公开(公告)号：US20160066434A1

公开(公告)日：2016-03-03

申请号：US14813695

申请日：2015-07-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seong Min CHO ,  Jung Youn KIM ,  Sang Kun KIM

IPC: H05K3/18 ,  H05K3/26 ,  H05K3/00 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K3/243 ,  H05K1/0298 ,  H05K3/244 ,  H05K3/26 ,  H05K2203/072

Abstract: The circuit board provided with a first conductive pattern and a second conductive pattern performed by different types of surface treatments are disclosed. The circuit board in accordance with one embodiment of the present invention forms the first conductive pattern and the second conductive pattern on an insulating layer, wherein the first metal plating layer and the second metal plating layer are formed on the surface of the first conductive pattern, the second metal plating layer is formed on the surface of the second conductive pattern, and the second metal plating layer is made of the material different from that of the first metal plating layer to be exposed to the outside, whereby the pattern pitch is easily reduced, the reduction of the electrical characteristics due to the surface treatment can be minimized and the efficiency of the manufacturing process may be improved.

Abstract translation: 公开了具有通过不同类型的表面处理执行的第一导电图案和第二导电图案的电路板。 根据本发明的一个实施例的电路板在绝缘层上形成第一导电图案和第二导电图案，其中第一金属镀层和第二金属镀层形成在第一导电图案的表面上， 第二金属镀层形成在第二导电图案的表面上，并且第二金属镀层由与第一金属镀层不同的材料制成以暴露于外部，由此图案间距容易减小 可以将由于表面处理引起的电特性的降低最小化，并且可以提高制造工艺的效率。

公开(公告)号：US20190229060A1

公开(公告)日：2019-07-25

申请号：US16375302

申请日：2019-04-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Ho BAEK ,  Sang Kun KIM ,  Ye Jeong KIM ,  Jae Ean LEE ,  Jae Hoon CHOI

IPC: H01L23/538 ,  H01L21/66 ,  H01L21/48 ,  H05K1/18 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56

Abstract: An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.

公开(公告)号：US20180269156A1

公开(公告)日：2018-09-20

申请号：US15982839

申请日：2018-05-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Ho BAEK ,  Sang Kun KIM ,  Ye Jeong KIM ,  Jae Ean LEE ,  Jae Hoon CHOI

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L21/66 ,  H05K1/18 ,  H01L23/31 ,  H01L23/00 ,  H01L23/13

CPC classification number: H01L23/5389 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L22/14 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/215 ,  H01L2224/24265 ,  H01L2224/82005 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19102 ,  H05K1/186

Abstract: An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.

公开(公告)号：US20170213794A1

公开(公告)日：2017-07-27

申请号：US15385414

申请日：2016-12-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Ho BAEK ,  Sang Kun KIM ,  Ye Jeong KIM ,  Jae Ean LEE ,  Jae Hoon CHOI

IPC: H01L23/538 ,  H01L23/00 ,  H01L21/66 ,  H01L21/48 ,  H01L21/56 ,  H05K1/18 ,  H01L23/31

CPC classification number: H01L23/5389 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L22/14 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/215 ,  H01L2224/24265 ,  H01L2224/82005 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19102 ,  H05K1/186

Abstract: An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.