therebetween; a first external electrode connected to the first internal electrodes; a second external electrode connected to the second internal electrodes; and a protective layer disposed on the ceramic body, the first external electrode, and the second external electrode, wherein the protective layer includes an adhesion assisting layer and a coating layer.
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