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公开(公告)号:US20210367102A1
公开(公告)日:2021-11-25
申请号:US17117298
申请日:2020-12-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jaiwon Jean , Joongseo Kang , Namsung Kim , Daemyung Chun
Abstract: A semiconductor light-emitting device includes a buffer structure, a first-type semiconductor layer on the buffer structure, an active layer on the first-type semiconductor layer, and a second-type semiconductor layer on the active layer. The buffer structure includes a nucleation layer, a first dislocation-removing structure on the nucleation layer, and a buffer layer on the first dislocation-removing structure. The first dislocation-removing structure includes a first material layer on the nucleation layer and a second material layer on the first material layer. The second material layer has a lattice constant different from a lattice constant of the first material layer. A roughness of a top surface of the first material layer is higher than a roughness of a top surface of the nucleation layer and higher than a roughness of a top surface of the second material layer.
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公开(公告)号:US11646398B2
公开(公告)日:2023-05-09
申请号:US17323042
申请日:2021-05-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kiwon Park , Namsung Kim , Youngsub Shin , Jonghyun Lee , Daemyung Chun , Byungchul Choi
CPC classification number: H01L33/505 , H01L27/15 , H01L33/007 , H01L33/0093 , H01L33/382 , H01L33/46 , H01L2933/0016 , H01L2933/0025 , H01L2933/0041
Abstract: A semiconductor light emitting device including a semiconductor laminate having first and second surfaces, the semiconductor laminate including first and second conductivity-type semiconductor layers, and an active layer between the semiconductor layers; a partition structure on the first surface, the partition structure having a window defining a light emitting region of the first surface of the semiconductor laminate; a wavelength converter in the window, the wavelength converter being configured to convert a wavelength of light emitted from the active layer; and a first electrode and a second electrode on the second surface of the semiconductor laminate and respectively connected to the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer, wherein the semiconductor laminate includes a plurality of first patterns arranged in the light emitting region of the first surface, and a plurality of second patterns arranged in a covered region of the first surface contacting the partition structure.
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公开(公告)号:US11502221B2
公开(公告)日:2022-11-15
申请号:US17117298
申请日:2020-12-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jaiwon Jean , Joongseo Kang , Namsung Kim , Daemyung Chun
Abstract: A semiconductor light-emitting device includes a buffer structure, a first-type semiconductor layer on the buffer structure, an active layer on the first-type semiconductor layer, and a second-type semiconductor layer on the active layer. The buffer structure includes a nucleation layer, a first dislocation-removing structure on the nucleation layer, and a buffer layer on the first dislocation-removing structure. The first dislocation-removing structure includes a first material layer on the nucleation layer and a second material layer on the first material layer. The second material layer has a lattice constant different from a lattice constant of the first material layer. A roughness of a top surface of the first material layer is higher than a roughness of a top surface of the nucleation layer and higher than a roughness of a top surface of the second material layer.
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公开(公告)号:US11670736B2
公开(公告)日:2023-06-06
申请号:US17964957
申请日:2022-10-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jaiwon Jean , Joongseo Kang , Namsung Kim , Daemyung Chun
CPC classification number: H01L33/12 , H01L27/156 , H01L33/22 , H01L33/32 , H01L33/382 , H01L33/44
Abstract: A semiconductor light-emitting device includes a buffer structure, a first-type semiconductor layer on the buffer structure, an active layer on the first-type semiconductor layer, and a second-type semiconductor layer on the active layer. The buffer structure includes a nucleation layer, a first dislocation-removing structure on the nucleation layer, and a buffer layer on the first dislocation-removing structure. The first dislocation-removing structure includes a first material layer on the nucleation layer and a second material layer on the first material layer. The second material layer has a lattice constant different from a lattice constant of the first material layer. A roughness of a top surface of the first material layer is higher than a roughness of a top surface of the nucleation layer and higher than a roughness of a top surface of the second material layer.
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