公开(公告)号：US20220231172A1

公开(公告)日：2022-07-21

申请号：US17398494

申请日：2021-08-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： DAEWON HA ,  MINGYU KIM ,  DOYOUNG CHOI

IPC: H01L29/786 ,  H01L29/06 ,  H01L29/423 ,  H01L21/02 ,  H01L29/66

Abstract: A semiconductor device includes, on a substrate, a channel pattern including semiconductor patterns, which are spaced apart from each other in a first direction perpendicular to a top surface of the substrate, a gate electrode on the channel pattern, the gate electrode disposed on an uppermost semiconductor pattern of the semiconductor patterns and extended into regions between the semiconductor patterns, and a pair of gate spacers disposed on the uppermost semiconductor pattern to cover opposite side surfaces of the gate electrode, respectively. Each semiconductor pattern includes germanium. Each semiconductor pattern includes a pair of first portions vertically overlapped with the pair of gate spacers and a second portion between the pair of first portions. A thickness, in the first direction, of a pair of first portions of the uppermost semiconductor pattern is larger than a thickness, in the first direction, of the second portion of the uppermost semiconductor pattern.

公开(公告)号：US20240213249A1

公开(公告)日：2024-06-27

申请号：US18512094

申请日：2023-11-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： DONGHOON HWANG ,  KYUNGHO KIM ,  BYUNGHO MOON ,  KYUNGHEE CHO ,  DOYOUNG CHOI ,  INCHAN HWANG

IPC: H01L27/092 ,  H01L21/822 ,  H01L21/8238 ,  H01L23/528 ,  H01L29/06 ,  H01L29/417 ,  H01L29/423 ,  H01L29/66 ,  H01L29/775

CPC classification number: H01L27/0922 ,  H01L21/8221 ,  H01L21/823871 ,  H01L23/528 ,  H01L29/0673 ,  H01L29/41733 ,  H01L29/42392 ,  H01L29/66439 ,  H01L29/775

Abstract: An integrated circuit device includes a lower insulating line extending in a first direction, a plurality of lower channel lines over the lower insulating line, first and second lower gate lines respectively on opposing sides of the lower insulating line and opposing sides of one of the lower channel lines, a third lower gate line extending around upper and lower surfaces of the one of the lower channel line and connecting the first and second lower gate lines to each other, an outer gate line arranged under the lower insulating line and contacting the first and second lower gate lines, an upper insulating line over an upper surface of each lower channel line, a plurality of upper channel lines over the upper insulating line, and an upper gate line extending around one of the upper channel lines.

公开(公告)号：US20230146060A1

公开(公告)日：2023-05-11

申请号：US17838384

申请日：2022-06-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： SUNGIL PARK ,  KYUMAN HWANG ,  JAE HYUN PARK ,  DOYOUNG CHOI ,  DAEWON HA

IPC: H01L29/66 ,  H01L27/11556 ,  H01L27/11582 ,  H01L27/11565 ,  H01L27/06 ,  H01L21/822 ,  H01L21/8238

CPC classification number: H01L29/66545 ,  H01L27/11556 ,  H01L27/11582 ,  H01L27/11565 ,  H01L27/0688 ,  H01L21/8221 ,  H01L21/823842

Abstract: Three-dimensional (3D) semiconductor device may include a first active region on a substrate, the first active region including a lower channel pattern and a pair of lower source/drain patterns that are on opposing side surfaces of the lower channel pattern respectively, a second active region stacked on the first active region, the second active region including an upper channel pattern and a pair of upper source/drain patterns that are on opposing side surfaces of the upper channel pattern, respectively, a dummy channel pattern between the lower and upper channel patterns, a pair of liner layers that are on opposing side surfaces of the dummy channel pattern, respectively, and a gate electrode on the lower, dummy, and upper channel patterns. The gate electrode may include a lower gate electrode on the lower channel pattern and an upper gate electrode on the upper channel pattern.

公开(公告)号：US20240105724A1

公开(公告)日：2024-03-28

申请号：US18196741

申请日：2023-05-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： DONGHOON HWANG ,  MYUNGIL KANG ,  MINCHAN GWAK ,  Kyungho KIM ,  Kyung Hee CHO ,  DOYOUNG CHOI

IPC: H01L27/092 ,  H01L21/822 ,  H01L21/8238 ,  H01L29/06 ,  H01L29/417 ,  H01L29/423 ,  H01L29/66 ,  H01L29/775

CPC classification number: H01L27/0922 ,  H01L21/8221 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823871 ,  H01L29/0673 ,  H01L29/41733 ,  H01L29/42392 ,  H01L29/66439 ,  H01L29/66545 ,  H01L29/775

Abstract: A three-dimensional semiconductor device includes a first active region on a substrate, the first active region including a lower channel pattern and a lower source/drain pattern connected to the lower channel pattern, a second active region stacked on the first active region, the second active region including an upper channel pattern and an upper source/drain pattern connected to the upper channel pattern, a gate electrode on the lower channel pattern and the upper channel pattern, a lower contact electrically connected to the lower source/drain pattern, the lower contact having a bar shape extending on the lower source/drain pattern in a first direction, a first active contact coupled to the lower contact, and a second active contact coupled to the upper source/drain pattern. A first width of the lower source/drain pattern in a second direction is larger than a second width of the lower contact in the second direction.

公开(公告)号：US20220037502A1

公开(公告)日：2022-02-03

申请号：US17451691

申请日：2021-10-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： NAKJIN SON ,  SEUNGJOON LEE ,  BONG SEOB YANG ,  DOYOUNG CHOI

IPC: H01L29/49 ,  H01L29/786 ,  H01L21/02 ,  H01L21/28 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/06 ,  H01L29/423 ,  H01L29/51 ,  H01L29/66

Abstract: A semiconductor device include a substrate including a peripheral region, a first active pattern provided on the peripheral region of the substrate, the first active pattern having an upper portion including first semiconductor patterns and second semiconductor patterns which are alternately stacked, a first gate electrode intersecting the first active pattern, a pair of first source/drain patterns provided at both sides of the first gate electrode, respectively, and a first gate insulating layer disposed between the first gate electrode and the first active pattern. The first gate insulating layer includes a first insulating layer formed on the first active pattern, a second insulating layer formed on the first insulating layer, and a high-k dielectric layer formed on the second insulating layer. The first gate insulating layer contains a first dipole element including lanthanum (La), aluminum (Al), or a combination thereof.