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公开(公告)号：US20180122557A1
公开(公告)日：2018-05-03
申请号：US15662025
申请日：2017-07-27
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ki Seok KIM , Myung Sam KANG , Ye Jeong KIM , Kwang Hee KWON , Sa Yong LEE
CPC classification number: H01F27/2804 , H01F17/0013 , H01F17/0033 , H01F27/29 , H01F41/041 , H01F41/10 , H01F2017/004 , H01F2017/048 , H01F2027/2809
Abstract: A coil electronic component includes: a plurality of coil layers including, respectively, coil patterns and connection patterns disposed outside the coil patterns and forming a stacking structure; conductive vias connecting the coil patterns formed on different levels to each other; and external electrodes electrically connected to the plurality of coil layers. The coil patterns of at least two of the plurality of coil layers may have the same shape and be electrically connected to each other in parallel.
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公开(公告)号：US20190333683A1
公开(公告)日：2019-10-31
申请号：US16507982
申请日：2019-07-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ki Seok KIM , Ye Jeong KIM , Myung Sam KANG , Kwang Hee KWON
Abstract: A coil electronic component includes: a plurality of stacked coil layers each including coil patterns including anisotropic plating layers; conductive vias connecting the coil patterns formed on different coil layers to each other; and external electrodes electrically connected to the plurality of coil layers.
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公开(公告)号：US20180122548A1
公开(公告)日：2018-05-03
申请号：US15650309
申请日：2017-07-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ye Jeong KIM , Ki Seok KIM , Myung Sam KANG
CPC classification number: H01F27/24 , H01F5/04 , H01F5/06 , H01F17/0013 , H01F17/0033 , H01F17/04 , H01F27/292 , H01F27/323 , H01F41/10 , H01F2017/004 , H01F2027/2809
Abstract: A coil electronic component includes a plurality of coil layers including coil patterns and connection patterns. The coil patterns are disposed between the connection patterns. The connection patterns are at least partially exposed from the coil electronic component. The coil electronic component further includes connection electrodes connecting the connection patterns formed in different coil layers of the plurality of coil layers with each other, and external electrodes connected to the connection electrodes and at least partially enclosing the connection electrodes.
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Patent Agency Ranking
公开(公告)号：US20180122556A1
公开(公告)日：2018-05-03
申请号：US15660640
申请日：2017-07-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ki Seok KIM , Ye Jeong KIM , Myung Sam KANG , Kwang Hee KWON
CPC classification number: H01F27/2804 , H01F17/0013 , H01F17/0033 , H01F27/292 , H01F27/323 , H01F41/041 , H01F41/042 , H01F41/122 , H01F2017/004 , H01F2027/2809
Abstract: A coil electronic component includes: a plurality of stacked coil layers each including coil patterns including anisotropic plating layers; conductive vias connecting the coil patterns formed on different coil layers to each other; and external electrodes electrically connected to the plurality of coil layers.
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公开(公告)号：US20180122555A1
公开(公告)日：2018-05-03
申请号：US15655655
申请日：2017-07-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ki Seok KIM , Ye Jeong KIM , Tae Hong MIN , Myung Sam KANG , Kwang Hee KWON
CPC classification number: H01F27/2804 , H01F17/0013 , H01F27/292 , H01F41/043 , H01F2027/2809
Abstract: Embodiments disclosed are directed to a multilayer electronic component and a method of manufacturing the same. The multilayer electronic component may includ a multilayer body having a plurality of insulating layers and internal coil parts disposed on the insulating layers. The plurality of insulating layers and internal coil parts are stacked. The multilayer electronic component may also include and external electrodes disposed on external surfaces of the multilayer body and connected to the internal coil parts. The internal coil parts include a first metal and a second metal having electrical conductivity higher than that of a first metal is disposed on the internal coil parts and surrounds the internal coil parts.
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公开(公告)号：US20190229060A1
公开(公告)日：2019-07-25
申请号：US16375302
申请日：2019-04-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Ho BAEK , Sang Kun KIM , Ye Jeong KIM , Jae Ean LEE , Jae Hoon CHOI
Abstract: An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.
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公开(公告)号：US20180269156A1
公开(公告)日：2018-09-20
申请号：US15982839
申请日：2018-05-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Ho BAEK , Sang Kun KIM , Ye Jeong KIM , Jae Ean LEE , Jae Hoon CHOI
CPC classification number: H01L23/5389 , H01L21/4857 , H01L21/486 , H01L21/56 , H01L22/14 , H01L23/13 , H01L23/3114 , H01L23/3128 , H01L23/5383 , H01L23/5384 , H01L23/5385 , H01L23/5386 , H01L24/24 , H01L24/82 , H01L2224/215 , H01L2224/24265 , H01L2224/82005 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/15153 , H01L2924/15192 , H01L2924/15311 , H01L2924/19102 , H05K1/186
Abstract: An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.
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公开(公告)号：US20170213794A1
公开(公告)日：2017-07-27
申请号：US15385414
申请日：2016-12-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Ho BAEK , Sang Kun KIM , Ye Jeong KIM , Jae Ean LEE , Jae Hoon CHOI
CPC classification number: H01L23/5389 , H01L21/4857 , H01L21/486 , H01L21/56 , H01L22/14 , H01L23/13 , H01L23/3114 , H01L23/3128 , H01L23/5383 , H01L23/5384 , H01L23/5385 , H01L23/5386 , H01L24/24 , H01L24/82 , H01L2224/215 , H01L2224/24265 , H01L2224/82005 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/15153 , H01L2924/15192 , H01L2924/15311 , H01L2924/19102 , H05K1/186
Abstract: An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.
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